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12 条记录 (耗时 0.021 秒)

    Circuit board and slot connector assembly
    3.
    发明授权
    Circuit board and slot connector assembly 失效
    电路板和插槽连接器组件

    公开(公告)号：US06930889B2

    公开(公告)日：2005-08-16

    申请号：US09811063

    申请日：2001-03-16

    申请人： Joe A. Harrison ,  Edward R. Stanford ,  Daniel S. Kingsley ,  Kelli A. Wise

    发明人： Joe A. Harrison ,  Edward R. Stanford ,  Daniel S. Kingsley ,  Kelli A. Wise

    IPC分类号： H01R12/70 ,  H01R12/72 ,  H05K1/11 ,  H01R9/00

    CPC分类号： H01R12/721 ,  H01R12/7005 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/10189

    摘要： A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and second set of contacts that are associated with the communication of signals and are not used to communicate power. Adjacent contacts of the first set have a first spacing, and adjacent contacts of the second set have a second spacing different from the first spacing. The circuit board has a retention profile to engage a retention mechanism of the slot connector. A housing of the slot connector may be made from a material that has a thermal conductivity of at least 0.27 W/m·K, and the slot connector housing may include fins that are formed on the slot connector to conduct heat away from circuitry of the circuit board.

    摘要翻译： 电路板包括基板和与插槽连接器配合的电触头。 触点包括与电力通信相关联的第一组触点和与信号通信相关联并且不用于传达电力的第二组触点。 第一组的相邻触点具有第一间隔，并且第二组的相邻触点具有与第一间隔不同的第二间隔。 电路板具有保持轮廓以接合槽连接器的保持机构。 槽连接器的壳体可以由具有至少0.27W / mK的热导率的材料制成，并且槽连接器壳体可以包括形成在槽连接器上以将热量从电路板的电路传导出来的散热片 。

    Vertical electronic packaging
    5.
    发明申请
    Vertical electronic packaging 审中-公开
    立式电子包装

    公开(公告)号：US20080158793A1

    公开(公告)日：2008-07-03

    申请号：US11647776

    申请日：2006-12-28

    申请人： Joe A. Harrison ,  Richard E. Conlee ,  Timothy J. Cox

    发明人： Joe A. Harrison ,  Richard E. Conlee ,  Timothy J. Cox

    IPC分类号： H05K5/00

    CPC分类号： H05K7/12

    摘要： In some embodiments a holder holds an electronic device at a distance from a board and couples the electronic device to the board. One or more legs stabilize and provide 360 degree support for the electronic device in a z-axis height away from the board. Other embodiments are described and claimed.

    摘要翻译： 在一些实施例中，保持器保持距板的距离一定距离的电子设备，并将电子设备耦合到电路板。 一个或多个腿稳定，并且在离电路板的z轴高度为电子设备提供360度支撑。 描述和要求保护其他实施例。

    Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts
    7.
    发明授权
    Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts 失效
    使用带导电聚合物触点的边缘连接器将电路模块互连到主板

    公开(公告)号：US06461169B1

    公开(公告)日：2002-10-08

    申请号：US09849506

    申请日：2001-05-04

    申请人： Joe A. Harrison ,  Tom G. Ruttan ,  Mathew C. Miscio

    发明人： Joe A. Harrison ,  Tom G. Ruttan ,  Mathew C. Miscio

    IPC分类号： H01R1200

    CPC分类号： H05K3/366 ,  H01R12/7005 ,  H01R12/721 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/09181 ,  H05K2201/10378

    摘要： An interconnected circuit module and motherboard use an electrical edge connector with conductive polymer contacts. The circuit module has electrical terminals along an edge of a front surface, and the electrical terminals extend to plated cylindrical grooves that are formed in the edge surface of the circuit module. The electrical edge connector is fastened to a surface of the motherboard and receives the edge terminals of the circuit module. When the circuit module is secured in the edge connector, the conductive polymer contacts are aligned with the cylindrical grooves of the circuit module and compressed against a land grid array on the surface of the motherboard. The connector is able to transmit electrical signals between the circuit module and the motherboard without the used of electrical pin connections.

