-
公开(公告)号:US20080192543A1
公开(公告)日:2008-08-14
申请号:US11673771
申请日:2007-02-12
申请人: Jungwon Kim , Jiho Kim , Changduk Kim
发明人: Jungwon Kim , Jiho Kim , Changduk Kim
IPC分类号: G11C16/06
CPC分类号: G11C29/24 , G11C29/808 , G11C29/812
摘要: In a semiconductor memory which comprises a main memory array, redundant memory cells, and a plurality of repair fuse boxes, a method of selecting redundant memory cells in relation to repair fuse boxes, comprising testing redundant memory cells to determine whether they are valid or defective, and making a selection of redundant memory cells which allocates valid redundant memory cells to respective repair fuse boxes but which does not allocate defective redundant memory cells to any repair fuse boxes.
摘要翻译: 在包括主存储器阵列,冗余存储器单元和多个修复保险丝盒的半导体存储器中,选择与修复保险丝盒相关的冗余存储器单元的方法,包括测试冗余存储器单元以确定它们是有效还是有缺陷 并且选择冗余存储器单元,其将有效的冗余存储器单元分配给相应的修复保险丝盒,但不将有缺陷的冗余存储器单元分配给任何维修保险丝盒。
-
公开(公告)号:USD661437S1
公开(公告)日:2012-06-05
申请号:US29396351
申请日:2011-06-29
申请人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
设计人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
-
公开(公告)号:USD682491S1
公开(公告)日:2013-05-14
申请号:US29396357
申请日:2011-06-29
申请人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
设计人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
-
公开(公告)号:USD658828S1
公开(公告)日:2012-05-01
申请号:US29396341
申请日:2011-06-29
申请人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
设计人: Jae Jun Kim , Dae Kyun Lee , Jiho Kim , Gilock Lee
-
公开(公告)号:US09169762B2
公开(公告)日:2015-10-27
申请号:US13528456
申请日:2012-06-20
申请人: Jiho Kim , Sukil Park , Joungwoo Lee
发明人: Jiho Kim , Sukil Park , Joungwoo Lee
CPC分类号: F01N3/36 , F02M37/22 , F02M2037/226 , Y02T10/20
摘要: A hydro-carbon injection supply unit includes a fuel filter including a damping head which reduces a high fuel pulsation pressure generated in a cylinder head through an inner circulation path along of the fuel, and an HCI part for receiving the fuel discharged from the fuel filter whose pulsation pressure has been reduced and injecting the fuel to an exhaust manifold at a front end of a catalyst. Accordingly, even if a fuel pulsation pressure exceeding a design value is generated in the cylinder head, the HCI part is not influenced at all.
摘要翻译: 水力碳注入供给单元包括燃料过滤器,该燃料过滤器包括阻尼头,该阻尼头通过沿着燃料的内部循环路径减小在气缸盖中产生的高燃料脉动压力;以及HCI部分,用于接收从燃料过滤器排出的燃料 其脉动压力已经降低,并且将燃料喷射到催化剂前端处的排气歧管。 因此,即使在气缸盖中产生超过设计值的燃料脉动压力,也不会完全影响HCl部分。
-
公开(公告)号:US20100237484A1
公开(公告)日:2010-09-23
申请号:US12659391
申请日:2010-03-08
申请人: Chang-Hoon Han , Jiho Kim
发明人: Chang-Hoon Han , Jiho Kim
CPC分类号: H01L23/3128 , H01L21/565 , H01L23/481 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/13099 , H01L2224/16145 , H01L2224/16225 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Provided is a semiconductor package including a first package and a second package. The first package includes a first substrate having a first front side and a first back side opposing the first front side. The first package further includes a first semiconductor chip on the first front side and an external connection member on the first semiconductor chip. The external connection member may be configured to electrically connect the first semiconductor chip to an external device. The second package includes a second substrate having a second back side facing the first back side of the first substrate and a second front surface opposing the second back side. The second package includes a second semiconductor chip on the second front side. The semiconductor package further includes an internal connection member between the first back side and the second back side to electrically connect the first package to the second package.
摘要翻译: 提供了包括第一封装和第二封装的半导体封装。 第一包装包括具有第一前侧和与第一前侧相对的第一后侧的第一基板。 第一封装还包括第一前侧上的第一半导体芯片和第一半导体芯片上的外部连接构件。 外部连接构件可以被配置为将第一半导体芯片电连接到外部设备。 第二包装包括具有面向第一基板的第一后侧的第二后侧和与第二背面相对的第二前表面的第二基板。 第二封装包括在第二正面上的第二半导体芯片。 半导体封装还包括在第一背侧和第二后侧之间的内部连接构件,以将第一封装电连接到第二封装。
-
-
-
-
-