摘要:
A method of manufacturing a silicon carbide semiconductor device of an embodiment includes: implanting ions in a silicon carbide substrate; performing first heating processing of the silicon carbide substrate in which the ions are implanted; and performing second heating processing of the silicon carbide substrate for which the first heating processing is performed, at a temperature lower than the first heating processing.
摘要:
A method of manufacturing a silicon carbide semiconductor device of an embodiment includes: implanting ions in a silicon carbide substrate; performing first heating processing of the silicon carbide substrate in which the ions are implanted; and performing second heating processing of the silicon carbide substrate for which the first heating processing is performed, at a temperature lower than the first heating processing.
摘要:
A slider comprising a contact sensor element configured to respond to a change in resistance due to a change in temperature, and a shield structure. The shield structure comprises a lower thermal conductivity than the contact sensor element and a greater hardness than the contact sensor element.
摘要:
An information recording apparatus includes a medium for recording information; a head slider including a device for writing the information onto the medium and a reflective surface for reflecting light; a light emitting portion for generating emission light toward the reflective surface; a light receiving portion for detecting light reflected on the reflective surface; and a regulating mechanism for adjusting an amount of the emission light from the light emitting portion in a mode of information recording onto the medium in correspondence to a result of the detection.
摘要:
A microwave-assisted magnetic recording head includes: a main magnetic pole that generates a recording magnetic field to be recorded on a magnetic recording medium; a shield; and an oscillator that is provided between the main magnetic pole and the shield and generates a microwave magnetic field. The microwave-assisted magnetic recording head is provided with a thermal expansion device for adjusting a relative position between the oscillator and the main magnetic pole so as to be able to independently adjust a recording magnetic field from the main magnetic pole and a microwave magnetic field from the oscillator.
摘要:
A resin composition for a molding material is provided which comprises a resol-type phenolic resin, an epoxy resin and an amine compound having hydrogen atoms directly bonded to the nitrogen atom. The amine compound is contained in such a proportion that the amount of its hydrogen atoms directly bonded to the nitrogen atom is 0.5 to 2.0 equivalents per equivalent of the epoxy groups of the epoxy resin.
摘要:
An information recording apparatus includes a medium for recording information; a head slider including a device for writing the information onto the medium and a reflective surface for reflecting light; a light emitting portion for generating emission light toward the reflective surface; a light receiving portion for detecting light reflected on the reflective surface; and a regulating mechanism for adjusting an amount of the emission light from the light emitting portion in a mode of information recording onto the medium in correspondence to a result of the detection.
摘要:
A microwave-assisted magnetic recording head includes: a main magnetic pole that generates a recording magnetic field to be recorded on a magnetic recording medium; a shield; and an oscillator that is provided between the main magnetic pole and the shield and generates a microwave magnetic field. The microwave-assisted magnetic recording head is provided with a thermal expansion device for adjusting a relative position between the oscillator and the main magnetic pole so as to be able to independently adjust a recording magnetic field from the main magnetic pole and a microwave magnetic field from the oscillator.
摘要:
A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要:
A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.