COMPUTER PRODUCT, UNEVENNESS ANALYSIS METHOD, AND UNEVENNESS ANALYZER
    1.
    发明申请
    COMPUTER PRODUCT, UNEVENNESS ANALYSIS METHOD, AND UNEVENNESS ANALYZER 审中-公开
    计算机产品,未知分析方法和无损分析仪

    公开(公告)号:US20160244066A1

    公开(公告)日:2016-08-25

    申请号:US15147026

    申请日:2016-05-05

    Abstract: A non-transitory, computer-readable recording medium stores therein an unevenness analysis program that causes a computer to perform based on an analysis parameter, analysis of motion data of a mobile object and analysis of unevenness of a road surface traveled by the mobile object. The unevenness analysis program causes the computer to execute a process including identifying based on a motion status of the mobile object indicated by the motion data, which includes at least longitudinal acceleration of the mobile object, first motion data that indicates one of an accelerating state and a decelerating state of the mobile object; and executing with respect to the identified first motion data indicating one of an accelerating state and a decelerating state, a comparison with second motion data not indicating one of an accelerating state and a decelerating state, and detection of unevenness of the road surface by a reduced sensitivity.

    Abstract translation: 非暂时的计算机可读记录介质中存储有使计算机基于分析参数执行的不平衡分析程序,移动对象的运动数据的分析以及移动对象所行驶的路面的不均匀性的分析。 不平坦度分析程序使计算机执行包括基于由运动数据指示的移动对象的运动状态进行识别的处理,运动数据至少包括移动对象的纵向加速度,指示加速状态之一的第一运动数据和 移动物体的减速状态; 并且相对于指示加速状态和减速状态之一的所识别的第一运动数据执行与不指示加速状态和减速状态之一的第二运动数据的比较,以及通过减少的路面的不均匀性的检测 灵敏度。

    Method and system for measuring film stress in a wafer film
    2.
    发明申请
    Method and system for measuring film stress in a wafer film 有权
    用于测量晶片薄膜中薄膜应力的方法和系统

    公开(公告)号:US20100141292A1

    公开(公告)日:2010-06-10

    申请号:US12315933

    申请日:2008-12-08

    Inventor: Peter J. Hopper

    CPC classification number: G01L1/14 G01B7/345 G01B2210/56 H01F5/003

    Abstract: In a MEMS wafer, film stresses are measured by placing an inductor array over or under the wafer and measuring inductance variations across the array to obtain a map defining the amount of bowing of the wafer.

    Abstract translation: 在MEMS晶片中,通过将电感器阵列放置在晶片上方或下方并测量阵列上的电感变化来测量膜应力,以获得限定晶片弯曲量的映射。

    Pin height adjustment in bed of nails shape measurement
    3.
    发明授权
    Pin height adjustment in bed of nails shape measurement 有权
    针脚高度调整床指甲形状测量

    公开(公告)号:US07509218B2

    公开(公告)日:2009-03-24

    申请号:US11602730

    申请日:2006-11-21

    CPC classification number: G01B7/287 G01B5/20 G01B7/345

    Abstract: Systems, methods, apparatus and products relate to systematic calculation and execution of pin height adjustments within a bed of nails shape measurement gauge with respect to a measured subject, such as glass substrates, and in particular, to using a bed of nails gauge for measuring a gravity-free shape of a surface of an object, including glass substrates used to make liquid crystal display (LCD) glass sheets. One or more embodiments may include a plurality of pins operable to support the surface during measurement. Each pin comprises a load cell operable to transmit measurement signals, and a height adjuster operable to receive adjustment signals and execute pin height adjustments upon receiving adjustment signals. Execution of the pin height adjustments systematically positions the pins so that the surface exerts on each pin a measured force nearing a target force corresponding to the gravity-free shape.

    Abstract translation: 系统,方法,装置和产品涉及相对于被测物体如玻璃基板的指甲形状测量计床的系统计算和执行针脚高度调节,并且特别地涉及使用钉子测量床测量 物体表面的无重力形状,包括用于制造液晶显示器(LCD)玻璃板的玻璃基板。 一个或多个实施例可以包括可操作以在测量期间支撑表面的多个销。 每个引脚包括可操作以传送测量信号的测力传感器,以及可接收调节信号并且在接收到调节信号时执行引脚高度调节的高度调节器。 销高度调整的执行系统地定位销,使得表面在每个销上施加接近与无重力形状对应的目标力的测量力。

    Method of and apparatus for contactless planarity measurements on ferromagnetic metal strip
    4.
    发明申请
    Method of and apparatus for contactless planarity measurements on ferromagnetic metal strip 失效
    铁磁金属带上无接触平面度测量的方法和装置

    公开(公告)号:US20010007422A1

    公开(公告)日:2001-07-12

    申请号:US09760368

    申请日:2001-01-11

    CPC classification number: G01B7/345

    Abstract: A method and apparatus for the contactless determination of planarity and a ferromagnetic metal strip during transit of the strip through a strip-processing line or cold-rolling line. Hysteresis loops repetitively impressed in the metal strip and the tangential magnetic field strength is measured at a surface thereof and electromagnetic parameters are determined from the time course of the tangential field strength signal. The parameters are functions of the mechanical stress which is evaluated to determine residual intrinsic stress distribution and then the planarity or nonplanarity of the strip.

