Process and apparatus for low pressure chemical vapor deposition of
refractory metal
    1.
    发明授权
    Process and apparatus for low pressure chemical vapor deposition of refractory metal 失效
    难熔金属低压化学气相沉积工艺及装置

    公开(公告)号:US4817557A

    公开(公告)日:1989-04-04

    申请号:US92967

    申请日:1987-09-04

    CPC分类号: C23C16/54 H01L21/28556

    摘要: A process and apparatus for the low pressure, cold wall, chemical vapor deposition of refractory metals, such as tungsten on a silicon wafer. The silicon wafer is introduced into a loading lock wherein the pressure is reduced to subatmospheric pressure. The silicon wafer is transferred to a deposition chamber where it is heated to an elevated temperature. A refractory metal carbonyl vapor is introduced into the deposition chamber and dissociates to deposit a refractory metal on the silicon wafer. The wafer is transferred to an unloading lock where it is allowed to cool and is then removed.

    摘要翻译: 用于在硅晶片上的诸如钨的难熔金属的低压,冷壁,化学气相沉积的方法和装置。 将硅晶片引入装载锁中,其中压力降低至低于大气压。 将硅晶片转移到沉积室,在其中将其加热到升高的温度。 将难熔金属羰基蒸气引入沉积室中并解离以在硅晶片上沉积难熔金属。 将晶片转移到卸载锁上,在其中允许其冷却,然后将其移除。

    Process for low pressure chemical vapor deposition of refractory metal
    2.
    发明授权
    Process for low pressure chemical vapor deposition of refractory metal 失效
    难熔金属低压化学气相沉积工艺

    公开(公告)号:US4726961A

    公开(公告)日:1988-02-23

    申请号:US874754

    申请日:1986-06-16

    摘要: A process and apparatus for the low pressure, cold wall, chemical vapor deposition of refractory metals, such as tungsten on a silicon wafer. The silicon wafer is introduced into a loading lock wherein the pressure is reduced to subatmospheric pressure. The silicon wafer is transferred to a deposition chamber where it is heated to an elevated temperature. A refractory metal carbonyl vapor is introduced into the deposition chamber and dissociates to deposit a refractory metal on the silicon wafer. The wafer is transferred to an unloading lock where it is allowed to cool and is then removed.

    摘要翻译: 用于在硅晶片上的诸如钨的难熔金属的低压,冷壁,化学气相沉积的方法和装置。 将硅晶片引入装载锁中,其中压力降低至低于大气压。 将硅晶片转移到沉积室,在其中将其加热到升高的温度。 将难熔金属羰基蒸气引入沉积室中并解离以在硅晶片上沉积难熔金属。 将晶片转移到卸载锁上,在其中允许其冷却,然后将其移除。

    Process and apparatus for low pressure chemical vapor deposition of
refractory metal
    3.
    发明授权
    Process and apparatus for low pressure chemical vapor deposition of refractory metal 失效
    难熔金属低压化学气相沉积工艺及装置

    公开(公告)号:US4619840A

    公开(公告)日:1986-10-28

    申请号:US497321

    申请日:1983-05-23

    摘要: A process and apparatus for the low pressure, cold wall, chemical vapor deposition of refractory metals, such as tungsten on a silicon wafer. The silicon wafer is introduced into a loading lock wherein the pressure is reduced to subatmospheric pressure. The silicon wafer is transferred to a deposition chamber where it is heated to an elevated temperature. A refractory metal carbonyl vapor is introduced into the deposition chamber and dissociates to deposit a refractory metal on the silicon wafer. The wafer is transferred to an unloading lock where it is allowed to cool and is then removed.

    摘要翻译: 用于在硅晶片上的诸如钨的难熔金属的低压,冷壁,化学气相沉积的方法和装置。 将硅晶片引入装载锁中,其中压力降低至低于大气压。 将硅晶片转移到沉积室,在其中将其加热到升高的温度。 将难熔金属羰基蒸气引入沉积室中并解离以在硅晶片上沉积难熔金属。 将晶片转移到卸载锁上,在其中允许其冷却,然后将其移除。

    Incremental tune etch apparatus and method
    8.
    发明授权
    Incremental tune etch apparatus and method 失效
    增量调谐蚀刻装置和方法

    公开(公告)号:US5076886A

    公开(公告)日:1991-12-31

    申请号:US605588

    申请日:1990-10-29

    申请人: Michael Diem

    发明人: Michael Diem

    IPC分类号: C23F1/08 H01L21/00

    CPC分类号: H01L21/67086 C23F1/08

    摘要: A method of performing a liquid etching operation on a wafer surface includes placing the wafer into an etch container, filling the etch container with a liquid etch solution, retaining the etch solution in the etch container for a short predetermined length of time, releasing the etch solution from the etch container, and then repeating the above steps without replacing the wafer, to obtain a series of short etch cycles having collectively a predictable average etch rate.

    摘要翻译: 在晶片表面上执行液体蚀刻操作的方法包括将晶片放置在蚀刻容器中,用液体蚀刻溶液填充蚀刻容器,将蚀刻溶液保持在蚀刻容器中短时间的预定长度,释放蚀刻 溶液,然后重复上述步骤而不更换晶片,以获得一系列具有可预测的平均蚀刻速率的短蚀刻循环。