摘要:
A removal tool for removing a bonded surface mount component from a printed wiring board. The removal tool comprises a printed wiring board holder for securing the printed wiring board. A base plate is provided and first and second end blocks are fastened to the base plate. The holder is slidable between the first and second end blocks. Two transverse guide shafts extend between the first and second end blocks. A main slide block is slidably attached to two transverse guide shafts, and is slidable along the shafts in response to rotation of the threaded rod. A torque application member is coupled to the surface mount component and to the main slide block for applying a downward force to the surface mount component during removal thereof. A threaded rod is rotatably disposed through the second end block and the torque application means that is rotatable to shear the bond between the surface mount component and the printed wiring board. A load cell may be disposed in the second end block for measuring the amount of force exerted by the removal tool on the surface mount component.
摘要:
The methods and compositions disclosed herein describes a solution containing at least one block co-polymer that is a liquid at lower temperatures and transitions to a gel at higher temperatures. The compositions are useful, for example, as an alternative to saline or silicone-gel as fillers for prostheses.
摘要:
A micro-electro-mechanical device including a first substrate; a first contact disposed on a first surface of the substrate; a piezoelectric actuator disposed over the first surface of the substrate; a second contact coupled to the actuator and disposed in proximity to the first contact; a gap control mechanism disposed between the substrate and the actuator for limiting movement of the first contact relative to the second contact. In the exemplary embodiment, the gap control mechanism is a gap control stop constructed of dielectric material. In practice, plural stops are used. In the exemplary embodiment, plural thermosonic bonds are used to connect the actuator to the first substrate. A second substrate is disposed over the piezo-electric actuator. The second substrate has wells over the bonds to facilitate application of a bonding tool to the bonds. The gap control mechanism provides consistent height control between a flipped chip and its base substrate without exposing the assembly to high temperatures.
摘要:
A method for forming a pattern of an organic insulating film by forming an electrode on a substrate, coating an imprintable composition thereon to form an organic insulating film, pressurizing and curing the organic insulating film using a patterned mold to transfer a pattern of the mold to the organic insulating film, and etching a portion of the organic insulating film remaining on the electrode. Since a pattern of an organic insulating film can be formed by simple molding without the use of a photoresist, the overall procedure is simplified and eventually an organic thin film transistor with high charge carrier mobility can be fabricated by all wet processes.
摘要:
The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.
摘要:
The present invention relates to methods and systems for creating secure cookies. The methods can be used to create, receive, and transmit secure cookies, confidential cookies, and authentication cookies.
摘要:
The hard coated abrasive medium is formed by providing a hollow body with abrasive deposit on the outer surface. The buoyancy is provided by the enclosed air space, and the weight is defined by the weight of the body plus the hard plating or the abrasive grit deposited thereon. The density is selected in accordance to the character of the workpiece with which it is to be used in order to optimize the abrading action by interacting with the workpiece in the optimum fashion. In one embodiment, the abrasive grit is bonded to the exterior surface of the abrasive medium in a spiral shape to accelerate the abrading action.
摘要:
A coplanarity inspection fixture for use in determining the coplanarity of a printed wiring assembly with respect to its edge connector. The fixture measures the deviation in parallelism between respective card guides of the printed wiring assembly and the centerline of the edge connector. The fixture includes a frame, a linear bearing block affixed to the frame, a rotational bearing block disposed above the linear bearing block, and a pin slot block fastened to the rotational bearing block. The pin slot block includes a plurality of slots for receiving the rows of pins of the edge connector. Left and right support members are vertically disposed on the frame for guiding and aligning the card guides so that the plurality of rows of connector pins of the connector mate with the slots in the pin slot block. A plurality of clamping jaw assemblies are affixed to the left and right support members that are adjustable to selectively grip a calibration template to calibrate the fixture, and thereafter to calibrate the printed wiring assembly that is to be inspected. Left and right indicators contact the pin slot block adjacent the respective support members along the centerline of the pin slot block, and are zeroed using the calibration template. After calibration, the indicators are used to measure the relative deviation of the centerline of the edge connector with respect to the card guides, which determines the deviation in parallelism between respective card guides and the centerline of the edge connector, whose centerline is designed to be coplanar with the respective centerlines of the card guides.
摘要:
The carrier handling system has a plurality of magazine tubes which contain carriers. In each tube, the carrier contains a different electronic component. A carriage is mounted on the base and moves on rectangular coordinates to the selected magazine tube. The collector saddle on the carriage is raised and the lowest carrier in the selected magazine is pushed out into the collector saddle. The collector saddle is moved to a reference position where the carrier is positioned for further processing.
摘要:
The base (12) of the fixture apparatus carries four fingers (22)-(28) which define the top plane of the printed wiring board (14). The fingers move out of active position to permit placement of the board in a frame (16). The frame rests on lifter assemblies (46-52) which raise the printed wiring board into contact with the fingers.