    摘要翻译： 互连的电路模块和主板使用具有导电聚合物触点的电气边缘连接器。 电路模块具有沿着前表面的边缘的电端子，并且电端子延伸到形成在电路模块的边缘表面中的电镀圆柱形槽。 电气边缘连接器固定在主板的表面上，并接收电路模块的边缘端子。 当电路模块固定在边缘连接器中时，导电聚合物触点与电路模块的圆柱形凹槽对齐并且压靠在主板表面上的焊盘格栅阵列上。 连接器能够在电路模块和主板之间传输电信号，而不用电气引脚连接。

    Cable assembly retention
    8.
    发明授权
    Cable assembly retention 有权
    电缆组件固定

    公开(公告)号：US06854693B2

    公开(公告)日：2005-02-15

    申请号：US10308615

    申请日：2002-12-03

    申请人： Joe A. Harrison ,  Anthony P. Valpiani

    发明人： Joe A. Harrison ,  Anthony P. Valpiani

    IPC分类号： H02G3/32 ,  F16L3/22 ,  F16B15/00

    CPC分类号： H02G3/32 ,  Y10T24/1498

    摘要： A tie wrap assembly comprises a tie wrap, for retaining a cable assembly, and a tie wrap base, for connecting the cable assembly to the chassis. The tie wrap includes a shaped engagement member for fittably coupling to an orifice within the tie wrap base. The tie wrap base is flexible, allowing the engagement member to be repeatedly inserted into and removed from the tie wrap base, as well as being fit through a hole in the chassis. One or more tie wrap bases are disposed at pre-arranged locations along the chassis. The tie wrap assembly allows cabling to be consistently routed along the pre-arranged locations, facilitating the consistent placement of cables in a mass production environment.

    摘要翻译： 捆扎包装组件包括用于保持电缆组件的扎带，和用于将电缆组件连接到底架的扎带包装基座。 扎带包括一个成形的接合构件，用于可适配地联接到系带包装基座内的孔口。 领带包装基部是柔性的，允许接合构件被重复插入和从绑带基部移除，并且通过底座中的孔配合。 一个或多个扎带基座沿着底盘设置在预先布置的位置。 扎带组件允许布线沿着预先布置的位置一致地布线，有助于电缆在大规模生产环境中的一致放置。

    Computer peripheral bay cooling apparatus
    9.
    发明授权
    Computer peripheral bay cooling apparatus 失效
    电脑周边柜冷却装置

    公开(公告)号：US06493221B2

    公开(公告)日：2002-12-10

    申请号：US09073300

    申请日：1998-05-05

    申请人： Joe A. Harrison ,  Scott M. Deane

    发明人： Joe A. Harrison ,  Scott M. Deane

    IPC分类号： G06F120

    CPC分类号： H05K7/20718 ,  G06F1/20 ,  G11B33/142

    摘要： The computer peripheral bay cooling apparatus comprises a blower chassis adapted to fit within the 5¼ inch drive bay of a computer chassis and a blower enclosed within the blower chassis.

    摘要翻译： 计算机外围设备间冷却设备包括适于安装在计算机机箱的5¼英寸驱动器托架内的鼓风机底盘以及包围在鼓风机底盘内的鼓风机。

    SYSTEMS AND METHODS FOR MANUFACTURING MODIFIED IMPEDANCE COAXIAL CABLES
    10.
    发明申请
    SYSTEMS AND METHODS FOR MANUFACTURING MODIFIED IMPEDANCE COAXIAL CABLES 审中-公开
    制造修改后的阻抗同轴电缆的系统和方法

    公开(公告)号：US20110154656A1

    公开(公告)日：2011-06-30

    申请号：US12975433

    申请日：2010-12-22

    申请人： Joe A. Harrison ,  Songnan Yang ,  Michael A. Link

    发明人： Joe A. Harrison ,  Songnan Yang ,  Michael A. Link

    IPC分类号： H01B13/20

    CPC分类号： H04B1/18 ,  H01P1/202 ,  Y10T29/49123

    摘要： Systems and methods for manufacturing modified impedance coaxial cables including providing a coaxial cable having an inner conductor, a dielectric layer at least partially covering an outer surface of the inner conductor, and an outer conductor at least partially covering an outer surface of the dielectric layer. The coaxial cable may include a first section having a first impedance configured to allow a first frequency band to pass. A discontinuity section may be formed in at least one of the inner conductor, the dielectric layer, and the outer conductor. The discontinuity section may have an impedance different than the first impedance and a length which is configured to attenuate a second frequency band.

    摘要翻译： 制造改进的阻抗同轴电缆的系统和方法，包括提供具有内部导体的同轴电缆，至少部分覆盖内部导体的外表面的电介质层和至少部分地覆盖电介质层的外表面的外部导体。 同轴电缆可以包括具有被配置为允许第一频带通过的第一阻抗的第一部分。 可以在内部导体，电介质层和外部导体中的至少一个中形成不连续部分。 不连续部分可以具有不同于第一阻抗的阻抗和被配置为衰减第二频带的长度。