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公开(公告)号：US07510907B2
公开(公告)日：2009-03-31
申请号：US11165465
申请日：2005-06-22
申请人： John Heck , Qing Ma , Quan Tran , Tsung-Kuan Allen Chou , Semeon Altshuler , Boaz Weinfeld
发明人： John Heck , Qing Ma , Quan Tran , Tsung-Kuan Allen Chou , Semeon Altshuler , Boaz Weinfeld
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the first semiconductor die in the first via area and a blanket metal layer is formed over the first side including the deep recess. The blanket metal layer is removed from an outer surface of the first side of the first semiconductor die while retaining a portion of the blanket metal layer within the deep recess.
摘要翻译： 一种制造通晶片通孔的装置和方法。 第一掩模形成在第一半导体管芯的第一侧上以限定第一通孔区域。 通过第一通孔区域中的第一半导体管芯蚀刻深的凹部，并且在包括深凹部的第一侧上形成覆盖金属层。 将橡皮布金属层从第一半导体管芯的第一侧的外表面移除，同时将橡皮布金属层的一部分保持在深凹部内。
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公开(公告)号：US20060289967A1
公开(公告)日：2006-12-28
申请号：US11165465
申请日：2005-06-22
申请人： John Heck , Qing Ma , Quan Tran , Tsung-Kuan Chou , Semeon Altshuler , Boaz Weinfeld
发明人： John Heck , Qing Ma , Quan Tran , Tsung-Kuan Chou , Semeon Altshuler , Boaz Weinfeld
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the first semiconductor die in the first via area and a blanket metal layer is formed over the first side including the deep recess. The blanket metal layer is removed from an outer surface of the first side of the first semiconductor die while retaining a portion of the blanket metal layer within the deep recess.
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公开(公告)号：US07321275B2
公开(公告)日：2008-01-22
申请号：US11165795
申请日：2005-06-23
申请人： Tsung-Kuan Allen Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
发明人： Tsung-Kuan Allen Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
IPC分类号： H01P1/10
CPC分类号： H01H59/0009 , B81B3/0013 , B81B2201/014 , H01H2059/0063 , H01H2059/0072
摘要： An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.
摘要翻译： 机电开关包括致动电极，锚，悬臂电极，触点和信号线。 致动电极和锚固件安装到基板上。 悬臂电极由致动电极上方的锚固件支撑。 触点安装到悬臂电极。 当在致动电极和悬臂电极之间施加致动电压时，信号线被定位成与触点形成闭合电路，导致悬臂电极以拉链的方式朝着致动电极弯曲，从悬臂的远端开始 电极。
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公开(公告)号：US06809617B2
公开(公告)日：2004-10-26
申请号：US10322157
申请日：2002-12-17
申请人： Qing Ma , Joseph Hayden, III , Tsung-Kuan Allen Chou , Quan Tran
发明人： Qing Ma , Joseph Hayden, III , Tsung-Kuan Allen Chou , Quan Tran
IPC分类号： H01P308
CPC分类号： H01P11/003 , H01P3/003 , H05K1/0219 , H05K1/0237 , H05K3/243 , H05K2201/09236 , H05K2201/09736 , H05K2201/098
摘要： Coplanar waveguides have a center signal line and a pair of ground lines on either side formed of a sputtered material such as gold (Au). Such waveguides are subject to what is known as the edge effect at high frequency operation causing currents to concentrate and flow along adjacent edges of the lines. Providing a thicker plated layer only on adjacent edges of the lines provide substantial performance improvements over sputtered lines alone while saving significant amount of Au, thus reducing costs.
