公开(公告)号：US08039759B2

公开(公告)日：2011-10-18

申请号：US11808298

申请日：2007-06-08

申请人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

公开(公告)号：US20080236878A1

公开(公告)日：2008-10-02

申请号：US12076989

申请日：2008-03-26

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

IPC分类号： H05K1/18 ,  H01G4/10 ,  H01G7/00

CPC分类号： H05K1/162 ,  H01G4/105 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/435

摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

摘要翻译： 提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外，可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

公开(公告)号：US20080158770A1

公开(公告)日：2008-07-03

申请号：US12000125

申请日：2007-12-10

申请人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

发明人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

IPC分类号： H01G4/00 ,  H05K3/30

CPC分类号： H05K1/162 ,  H01G4/005 ,  H01G4/33 ,  H05K3/046 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2203/016 ,  H05K2203/0528 ,  H05K2203/0537 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.

摘要翻译： 一种制造嵌入薄膜电容器的电路板的方法，所述方法包括：在第一基板上形成牺牲层; 在所述牺牲层上形成介电层; 在所述电介质层上形成第一电极层; 将第一基板设置在第二基板上，使得第一电极层接合到第二基板的顶部; 通过经由所述第一基板将激光束照射到所述牺牲层上来分解所述牺牲层; 将第一基板与第二基板分离; 以及在所述电介质层上形成第二电极层。

公开(公告)号：US07943858B2

公开(公告)日：2011-05-17

申请号：US12076989

申请日：2008-03-26

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/105 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/435

摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

摘要翻译： 提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外，可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

公开(公告)号：US20090223706A1

公开(公告)日：2009-09-10

申请号：US12466841

申请日：2009-05-15

申请人： Jung Won LEE ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won LEE ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K1/16 ,  H01G4/002 ,  H05K3/10

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

摘要翻译： 一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。 在该方法中，在透明基板上形成电介质膜并进行热处理。 在热处理电介质膜上形成第一导电层。 将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。 在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。 此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

公开(公告)号：US20090223045A1

公开(公告)日：2009-09-10

申请号：US12466770

申请日：2009-05-15

申请人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K3/02

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

公开(公告)号：US08049117B2

公开(公告)日：2011-11-01

申请号：US12466841

申请日：2009-05-15

申请人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

摘要翻译： 一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。 在该方法中，在透明基板上形成电介质膜并进行热处理。 在热处理电介质膜上形成第一导电层。 将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。 在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。 此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

公开(公告)号：US07845073B2

公开(公告)日：2010-12-07

申请号：US12000125

申请日：2007-12-10

申请人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

发明人： In Hyung Lee ,  Yul Kyo Chung ,  Bae Kyun Kim ,  Seung Eun Lee ,  Jung Won Lee

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/162 ,  H01G4/005 ,  H01G4/33 ,  H05K3/046 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2203/016 ,  H05K2203/0528 ,  H05K2203/0537 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.

摘要翻译： 一种制造嵌入薄膜电容器的电路板的方法，所述方法包括：在第一基板上形成牺牲层; 在所述牺牲层上形成介电层; 在所述电介质层上形成第一电极层; 将第一基板设置在第二基板上，使得第一电极层接合到第二基板的顶部; 通过经由所述第一基板将激光束照射到所述牺牲层上来分解所述牺牲层; 将第一基板与第二基板分离; 以及在所述电介质层上形成第二电极层。

公开(公告)号：US10000695B2

公开(公告)日：2018-06-19

申请号：US14981887

申请日：2015-12-28

申请人： Chan Suk Min ,  Tae Hoon Kim ,  Jong Won Park ,  Ji Ho You ,  Jeong Rok Oh ,  Chul Soo Yoon ,  In Hyung Lee ,  Chi Woo Lee

发明人： Chan Suk Min ,  Tae Hoon Kim ,  Jong Won Park ,  Ji Ho You ,  Jeong Rok Oh ,  Chul Soo Yoon ,  In Hyung Lee ,  Chi Woo Lee

IPC分类号： C09K11/61 ,  C09K11/02 ,  B08B3/12 ,  B05D1/18 ,  H01L33/00

CPC分类号： C09K11/617 ,  C09K11/025 ,  H01L33/00 ,  H01L33/502 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  Y02B20/181 ,  H01L2924/00012

摘要： A method of manufacturing a fluoride phosphor, the method comprising: preparing a hydrofluoric (HF) solution in which a first source material and a fluoride containing Mn4+ are dissolved; and forming fluoride particles by introducing a second source material to the HF solution in each of a plurality of instances.

公开(公告)号：US20130021268A1

公开(公告)日：2013-01-24

申请号：US13252755

申请日：2011-10-04

申请人： Woo Jin Lee ,  Sang Su Hong ,  Jae Hun Kim ,  Chung Mo Yang ,  In Hyung Lee ,  Seul Gi Kim ,  Young Woo Lee

发明人： Woo Jin Lee ,  Sang Su Hong ,  Jae Hun Kim ,  Chung Mo Yang ,  In Hyung Lee ,  Seul Gi Kim ,  Young Woo Lee

IPC分类号： G06F3/041

CPC分类号： G06F3/0416 ,  G06F3/044 ,  G06F3/045

摘要： Disclosed herein is a touch panel, including: a base substrate divided into an active area, a bezel area surrounding the active area, and a connection area provided outside the bezel area; sensing electrodes formed in the active area; and electrode wirings connected to the sensing electrodes and extended to the connecting area. Here, a predetermined portion of the base substrate is cut and the connection area is folded by using the predetermined portion as a boundary line such that the connection area is protruded outwardly from the base substrate. According to the present invention, the connection area is provided in the base substrate in a single body, thereby allowing omission of separate flexible printed cables, and thus, an attaching process of the flexible printed cable can also be omitted.

摘要翻译： 这里公开了一种触摸面板，包括：分为活动区域的基底基板，围绕有源区域的边框区域和设置在边框区域外部的连接区域; 形成在有源区中的感测电极; 和连接到感测电极并延伸到连接区域的电极配线。 这里，通过使用预定部分作为边界线，将基底基板的预定部分切割并且连接区域被折叠，使得连接区域从基底基板向外突出。 根据本发明，连接区域设置在单个主体中的基底基板中，从而可以省略单独的柔性印刷电缆，因此也可以省略柔性印刷电缆的连接过程。