Thermal device, system, and method, for fluid processing device
    1.
    发明授权
    Thermal device, system, and method, for fluid processing device 有权
    用于流体处理装置的热装置,系统和方法

    公开(公告)号:US07585663B2

    公开(公告)日:2009-09-08

    申请号:US10926915

    申请日:2004-08-26

    IPC分类号: C12M1/34 C12M3/00 C12P19/34

    摘要: A device, system, and method are provided for thermally treating a fluid processing device. According to various embodiments, a system is provided that can include a thermal device and a fluid processing device holder. The thermal device can include a first block having a thermal conductivity greater than 0.5 Watt per centimeter Kelvin (W/cm·K), a second block having a thermal conductivity greater than 0.5 W/cm·K, and a heat-pump device disposed between the first block and the second block. The heat-pump device can transfer thermal energy from at least one of the first block and the second block to the other of the first block and the second block. The fluid processing device holder can hold a fluid processing device in a heat-transfer position with respect to the first block and the second block. The fluid processing device can be a microfluidic device.

    摘要翻译: 提供了用于热处理流体处理装置的装置,系统和方法。 根据各种实施例,提供一种可以包括热装置和流体处理装置支架的系统。 热装置可以包括具有大于0.5瓦/厘米开尔文(W / cm·K)的热导率的第一块,具有大于0.5W / cm·K的热导率的第二块,以及设置在所述热泵装置 在第一块和第二块之间。 热泵装置可以将热能从第一块和第二块中的至少一个传递到第一块和第二块中的另一个块。 流体处理装置保持器可以将流体处理装置保持在相对于第一块和第二块的热传递位置。 流体处理装置可以是微流体装置。

    Thermal Device, System, and Method, for Fluid Processing Device
    2.
    发明申请
    Thermal Device, System, and Method, for Fluid Processing Device 审中-公开
    用于流体处理装置的热装置,系统和方法

    公开(公告)号:US20090325277A1

    公开(公告)日:2009-12-31

    申请号:US12552218

    申请日:2009-09-01

    IPC分类号: C12M1/34

    摘要: A device, system, and method are provided for thermally treating a fluid processing device. According to various embodiments, a system is provided that can include a thermal device and a fluid processing device holder. The thermal device can include a first block having a thermal conductivity greater than 0.5 Watt per centimeter Kelvin (W/cm·K), a second block having a thermal conductivity greater than 0.5 W/cm·K, and a heat-pump device disposed between the first block and the second block. The heat-pump device can transfer thermal energy from at least one of the first block and the second block to the other of the first block and the second block. The fluid processing device holder can hold a fluid processing device in a heat-transfer position with respect to the first block and the second block. The fluid processing device can be a microfluidic device.

    摘要翻译: 提供了用于热处理流体处理装置的装置,系统和方法。 根据各种实施例,提供一种可以包括热装置和流体处理装置支架的系统。 热装置可以包括具有大于0.5瓦/厘米开尔文(W / cm·K)的热导率的第一块,具有大于0.5W / cm·K的热导率的第二块,以及设置在所述热泵装置 在第一块和第二块之间。 热泵装置可以将热能从第一块和第二块中的至少一个传递到第一块和第二块中的另一个块。 流体处理装置保持器可以将流体处理装置保持在相对于第一块和第二块的热传递位置。 流体处理装置可以是微流体装置。