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公开(公告)号：US20140070828A1
公开(公告)日：2014-03-13
申请号：US13609154
申请日：2012-09-10
申请人： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
发明人： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
CPC分类号： G01R1/073 , G01R1/0408 , G01R31/2891 , G01R31/2893 , G01R35/005
摘要： Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.
摘要翻译： 本文公开了一种成本有效，高效，大规模并行的多晶圆测试电池。 此外，该测试单元可用于单触地板和多触地应用。 本发明使用新颖的“分离式墨盒”设计，结合将晶片与探针卡组件分离时对准的方法，以创建成本有效的，高效的多晶圆测试单元。 可以在墨盒内使用“探针卡停止”设计，以简化总体墨盒的设计和操作。
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公开(公告)号：US09335347B2
公开(公告)日：2016-05-10
申请号：US13609154
申请日：2012-09-10
申请人： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
发明人： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
CPC分类号： G01R1/073 , G01R1/0408 , G01R31/2891 , G01R31/2893 , G01R35/005
摘要： Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.
摘要翻译： 本文公开了一种成本有效，高效，大规模并行的多晶圆测试电池。 此外，该测试单元可用于单触地板和多触地应用。 本发明使用新颖的“分离式墨盒”设计，结合将晶片与探针卡组件分离时对准的方法，以创建成本有效的，高效的多晶圆测试单元。 可以在墨盒内使用“探针卡停止”设计，以简化总体墨盒的设计和操作。
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3.发明申请PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, AND METHODS OF MAKING SAME 有权用于微电子接触器组件的探头及其制造方法公开(公告)号：US20100237888A1
公开(公告)日：2010-09-23
申请号：US12709285
申请日：2010-02-19
IPC分类号： G01R31/02
CPC分类号： G01R1/07378
摘要： Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.
摘要翻译： 探针接触器基板上的微电子接触器或探针接触器或空间变压器基板上的粘合元件由牺牲材料保护，如：1）微电子接触器或粘合元件被平坦化，或2）基板的表面，微电子 形成接触器或粘合剂元件。 粘合元件用于将探针接触器基板粘合到空间变换器基板。
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4.发明授权Probe head for a microelectronic contactor assembly, the probe head having SMT electronic components thereon 有权用于微电子接触器组件的探针头，探针头上具有SMT电子部件公开(公告)号：US08232818B2
公开(公告)日：2012-07-31
申请号：US12709297
申请日：2010-02-19
IPC分类号： G01R31/00
CPC分类号： G01R1/07378
摘要： A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mount technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through-hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor and space transformer substrates.
摘要翻译： 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面贴装技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而定位成靠近探针接触器基板上的导电元件，这些空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器和空间变压器基板之间。
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5.发明授权Microelectronic contactor assembly, structures thereof, and methods of constructing same 有权微电子接触器组件，其结构及其构造方法公开(公告)号：US08305101B2
公开(公告)日：2012-11-06
申请号：US12709268
申请日：2010-02-19
CPC分类号： G01R1/07378
摘要： A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.
摘要翻译： 多个插入件锚固在探针头中的孔或凹槽中。 轴联接到插入件，并且可调节的多部件紧固件附接到轴和加强件。 操作多部件紧固件以移动轴并耦合探针头，加强件和微电子接触器组件的其它部件。 在一些实施例中，插入件可以使用粘合剂锚定在探头中。 在一些实施例中，探针头可以包括多于一个主要基底，并且插入物可以锚固在任一基底中。
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6.发明授权Probe head for a microelectronic contactor assembly, and methods of making same 有权微电子接触器组件的探针头及其制造方法公开(公告)号：US08901950B2
公开(公告)日：2014-12-02
申请号：US12709285
申请日：2010-02-19
CPC分类号： G01R1/07378
摘要： Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.
摘要翻译： 探针接触器基板上的微电子接触器或探针接触器或空间变压器基板上的粘合元件由牺牲材料保护，如：1）微电子接触器或粘合元件被平坦化，或2）基板的表面，微电子 形成接触器或粘合剂元件。 粘合元件用于将探针接触器基板粘合到空间变换器基板。
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7.发明申请PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, THE PROBE HEAD HAVING SMT ELECTRONIC COMPONENTS THEREON 有权用于微电子接触器组件的探头，具有SMT电子部件的探头公开(公告)号：US20100237889A1
公开(公告)日：2010-09-23
申请号：US12709297
申请日：2010-02-19
IPC分类号： G01R31/02
CPC分类号： G01R1/07378
摘要： A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mount technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through-hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor and space transformer substrates.
摘要翻译： 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面贴装技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而定位成靠近探针接触器基板上的导电元件，这些空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器和空间变压器基板之间。
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8.发明申请MICROELECTRONIC CONTACTOR ASSEMBLY, STRUCTURES THEREOF, AND METHODS OF CONSTRUCTING SAME 有权微电子接触器组件，其结构及其构造方法公开(公告)号：US20100237887A1
公开(公告)日：2010-09-23
申请号：US12709268
申请日：2010-02-19
IPC分类号： G01R31/02
CPC分类号： G01R1/07378
摘要： A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.
摘要翻译： 多个插入件锚固在探针头中的孔或凹槽中。 轴联接到插入件，并且可调节的多部件紧固件附接到轴和加强件。 操作多部件紧固件以移动轴并耦合探针头，加强件和微电子接触器组件的其它部件。 在一些实施例中，插入件可以使用粘合剂锚定在探头中。 在一些实施例中，探针头可以包括多于一个主要基底，并且插入物可以锚固在任一基底中。
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公开(公告)号：US20110248735A1
公开(公告)日：2011-10-13
申请号：US12756578
申请日：2010-04-08
申请人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
发明人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
CPC分类号： G01R31/2889 , G01R1/06744
摘要： A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
摘要翻译： 微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括第一和第二加强件本体，其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。 探针头可以在其中心部分外部的位置处附接到第一加强体，而探针机可以在其中心部分外部的位置处附接到第二加强体。 第一和第二加强体可具有不同的热膨胀系数。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。 调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。
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公开(公告)号：US08278956B2
公开(公告)日：2012-10-02
申请号：US12756578
申请日：2010-04-08
申请人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
发明人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
IPC分类号： G01R31/00
CPC分类号： G01R31/2889 , G01R1/06744
摘要： A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
摘要翻译： 微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括第一和第二加强件本体，其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。 探针头可以在其中心部分外部的位置处附接到第一加强体，而探针机可以在其中心部分外部的位置处附接到第二加强体。 第一和第二加强体可具有不同的热膨胀系数。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。 调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。
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