摘要:
A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.
摘要:
A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.
摘要:
A touchpad assembly for use in an electronic device is provided. The touchpad assembly may include a touchpad frame operative to be placed within an opening in an electronic device frame. The touchpad assembly may include a support plate for supporting a touchpad, and a bracket for receiving a pick button. The support plate and bracket may be manufactured into a same component to increase the rigidity of the touchpad assembly. The pick button may include a varying height to prevent the pick button from deflecting and to make the pick button travel for providing a selection instruction uniform. The pick button may be coupled to the frame using any suitable approach, including using springs connected the ends of the pick button to the frame. The frame may also include pads to muffle the sound of the pick button when it returns to its initial position after having been pressed.
摘要:
A touchpad assembly for use in an electronic device is provided. The touchpad assembly may include a touchpad frame operative to be placed within an opening in an electronic device frame. The touchpad assembly may include a support plate for supporting a touchpad, and a bracket for receiving a pick button. The support plate and bracket may be manufactured into a same component to increase the rigidity of the touchpad assembly. The pick button may include a varying height to prevent the pick button from deflecting and to make the pick button travel for providing a selection instruction uniform. The pick button may be coupled to the frame using any suitable approach, including using springs connected the ends of the pick button to the frame. The frame may also include pads to muffle the sound of the pick button when it returns to its initial position after having been pressed.
摘要:
A movable I/O port and housing therefore. The I/O port housing may be hinged to pivot between an open and closed position. The pivot point may be a low- or zero-friction pivot. The I/O port housing may include an opening mechanism to facilitate pivoting the port between the open and closed positions, and/or vice versa. For example, the opening mechanism may take the form of paired magnets of opposing polarities.
摘要翻译:因此,可移动的I / O端口和外壳。 I / O端口壳体可以铰接以在打开和关闭位置之间枢转。 枢轴点可以是低摩擦或零摩擦的枢轴。 I / O端口壳体可以包括开启机构,以便于在打开和关闭位置之间枢转端口,和/或反之亦然。 例如,打开机构可以采用具有相反极性的配对磁铁的形式。
摘要:
A touchpad assembly for use in an electronic device is provided. The touchpad assembly may include a touchpad frame operative to be placed within an opening in an electronic device frame. The touchpad assembly may include a support plate for supporting a touchpad, and a bracket for receiving a pick button. The support plate and bracket may be manufactured into a same component to increase the rigidity of the touchpad assembly. The pick button may include a varying height to prevent the pick button from deflecting and to make the pick button travel for providing a selection instruction uniform. The pick button may be coupled to the frame using any suitable approach, including using springs connected the ends of the pick button to the frame. The frame may also include pads to muffle the sound of the pick button when it returns to its initial position after having been pressed.
摘要:
A movable I/O port and housing therefore. The I/O port housing may be hinged to pivot between an open and closed position. The pivot point may be a low- or zero-friction pivot. The I/O port housing may include an opening mechanism to facilitate pivoting the port between the open and closed positions, and/or vice versa. For example, the opening mechanism may take the form of paired magnets of like polarities.
摘要翻译:因此,可移动的I / O端口和外壳。 I / O端口壳体可以铰接以在打开和关闭位置之间枢转。 枢轴点可以是低摩擦或零摩擦的枢轴。 I / O端口壳体可以包括开启机构,以便于在打开和关闭位置之间枢转端口,和/或反之亦然。 例如,打开机构可以采用具有相同极性的配对磁铁的形式。
摘要:
Wall portions, such as wall portions of electronic device housing components, are provided with one or more foot assemblies. A foot assembly can be formed by creating an internal cavity in an internal surface of the wall portion, an external cavity in an external surface of the wall portion, and a hollow passageway extending through the wall portion and between the cavities. The foot assembly can be completed by inserting a foot at least partially through the external cavity and hollow passageway and into the internal cavity, such that an external portion of the foot is at least partially contained within and contacting the surfaces of the external cavity, and such that an internal portion of the foot is at least partially contained within the internal cavity. A portion of the foot may be deformable to at least partially conform to the surfaces defining the internal cavity.
摘要:
Wall portions, such as wall portions of electronic device housing components, are provided with one or more foot assemblies. A foot assembly can be formed by creating an internal cavity in an internal surface of the wall portion, an external cavity in an external surface of the wall portion, and a hollow passageway extending through the wall portion and between the cavities. The foot assembly can be completed by inserting a foot at least partially through the external cavity and hollow passageway and into the internal cavity, such that an external portion of the foot is at least partially contained within and contacting the surfaces of the external cavity, and such that an internal portion of the foot is at least partially contained within the internal cavity. A portion of the foot may be deformable to at least partially conform to the surfaces defining the internal cavity.
摘要:
An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.