    Abstract translation: 一种用于在条带通过条带加工线或冷轧生产线的过渡期间非平面确定平面度和强磁性金属条的方法和装置。 在金属带中重复地施加滞后环,并且在其表面测量切向磁场强度,并且根据切向场强度信号的时间过程确定电磁参数。 这些参数是机械应力的函数,其被评估以确定残余固有应力分布,然后是条带的平面度或非平面度。

    Flattening process for epitaxial semiconductor wafers
    5.
    发明授权
    Flattening process for epitaxial semiconductor wafers 失效
    外延半导体晶片的平整工艺

    公开(公告)号:US6030887A

    公开(公告)日:2000-02-29

    申请号:US30894

    申请日:1998-02-26

    Abstract: Process for the preparation of an epitaxial wafer having a total thickness variation and/or site total indicated reading of less than about 1.0 .mu.ms. The distance between the front and back surfaces of the epitaxial wafer at discrete positions on the front surface is measured to generate thickness profile data. Additional stock is removed from the front surface of the epitaxial wafer in a stock removal step to reduce the thickness of the epitaxial wafer to the target thickness, T.sub.t, with the amount of stock being removed at each of said discrete positions being determined after taking into account the thickness profile data and T.sub.t.

    Abstract translation: 具有总厚度变化和/或部位总数的外延晶片的制备方法指示读数小于约1.0微米。 测量在前表面上离散位置处的外延晶片的前表面和后表面之间的距离以产生厚度分布数据。 在外推晶片的前表面从原料去除步骤中除去额外的原料,以将外延晶片的厚度减小到目标厚度Tt,其中在每个所述离散位置上去除的原料量在进入 记录厚度剖面数据和Tt。

    Method and apparatus for inspecting the geometry of a guide tube
    7.
    发明授权
    Method and apparatus for inspecting the geometry of a guide tube 失效
    用于检查导管几何形状的方法和装置

    公开(公告)号:US5852642A

    公开(公告)日:1998-12-22

    申请号:US882729

    申请日:1997-06-26

    CPC classification number: G21C17/06 G01B7/345 G21Y2002/204

    Abstract: The apparatus is for internal inspection of a guide tube of a nuclear fuel assembly and measurement of deformations of a zone of smaller diameter in a terminal portion of the tube. The apparatus has a stick whose distal portion presents, in succession, starting from a distal end of the stick-shaped means, a guiding swelling having an easy fit in the zone of smaller diameter and two projections. The first projection carries two sets of diametrically opposite strain sensors provided with conductors linking them to a proximal end of the stick. A sleeve slides in a running portion of the guide tube above the zone of smaller diameter and slides over the stick. The sleeve and said stick-shaped means have mutually cooperating abutments for limiting displacement of the sleeve towards the distal portion to a position where the sleeve surrounds the stick.

    Abstract translation: 该装置用于内部检查核燃料组件的导管和在管的端部中测量较小直径的区域的变形。 该装置具有一个棒,其远端部分从棒状装置的远端开始,具有易于装配在较小直径区域和两个突出部分中的引导凸起。 第一个突起带有两组直径相对的应变传感器,它们设有将它们连接到杆的近端的导体。 套管在引导管的运行部分中在较小直径的区域上方滑动,并在棒上滑动。 套筒和所述棒状装置具有相互配合的支座,用于限制套筒朝向远端部分的位移到套筒围绕杆的位置。

    Rolling digital surface measurement apparatus
    8.
    发明授权
    Rolling digital surface measurement apparatus 失效
    滚动式数字表面测量装置

    公开(公告)号:US5535143A

    公开(公告)日:1996-07-09

    申请号:US166861

    申请日:1993-12-15

    Applicant: Allen Face

    Inventor: Allen Face

    CPC classification number: G01B5/285 G01B5/201 G01B7/345

    Abstract: A rolling digital surface measurement apparatus which measures and records the second elevation differences between a plurality of sequentially oriented, regularly spaced, co-linear points which lie on the surface, and which then computes the elevations of those points relative to a datum line established relative to any two points in the sequence by assuming that the mean curvatures of the tested surface are equal to zero in order to remove the inevitable effects of error compounding.

