-
公开(公告)号：US11432448B2
公开(公告)日：2022-08-30
申请号：US16903979
申请日：2020-06-17
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , John Bultitude
IPC: H05K13/04 , H05K3/30 , H05K7/12 , H01G4/232 , H01C1/01 , H01G2/06 , H01C13/02 , H01G4/38 , H01C1/14 , H05K3/34 , H05K1/02 , H01G4/30 , H01C7/00
Abstract: A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
-
公开(公告)号：US10224149B2
公开(公告)日：2019-03-05
申请号：US15264305
申请日：2016-09-13
Applicant: KEMET Electronics Corporation
Inventor： Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
IPC: H01G4/38 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/30 , H01G4/40 , H01L23/48 , H01L23/52 , H05K1/18
Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.
-
公开(公告)号：US10068707B2
公开(公告)日：2018-09-04
申请号：US14925056
申请日：2015-10-28
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
IPC: H01G4/228 , H01G4/30 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/232 , H01G4/008 , H01G4/12 , H01G4/38 , B23K101/42 , B23K101/40
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
-
公开(公告)号：US20170169956A1
公开(公告)日：2017-06-15
申请号：US15264305
申请日：2016-09-13
Applicant: KEMET Electronics Corporation
Inventor： Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
CPC classification number: H01G4/38 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/2325 , H01G4/30 , H01G4/40 , H01L23/48 , H01L23/52
Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.
-
5.发明申请公开(公告)号：US20160254097A1
公开(公告)日：2016-09-01
申请号：US15149309
申请日：2016-05-09
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude
CPC classification number: H01G9/0032 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/286 , B23K35/3613 , B23K2101/42 , H01G4/005 , H01G4/2325 , H01G4/30 , H01G9/0029 , H01G9/008 , H01G9/045 , H01G9/07 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , Y10T29/435 , H01L2924/00
Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
Abstract translation: 提供了一种用于形成电容器的改进方法，如通过该方法形成的电容器或电气部件。 该方法包括在其上提供含铝阳极的氧化铝电介质; 在所述氧化铝电介质的第一部分上形成阴极; 通过瞬态液相烧结导电材料将阳极引线连接到氧化铝的第二部分上的铝阳极，从而将铝阳极冶金地结合到阳极引线; 以及将阴极引线接合到所述阴极。
-
Patent Agency Ranking
公开(公告)号：US20160071650A1
公开(公告)日：2016-03-10
申请号：US14925056
申请日：2015-10-28
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
CPC classification number: H01G4/228 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
Abstract translation: 提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。 第一电极在第一侧和第二电极的第二侧终止。 第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。
-
公开(公告)号：US20230038175A1
公开(公告)日：2023-02-09
申请号：US17968567
申请日：2022-10-18
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , John Bultitude , Allen Templeton
Abstract: Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.
-
公开(公告)号：US11227719B2
公开(公告)日：2022-01-18
申请号：US15909735
申请日：2018-03-01
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Garry L Renner , John Bultitude , Allen Hill
IPC: B23K1/00 , H01G4/30 , H01G4/232 , H01G4/38 , B23K1/005 , B23K1/008 , H01G4/228 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/008 , H01G4/12 , B23K101/40 , B23K101/42
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
-
公开(公告)号：US20200323112A1
公开(公告)日：2020-10-08
申请号：US16903979
申请日：2020-06-17
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , John Bultitude
IPC: H05K13/04 , H05K3/30 , H05K7/12 , H01G4/232 , H01C1/01 , H01G2/06 , H01C13/02 , H01G4/38 , H01C1/14 , H05K3/34
Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
-
公开(公告)号：US10757810B2
公开(公告)日：2020-08-25
申请号：US16195346
申请日：2018-11-19
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Galen Miller , John E. McConnell
IPC: H05K1/18 , H05K3/30 , H01L23/498 , H05K3/34
Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
-
-
-
-
-
-
-
-
-
Search Results
38
records
(took 0.021 seconds)
