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    Microelectronic package having multiple conductive paths through an opening in a support substrate
    3.
    发明申请
    Microelectronic package having multiple conductive paths through an opening in a support substrate 有权
    具有通过支撑衬底中的开口的多个导电路径的微电子封装

    公开(公告)号：US20070077747A1

    公开(公告)日：2007-04-05

    申请号：US11240750

    申请日：2005-09-30

    申请人： John Heck ,  Qing Ma

    发明人： John Heck ,  Qing Ma

    IPC分类号： H01L21/4763

    CPC分类号： H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/00012

    摘要： Microelectronic packages are disclosed. A microelectronic package may include a substrate having first and second sides. Passive components may be located on the first side of the substrate. Interconnects may also be located on the first side of the substrate, and may be electrically coupled with the passive components. Microelectronic components may be located on the first side of the substrate and may be electrically coupled with interconnects. The substrate may include an opening therein. The opening may lead from the second side of the substrate toward the first side of the substrate. A plurality of conductive paths may be at least partially included in the opening. Each of the conductive paths may lead from the second side of the substrate toward the first side of the substrate to communicate electrical signals to interconnects. Methods of making the packages and electronic devices including the packages are also disclosed.

    摘要翻译： 公开了微电子封装。 微电子封装可以包括具有第一和第二侧面的衬底。 无源组件可以位于衬底的第一侧上。 互连件也可以位于衬底的第一侧上，并且可以与无源部件电耦合。 微电子部件可以位于衬底的第一侧上并且可以与互连件电耦合。 衬底可以包括其中的开口。 开口可以从基板的第二侧朝向基板的第一侧。 多个导电路径可以至少部分地包括在开口中。 每个导电路径可以从衬底的第二侧朝向衬底的第一侧引导，以将电信号传送到互连。 还公开了制造包装和包括包装的电子装置的方法。

    Microelectromechanical (MEMS) switching apparatus
    6.
    发明授权
    Microelectromechanical (MEMS) switching apparatus 有权
    微机电（MEMS）开关装置

    公开(公告)号：US06686820B1

    公开(公告)日：2004-02-03

    申请号：US10194096

    申请日：2002-07-11

    申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

    发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

    IPC分类号： H01P110

    CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

    摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

    摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。

    Ultra-low voltage capable zipper switch
    7.
    发明申请
    Ultra-low voltage capable zipper switch 失效
    超低电压拉链开关

    公开(公告)号：US20060290443A1

    公开(公告)日：2006-12-28

    申请号：US11165795

    申请日：2005-06-23

    申请人： Tsung-Kuan Chou ,  Hanan Bar ,  Quan Tran ,  Joseph Melki ,  John Heck ,  Qing Ma

    发明人： Tsung-Kuan Chou ,  Hanan Bar ,  Quan Tran ,  Joseph Melki ,  John Heck ,  Qing Ma

    IPC分类号： H01P1/10

    CPC分类号： H01H59/0009 ,  B81B3/0013 ,  B81B2201/014 ,  H01H2059/0063 ,  H01H2059/0072

    摘要： An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.

    摘要翻译： 机电开关包括致动电极，锚，悬臂电极，触点和信号线。 致动电极和锚固件安装到基板上。 悬臂电极由致动电极上方的锚固件支撑。 触点安装到悬臂电极。 当在致动电极和悬臂电极之间施加致动电压时，信号线被定位成与触点形成闭合电路，导致悬臂电极以拉链的方式朝着致动电极弯曲，从悬臂的远端开始 电极。

    Module integrating MEMS and passive components
    8.
    发明申请
    Module integrating MEMS and passive components 有权
    集成MEMS和无源元件的模块

    公开(公告)号：US20060001123A1

    公开(公告)日：2006-01-05

    申请号：US10882635

    申请日：2004-06-30

    申请人： John Heck ,  Qing Ma ,  Eyal Bar-Sadeh

    发明人： John Heck ,  Qing Ma ,  Eyal Bar-Sadeh

    IPC分类号： H01L29/00

    CPC分类号： B81C1/0023 ,  Y10S977/701 ,  Y10S977/724

    摘要： An apparatus may include a first substrate, one or more microelectromechanical systems (MEMS) coupled to the first substrate, a second substrate coupled with the first substrate, and one or more passive components coupled to the second substrate. A method may include aligning a first substrate having one or more MEMS coupled thereto and a second substrate having one or more passive components coupled thereto, and coupling the aligned substrates.

    摘要翻译： 装置可以包括第一基板，耦合到第一基板的一个或多个微机电系统（MEMS），与第一基板耦合的第二基板以及耦合到第二基板的一个或多个无源部件。 一种方法可以包括对准具有耦合到其上的一个或多个MEMS的第一基板和具有耦合到其上的一个或多个无源部件的第二基板，以及连接对准的基板。

    Microelectromechanical (MEMS) switching apparatus
    9.
    发明申请
    Microelectromechanical (MEMS) switching apparatus 有权
    微机电（MEMS）开关装置

    公开(公告)号：US20050007219A1

    公开(公告)日：2005-01-13

    申请号：US10912413

    申请日：2004-08-04

    申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

    发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

    IPC分类号： H01H59/00 ,  H01H51/22

    CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

    摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

    摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。

    Through-wafer vias and surface metallization for coupling thereto
    10.
    发明授权
    Through-wafer vias and surface metallization for coupling thereto 有权
    通孔和用于耦合的表面金属化

    公开(公告)号：US07510907B2

    公开(公告)日：2009-03-31

    申请号：US11165465

    申请日：2005-06-22

    申请人： John Heck ,  Qing Ma ,  Quan Tran ,  Tsung-Kuan Allen Chou ,  Semeon Altshuler ,  Boaz Weinfeld

    发明人： John Heck ,  Qing Ma ,  Quan Tran ,  Tsung-Kuan Allen Chou ,  Semeon Altshuler ,  Boaz Weinfeld

    IPC分类号： H01L21/44

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the first semiconductor die in the first via area and a blanket metal layer is formed over the first side including the deep recess. The blanket metal layer is removed from an outer surface of the first side of the first semiconductor die while retaining a portion of the blanket metal layer within the deep recess.

    摘要翻译： 一种制造通晶片通孔的装置和方法。 第一掩模形成在第一半导体管芯的第一侧上以限定第一通孔区域。 通过第一通孔区域中的第一半导体管芯蚀刻深的凹部，并且在包括深凹部的第一侧上形成覆盖金属层。 将橡皮布金属层从第一半导体管芯的第一侧的外表面移除，同时将橡皮布金属层的一部分保持在深凹部内。