    Abstract translation: 一种滚动数字表面测量装置,其测量并记录位于表面上的多个顺序取向的,规则间隔的共线点之间的第二高差,然后计算这些点相对于相对于建立的基准线的高度 通过假定测试表面的平均曲率等于零,以消除误差复合的不可避免的影响,从而在序列中的任意两点。

    Printed wiring assembly coplanarity inspection fixture
    9.
    发明授权
    Printed wiring assembly coplanarity inspection fixture 失效
    印刷线路组装共面检查夹具

    公开(公告)号:US5519315A

    公开(公告)日:1996-05-21

    申请号:US332206

    申请日:1994-10-31

    CPC classification number: G01B7/345 G01B7/31

    Abstract: A coplanarity inspection fixture for use in determining the coplanarity of a printed wiring assembly with respect to its edge connector. The fixture measures the deviation in parallelism between respective card guides of the printed wiring assembly and the centerline of the edge connector. The fixture includes a frame, a linear bearing block affixed to the frame, a rotational bearing block disposed above the linear bearing block, and a pin slot block fastened to the rotational bearing block. The pin slot block includes a plurality of slots for receiving the rows of pins of the edge connector. Left and right support members are vertically disposed on the frame for guiding and aligning the card guides so that the plurality of rows of connector pins of the connector mate with the slots in the pin slot block. A plurality of clamping jaw assemblies are affixed to the left and right support members that are adjustable to selectively grip a calibration template to calibrate the fixture, and thereafter to calibrate the printed wiring assembly that is to be inspected. Left and right indicators contact the pin slot block adjacent the respective support members along the centerline of the pin slot block, and are zeroed using the calibration template. After calibration, the indicators are used to measure the relative deviation of the centerline of the edge connector with respect to the card guides, which determines the deviation in parallelism between respective card guides and the centerline of the edge connector, whose centerline is designed to be coplanar with the respective centerlines of the card guides.

    Abstract translation: 用于确定印刷线路组件相对于其边缘连接器的共面性的共平面检查夹具。 夹具测量印刷线路组件的相应卡片导轨和边缘连接器的中心线之间的平行度偏差。 固定装置包括框架,固定在框架上的直线轴承块,设置在直线轴承座上方的旋转轴承块,以及固定在旋转轴承座上的销槽块。 销槽块包括用于接收边缘连接器的销的行的多个槽。 左和右支撑构件垂直设置在框架上,用于引导和对准卡引导件,使得连接器的多排连接器针与插槽槽中的槽配合。 多个夹钳组件固定到左和右支撑构件上,所述左和右支撑构件可调节以选择性地夹持校准模板以校准夹具,并且此后校准要检查的印刷线路组件。 左右指示器沿着针槽插槽块的中心线与相应的支撑构件相邻的针槽插槽接触,并使用校准模板进行归零。 在校准之后,指示器用于测量边缘连接器相对于卡引导件的中心线的相对偏差,其确定相应卡片引导件与边缘连接器的中心线之间并联的偏差,其中心线被设计为 与卡片指南的相应中心线共面。

    Virtual two gauge profile system
    10.
    发明授权
    Virtual two gauge profile system 失效
    虚拟二量规简介系统

    公开(公告)号:US5388341A

    公开(公告)日:1995-02-14

    申请号:US102055

    申请日:1993-08-04

    Applicant: Bipin Patel

    Inventor: Bipin Patel

    CPC classification number: G01B7/345 B21B38/02 G01B7/28

    Abstract: A method and system for measuring a profile of a strip of material produced in a reversing mill in which a direction of travel of the strip is reversible includes a single thickness gauge that measures the thickness of the strip and generates the thickness signals, and a moving device coupled to the gauge. The moving device controllably moves the gauge transversely to the strip so that the gauge measures the thickness of the strip and different points across a width of the strip in one pass of the strip through the gauge. The moving device maintains the gauge in a stationary position in another pass of the strip through the gauge such that the gauge measures the thickness of the strip and different points along the longitudinal lines of the strip. The measurements of the thickness of the strip at the different points are interpreted into profile data. This profile data can be either displayed or used by a mill computer to control the processing of the strip.

    Abstract translation: 用于测量在反向轧机中生产的材料条的轮廓的方法和系统,其中条带的行进方向是可逆的,包括测量条的厚度并产生厚度信号的单个厚度计,并且移动 耦合到量规的装置。 移动装置可控制地横向移动该标尺,使得该标尺测量条带的厚度以及穿过条带的一次通过条带宽度上的不同点。 移动装置将条带保持在固定位置,在条带的另一遍中穿过测量计,使得该测量仪测量条带的厚度和沿条带的纵向线的不同点。 在不同点的条带的厚度测量被解释为轮廓数据。 该配置文件数据可以由铣床计算机显示或使用,以控制条带的处理。

Patent Agency Ranking