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    Low particle gas enclosure systems and methods
    2.
    发明授权
    Low particle gas enclosure systems and methods 有权

    公开(公告)号：US10434804B2

    公开(公告)日：2019-10-08

    申请号：US14275637

    申请日：2014-05-12

    Applicant: Kateeva, Inc.

    Inventor： Justin Mauck ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky ,  Shandon Alderson ,  Alexey Stepanov

    IPC: B05C15/00 ,  B41J29/02 ,  H01L51/56 ,  B41J29/13

    Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.

    Ink delivery systems and methods
    3.
    发明授权
    Ink delivery systems and methods 有权

    公开(公告)号：US10434782B2

    公开(公告)日：2019-10-08

    申请号：US16025999

    申请日：2018-07-02

    Applicant: Kateeva, Inc.

    Inventor： Alexander Sou-Kang Ko ,  Stephen Mark Smith ,  Shandon Alderson

    IPC: B41J2/175 ,  B41J29/02 ,  B41J2/165 ,  B41J29/13

    Abstract: The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a bulk ink delivery system that can be external to a gas enclosure. A bulk ink delivery system according to the present teachings can supply ink to a local ink delivery system that is internal to the gas enclosure. Various embodiments of a local ink delivery system of the present teachings can be proximal to a printhead device assembly, and can include a two-stage ink supply having a local ink replenishment reservoir that is configured to supply a local ink dispensing reservoir to a constant volume. According to the present teachings, a local ink dispensing reservoir can be in flow communication with a plurality of printhead devices. As such, a two-stage local ink delivery system maintaining a constant volume in a local ink dispensing reservoir can provide constant head pressure to the plurality of printhead devices.

    Printing System Assemblies and Methods
    4.
    发明申请
    Printing System Assemblies and Methods 审中-公开

    公开(公告)号：US20190270325A1

    公开(公告)日：2019-09-05

    申请号：US16416523

    申请日：2019-05-20

    Applicant: Kateeva, Inc.

    Inventor： Robert B. Lowrance ,  Alexander Sou-Kang Ko ,  Justin Mauck ,  Eliyahu Vronsky ,  Aleksey Khrustalev ,  Karl Mathia ,  Shandon Alderson

    IPC: B41J29/02 ,  B41J25/304 ,  B41J11/06 ,  B41J3/407 ,  B41J3/28

    Abstract: The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors.

    Printing system assemblies and methods
    7.
    发明授权
    Printing system assemblies and methods 有权
    打印系统组件和方法

    公开(公告)号：US09505245B2

    公开(公告)日：2016-11-29

    申请号：US14738785

    申请日：2015-06-12

    Applicant: Kateeva, Inc.

    Inventor： Robert B. Lowrance ,  Alexander Sou-Kang Ko ,  Justin Mauck ,  Eliyahu Vronsky ,  Aleksey Khrustalev ,  Karl Mathia ,  Shandon Alderson

    IPC: B41F35/00 ,  B41J11/06 ,  B41J3/28 ,  B41J3/407 ,  H01L51/56

    CPC classification number: B41J29/02 ,  B41J3/28 ,  B41J3/407 ,  B41J11/06 ,  B41J25/304 ,  H01L51/56

    Abstract: The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors. Additionally, various embodiments of a Y-axis motion system of the present teachings can include a gripper motion control assembly of a Y-axis motion system configured to provide dynamic orientation of the rotation of a substrate about the theta-Z (θ-Z) axis during Y-axis travel to maintain a high degree of precision for substrate orientation parallel to the axis of travel.

    Abstract translation: 本教导公开了用于印刷衬底的打印系统的各种实施例，其中打印系统可以容纳在气体外壳中，其中外壳内的环境可以被保持为受控打印环境。 本教导的受控环境可以包括控制气体外壳内的气体环境类型，外壳内的尺寸和级别的颗粒物质，控制外壳内的温度和控制照明。 本教导的打印系统的各种实施例可以包括Y轴运动系统和Z轴移动板，其被配置为通过例如消除或基本上最小化常规的使用来大大减少外壳内的过多热负荷 电动机。 另外，本教导的Y轴运动系统的各种实施例可以包括Y轴运动系统的夹持器运动控制组件，其构造成提供围绕θ-Z（θ-Z）的衬底的旋转的动态取向， 在保持Y轴行进时的轴线保持高度的准确性，以便平行于行进轴线的基板定向。

    Gas enclosure assembly and system
    8.
    发明授权
    Gas enclosure assembly and system 有权
    气体罩组件和系统

    公开(公告)号：US09048344B2

    公开(公告)日：2015-06-02

    申请号：US13802304

    申请日：2013-03-13

    Applicant: KATEEVA, INC.

    Inventor： Justin Mauck ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky ,  Shandon Alderson

    IPC: B05C11/00 ,  C23C14/00 ,  H01L33/00 ,  H01L21/67 ,  F24F3/16

    CPC classification number: B41J29/377 ,  B41J2/16508 ,  B41J2/1652 ,  B41J2/16523 ,  B41J2/16535 ,  B41J29/13 ,  B41J29/17 ,  F24F3/1607 ,  H01L21/6719 ,  H01L33/005 ,  H01L51/0005 ,  H01L51/0029 ,  H01L51/56 ,  H01L2924/0002 ,  Y10T29/49718 ,  H01L2924/00

    Abstract: The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

    Abstract translation: 本教导涉及密封的气体封闭组件和系统的各种实施例，其可以容易地运输和组装，并且提供保持最小的惰性气体体积和最大限度地接近其中封闭的各种装置和装置。 本发明的密封气体封闭组件和系统的各种实施例可以具有以最小化气体外壳组件的内部容积的方式构造的气体外壳组件，同时优化工作空间以适应各种各样的 各种OLED打印系统的脚印。 如此构造的气体外壳组件的各种实施例另外在处理期间从外部提供便利地进入气体外壳组件的内部，并且容易地进入内部进行维护，同时最小化停机时间。

    Low Particle Gas Enclosure Systems and Methods
    9.
    发明申请
    Low Particle Gas Enclosure Systems and Methods 审中-公开
    低颗粒气体封闭系统和方法

    公开(公告)号：US20140290567A1

    公开(公告)日：2014-10-02

    申请号：US14275637

    申请日：2014-05-12

    Applicant: Kateeva, Inc.

    Inventor： Justin Mauck ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky ,  Shandon Alderson ,  Alexey Stepanov

    IPC: B05C15/00

    CPC classification number: B41J29/02 ,  B05C15/00 ,  B41J29/13 ,  H01L51/56

    Abstract: The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.

    Abstract translation: 本教导涉及一种气体封闭系统的各种实施方案，其可以具有各种组分，其包含可提供靠近基底的低颗粒区域的颗粒控制系统。 颗粒控制系统的各种组件可以包括气体循环和过滤系统，用于相对于基板移动打印头组件的低颗粒生成运动系统，服务束壳体排气系统和打印头组件排气系统。 除了为各种各种各样的各种反应性物质（包括各种活性大气气体，例如水蒸汽和氧气）维持基本上低的水平，对于具有颗粒控制系统的气体封闭系统的各种实施方案，基板上颗粒规格可以 很容易遇到 因此，根据本教导的系统和方法在惰性，低颗粒气体环境中处理各种基底可以具有基本上较低的制造缺陷。

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