摘要:
A strain sensor comprises a capacitor formed on a substrate, the capacitor having a layered structure in which a lower electrode, a metal oxide film of perovskite structure and an upper electrode are laminated consecutively on the substrate, the capacitor being adapted to be mounted upon a specimen, and a measuring circuit that measures a leakage current flowing through the capacitor between the upper electrode and the lower electrode.
摘要:
A capacitor including a substrate; a conductive layer provided on the substrate and containing conductive particles; a valve metal sheet having a dielectric part formed throughout an entire surface of the conductive layer; a protection layer covering the valve metal sheet; a first electrode terminal electrically connected to the conductive layer and partially exposed from an external surface of the protection layer; and a second electrode terminal electrically connected to a surface of the valve metal sheet which is opposite to a surface of the valve metal sheet on which the dielectric part is provided, and the second electrode terminal partially exposed from the external surface of the protection layer; wherein the dielectric part is made of an oxide of a metallic material of the valve metal sheet, the dielectric part is formed with a corrugated surface on the conductive layer, and the conductive particles of the conductive layer are in contact with the corrugated surface of the dielectric part.
摘要:
A thin film capacitor device of the present invention has a thin film capacitor having two electrodes and a dielectric layer provided therebetween and external terminals electrically connected to the electrodes. In addition, the thin film capacitor device also has resistor layers which are provided between the external terminals and the electrodes and adjacent thereto, and which are formed of a material have a higher resistivity than that of the adjacent electrodes.
摘要:
As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes).
摘要:
A capacitor comprises a substrate, a conductive layer containing conductive particles, a valve metal sheet having a dielectric part formed throughout an entire surface of the conductive layer, a protection layer covering the valve metal sheet. The capacitor further includes a first electrode terminal electrically connected to the conductive layer and partially exposed from a surface of the protection layer, and a second electrode terminal electrically connected to a surface of the valve metal sheet opposite to a surface of the valve metal sheet on which the dielectric part is provided, and the second electrode terminal partially exposed from the surface of the protection layer. The dielectric part is made of an oxide of a metallic material of the valve metal sheet, the dielectric part is formed with a corrugated surface on the conductive layer, and the conductive particles are in contact with the corrugated surface.
摘要:
As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes).
摘要:
A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacitor includes a valve metal part, an anodic oxide film formed on a surface of the valve metal part, and a conductive part formed on the anodic oxide film and made of a conductive material.
摘要:
A loop heat pipe includes an evaporator to vaporize a working fluid due to heat supplied from an external heat source; a condenser to cause the vaporized working fluid to condense; and connecting lines to connect the evaporator and the condenser in a loop, wherein the evaporator includes a first space defined by a set of walls including a contact wall that comes into contact with the external heat source, a second space provided adjacent to at least one of the walls other than the contact wall, and a through-hole formed in a dividing wall separating the first space and the second space to allow the first space and the second space to communicate with each other.