公开(公告)号：US20150000970A1

公开(公告)日：2015-01-01

申请号：US14317538

申请日：2014-06-27

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Masakazu IINO ,  Teruya FUJISAKI ,  Takafumi OYOSHI

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2924/15313 ,  H05K1/113 ,  H05K1/181 ,  H05K3/4069 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10734

Abstract: A wiring board includes an insulating layer having a lower layer conductor on a lower surface thereof, a plurality of semiconductor element connection pads arranged in a lattice pattern in a semiconductor element mounting portion 1a having a quadrangular shape on the insulating layer, a via hole formed in the insulating layer below each of the semiconductor element connection pads, and a via conductor filled in the via hole and formed integrally with each of the semiconductor element connection pads. The wiring board includes a reinforcing via hole formed in the insulating layer in an outer region outside an arrangement region of the semiconductor element connection pads in corner portions of the semiconductor element mounting portion, and a reinforcing via conductor formed in the reinforcing via hole.

Abstract translation: 布线基板包括在其下表面具有下层导体的绝缘层，在绝缘层上具有四边形形状的半导体元件安装部分1a中以格子状布置的多个半导体元件连接焊盘，形成通孔 在每个半导体元件连接焊盘之下的绝缘层中，以及填充在通孔中并与每个半导体元件连接焊盘一体形成的通孔导体。 布线基板包括形成在半导体元件安装部的角部的半导体元件连接焊盘的配置区域的外侧的外部区域的绝缘层中的增强通孔，以及形成在加强型通孔中的加强型通路导体。

公开(公告)号：US20140116762A1

公开(公告)日：2014-05-01

申请号：US14060475

申请日：2013-10-22

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Takafumi OYOSHI

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K1/113 ,  H05K1/115 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/09227 ,  H05K2201/09709

Abstract: A wiring board includes a rectangular mount region surrounded by four sides circumscribed to pads located in an outer peripheral area among a plurality of pads arranged in a substantially matrix form, a corner pad close to a corner of the mount region, and a second via-conductor and a second corner via-conductor electrically connected to the corner pad via a first via-conductor and a first wiring conductor. In the wiring board, a distance in a plane direction between the second corner via-conductor and a center of the mount region is smaller than a distance in the plane direction between the corner pad and the center of the mount region.

Abstract translation: 布线基板包括由四个侧面包围的矩形安装区域，所述矩形安装区域围绕位于布置成基本矩阵形式的多个焊盘之间的外围区域中的焊盘，靠近安装区域的角部的角焊盘，以及第二通孔 - 导体和通过第一通孔导体和第一布线导体电连接到拐角垫的第二角通孔导体。 在布线板中，第二角通孔导体与安装区域的中心之间的平面方向的距离小于角垫与安装区域的中心之间的平面方向的距离。