摘要:
A source-series terminated (‘SST’) driver circuit that includes: one or more data signal inputs; one or more control signal inputs; a driver output; and a plurality of driver cells, the driver cells coupled in parallel to one another, outputs of the driver cells coupled together to form the driver output of the SST driver circuit, where output resistance of the SST driver circuit varies in dependence upon activation of one or more of the parallel driver cells, activation of each driver cell controlled by control signals received at the control signal inputs.
摘要:
A source-series terminated (‘SST’) driver circuit that includes: one or more data signal inputs; one or more control signal inputs; a driver output; and a plurality of driver cells, the driver cells coupled in parallel to one another, outputs of the driver cells coupled together to form the driver output of the SST driver circuit, where output resistance of the SST driver circuit varies in dependence upon activation of one or more of the parallel driver cells, activation of each driver cell controlled by control signals received at the control signal inputs.
摘要:
Disclosed are embodiments of on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors. In each embodiment the resulting pattern of shorts and opens, can be used as an on-chip identifier or private key.
摘要:
Cross-die connection structure and method for a die or chip includes buffer elements having a buffer driver and bypass, and control lines coupled to the buffer elements in order to select one of the buffer driver and bypass for each respective buffer element. A logic network is arranged with the buffer elements to form functional paths, a test unit is structured and arranged to test the functional paths and to be coupled to the control lines, and a configuration storage register to set the selected one of the buffer driver and bypass for each passing functional path.
摘要:
A method is disclosed for tuning each channel of a high-speed SerDes cable link interface arranged in a configuration linking a local side physical layer to a remote side physical layer. The method includes initiating an operational state of high-speed SerDes cable link interface, identifying flow-control packet Op codes not cited for use by operational high-speed SerDes cable link interface, transmitting a flow control signal from the local side physical layer to the remote side physical layer to control the remote side physical layer to monitor the bit error rate (BER) of the channels used by the local side physical layer to transfer data to the remote side physical layer, monitoring the BER in the channels used for data transfer, transferring BER data acquired in the monitoring to the local side physical layer and processing the BER data by the local side physical layer to generate equalization setting adjustments.
摘要:
A method and accompanying system are disclosed for tuning each channel of a high-speed SerDes link interface arranged in a configuration linking a local side to a remote side. The method includes transmitting a flow control packets from the local side to the remote side to change remote side transmission characteristics in a link channel; monitoring signal eye characteristics in the link channel; transferring additional flow control packets to adjust the remote side transmission characteristics; and processing the signal eye characteristics at the local side to generate the remote side transmission characteristics for the link channel.
摘要:
Method for correcting timing failures in an integrated circuit and device for monitoring an integrated circuit. The method includes placing a first and second latch near a critical path. The first latch has an input comprising a data value on the critical path. The method further includes generating a delayed data value from the data value, latching the delayed data value in the second latch, comparing the data value with the delayed data value to determine whether the critical path comprises a timing failure condition, and executing a predetermined corrective measure for the critical path.
摘要:
The embodiments of the invention provide an apparatus, method, etc. for a task based debugger (transaction-event-job-trigger). More specifically, an integrated event monitor for a SOC comprises functional cores each having a functional debug logic element. The cores are connected to an interconnect structure that links the functional debug logic elements. Each functional debug logic element is specifically dedicated to a function of its corresponding core, wherein the functional debug logic elements generate a table of function-specific system events. The system events are function-specific with respect to an associated core, wherein the system events include transaction events, controller events, processor events, interconnect structure arbiter events, interconnect interface core events, high speed serial link core events, and/or codec events.
摘要:
Method for correcting timing failures in an integrated circuit and device for monitoring an integrated circuit. The method includes placing a first and second latch near a critical path. The first latch has an input comprising a data value on the critical path. The method further includes generating a delayed data value from the data value, latching the delayed data value in the second latch, comparing the data value with the delayed data value to determine whether the critical path comprises a timing failure condition, and executing a predetermined corrective measure for the critical path.
摘要:
Disclosed is a system-on-chip (SOC) structure that allows for automated integration of multiple intellectual cores. The SOC structure incorporates a plurality of cells connected to a common bus on a chip. Each cell incorporates a functional core and an automated integration unit (AIU) connected to the functional core. Each AIU communicates integration information for its functional core over the common bus to the AIUs in the other cells. The exchange of information between the AIUs is controlled either by the integration units themselves or by a controller. Based on received integration information, each AIU can automatically make any required configuration adjustments for integration. Furthermore, based on this exchange of information, the functional cores can interact, as necessary, during SOC operation. Also disclosed are an associated method of forming such a SOC structure and a design structure for such an SOC structure.