Thermoplastic resin, molded product, film, and layered product

    公开(公告)号:US10858488B2

    公开(公告)日:2020-12-08

    申请号:US16098365

    申请日:2017-05-24

    Abstract: Provided is a thermoplastic resin composition that can be firmly bonded to an adherend with an active energy ray-curable adhesive provided therebetween, and provided are a molded product and a film each including such a thermoplastic resin composition. Also provided are a thermoplastic resin composition that is less likely to be whitened even when the adhesive permeates thereinto and a molded product and a film each including such a thermoplastic resin composition. The thermoplastic resin composition according to the present disclosure contains 70 to 95 mass % of a thermoplastic resin and 5 to 30 mass % of a multilayer structure polymer (C) having a multilayer particle structure, and the multilayer structure polymer (C) has a median diameter Da of no less than 200 nm and less than 500 nm when the median diameter Da is measured through a laser diffraction/scattering technique with the thermoplastic resin composition dissolved in acetone.

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