Resistor compositions for electronic circuitry applications
    2.
    发明授权
    Resistor compositions for electronic circuitry applications 有权
    电子电路应用的电阻组合物

    公开(公告)号:US07604754B2

    公开(公告)日:2009-10-20

    申请号:US11985950

    申请日:2007-11-19

    申请人: John D. Summers

    发明人: John D. Summers

    摘要: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

    摘要翻译: 公开了由包含聚酰亚胺组分,空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分(“A”)与环氧成分(“B”)的重量比为A:B,其中A在1〜15之间,B为1。

    Resistor compositions for electronic circuitry applications
    8.
    发明申请
    Resistor compositions for electronic circuitry applications 有权
    电子电路应用的电阻组合物

    公开(公告)号:US20080185561A1

    公开(公告)日:2008-08-07

    申请号:US11985950

    申请日:2007-11-19

    申请人: John D. Summers

    发明人: John D. Summers

    IPC分类号: H01B1/12 C08G59/24

    摘要: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

    摘要翻译: 公开了由包含聚酰亚胺组分,空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分(“A”)与环氧成分(“B”)的重量比为A:B,其中A在1〜15之间,B为1。