摘要翻译： 共平面波导具有中心信号线和由诸如金（Au）的溅射材料形成的任一侧上的一对接地线。 这种波导在高频操作下受到所谓的边缘效应的影响，导致电流集中并沿着线的相邻边缘流动。 仅在线路的相邻边缘上提供较厚的镀层仅提供了超过溅射线的显着性能改善，同时节省了大量的Au，从而降低了成本。
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公开(公告)号：US06967548B2
公开(公告)日：2005-11-22
申请号：US10912413
申请日：2004-08-04
申请人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
发明人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
CPC分类号： H01H59/0009 , H01H2001/0078 , H01H2059/0036
摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.
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公开(公告)号：US06686820B1
公开(公告)日：2004-02-03
申请号：US10194096
申请日：2002-07-11
申请人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
发明人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
IPC分类号： H01P110
CPC分类号： H01H59/0009 , H01H2001/0078 , H01H2059/0036
摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.
摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。
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公开(公告)号：US20060290443A1
公开(公告)日：2006-12-28
申请号：US11165795
申请日：2005-06-23
申请人： Tsung-Kuan Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
发明人： Tsung-Kuan Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
IPC分类号： H01P1/10
CPC分类号： H01H59/0009 , B81B3/0013 , B81B2201/014 , H01H2059/0063 , H01H2059/0072
摘要： An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.
摘要翻译： 机电开关包括致动电极，锚，悬臂电极，触点和信号线。 致动电极和锚固件安装到基板上。 悬臂电极由致动电极上方的锚固件支撑。 触点安装到悬臂电极。 当在致动电极和悬臂电极之间施加致动电压时，信号线被定位成与触点形成闭合电路，导致悬臂电极以拉链的方式朝着致动电极弯曲，从悬臂的远端开始 电极。
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公开(公告)号：US20050007219A1
公开(公告)日：2005-01-13
申请号：US10912413
申请日：2004-08-04
申请人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
发明人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
CPC分类号： H01H59/0009 , H01H2001/0078 , H01H2059/0036
摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.
摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。
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公开(公告)号：US20060176126A1
公开(公告)日：2006-08-10
申请号：US11335920
申请日：2006-01-19
申请人： Li-Peng Wang , Eyal Bar-Sadeh , Valluri Rao , John Heck , Qing Ma , Quan Tran , Alexander Talalyevsky , Eyal Ginsburg
发明人： Li-Peng Wang , Eyal Bar-Sadeh , Valluri Rao , John Heck , Qing Ma , Quan Tran , Alexander Talalyevsky , Eyal Ginsburg
IPC分类号： H04R17/00
摘要： A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lower conductive layer which is defined to form the bottom electrode of each film bulk acoustic resonator. A common top conductive layer may be defined to form each top electrode of each film bulk acoustic resonator. A common piezoelectric film layer, that may or may not be patterned, forms a continuous or discontinuous film.
摘要翻译： 薄膜体声波谐振器滤波器可以形成有形成在同一膜上的多个互连串联和分流膜体声波谐振器。 膜体积声谐振器中的每一个可以由限定为形成每个膜体声波谐振器的底部电极的公共下导电层形成。 可以限定共同的顶部导电层以形成每个膜体声波谐振器的每个顶部电极。 可以或可以不被图案化的公共压电膜层形成连续或不连续的膜。
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公开(公告)号：US06903452B2
公开(公告)日：2005-06-07
申请号：US10643427
申请日：2003-08-19
申请人： Qing Ma , Valluri Rao , Li-Peng Wang , John Heck , Quan Tran
发明人： Qing Ma , Valluri Rao , Li-Peng Wang , John Heck , Quan Tran
CPC分类号： B81B7/0006 , B81C2203/0118 , H01L2924/0002 , H01L2924/00
摘要： A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.
摘要翻译： 微机电系统可封闭在由连接的第一和第二半导体结构限定的密封腔中。 接合结构可以通过完全围绕空腔延伸的焊料密封环密封。 半导体结构中的一个可以具有形成在其上的系统，并且可以在所述系统下方形成开放区域。 该开放区域可以由结构的下侧形成，并且在一个实施例中可以通过用适当的膜覆盖来封闭。
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