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1.发明授权Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material 有权在倒装芯片流行组件的底部基底中形成穿孔开口以减少底部填充材料渗出的方法公开(公告)号：US09105647B2
公开(公告)日：2015-08-11
申请号：US12781754
申请日：2010-05-17
申请人： Junwei Hu , JaeHak Yee , Lin Tan , Wenbin Qu , YuFeng Feng
发明人： Junwei Hu , JaeHak Yee , Lin Tan , Wenbin Qu , YuFeng Feng
IPC分类号： H01L21/00 , H01L21/56 , H01L25/065 , H01L25/10 , H01L25/00 , H01L23/02 , H01L23/34 , H01L23/28 , H01L23/13 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/30 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/29007 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2224/81805 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device has a flipchip semiconductor die mounted to a first substrate using a plurality of first bumps. An opening or plurality of openings is formed in the first substrate in a location central to placement of the flipchip semiconductor die to the first substrate. A plurality of semiconductor die is mounted to a second substrate. The semiconductor die are electrically connected with bond wires. An encapsulant is over the plurality of semiconductor die and second substrate. The second substrate is mounted to the first substrate with a plurality of second bumps. An underfill material is dispensed through the opening in the first substrate between the flipchip semiconductor die and first substrate. The dispensing of the underfill material is discontinued as the underfill material approaches or reaches a perimeter of the flipchip semiconductor die to reduce bleeding of the underfill material. The underfill material is cured.
摘要翻译： 半导体器件具有使用多个第一凸块安装到第一基板的倒装芯片半导体管芯。 在第一基板中形成开口或多个开口，其中心位置是将倒装芯片半导体管芯放置到第一基板。 多个半导体管芯安装到第二基板。 半导体管芯与接合线电连接。 密封剂在多个半导体管芯和第二衬底之上。 第二基板用多个第二凸块安装到第一基板。 通过第一衬底中的开口在倒装芯片半导体管芯和第一衬底之间分配底部填充材料。 底部填充材料的分配由于底部填充材料接近或到达倒装芯片半导体管芯的周边而停止，以减少底部填充材料的渗出。 底部填充材料固化。
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2.发明申请Semiconductor Device and Method of Forming Perforated Opening in Bottom Substrate of Flipchip POP Assembly to Reduce Bleeding of Underfill Material 有权半导体装置及倒装芯片POP组件下底板穿孔的方法，以减少底层填充材料的渗出公开(公告)号：US20110278712A1
公开(公告)日：2011-11-17
申请号：US12781754
申请日：2010-05-17
申请人： Junwei Hu , JaeHak Yee , Lin Tan , Wenbin Qu , YuFeng Feng
发明人： Junwei Hu , JaeHak Yee , Lin Tan , Wenbin Qu , YuFeng Feng
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/30 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/29007 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2224/81805 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device has a flipchip semiconductor die mounted to a first substrate using a plurality of first bumps. An opening or plurality of openings is formed in the first substrate in a location central to placement of the flipchip semiconductor die to the first substrate. A plurality of semiconductor die is mounted to a second substrate. The semiconductor die are electrically connected with bond wires. An encapsulant is over the plurality of semiconductor die and second substrate. The second substrate is mounted to the first substrate with a plurality of second bumps. An underfill material is dispensed through the opening in the first substrate between the flipchip semiconductor die and first substrate. The dispensing of the underfill material is discontinued as the underfill material approaches or reaches a perimeter of the flipchip semiconductor die to reduce bleeding of the underfill material. The underfill material is cured.
摘要翻译： 半导体器件具有使用多个第一凸块安装到第一基板的倒装芯片半导体管芯。 在第一基板中形成开口或多个开口，其中心位置是将倒装芯片半导体管芯放置到第一基板。 多个半导体管芯安装到第二基板。 半导体管芯与接合线电连接。 密封剂在多个半导体管芯和第二衬底之上。 第二基板用多个第二凸块安装到第一基板。 通过第一衬底中的开口在倒装芯片半导体管芯和第一衬底之间分配底部填充材料。 底部填充材料的分配由于底部填充材料接近或到达倒装芯片半导体管芯的周边而停止，以减少底部填充材料的渗出。 底部填充材料固化。
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