MESO-SIZED CAPSULES USEFUL FOR THE DELIVERY OF AGRICULTURAL CHEMICALS
    6.
    发明申请
    MESO-SIZED CAPSULES USEFUL FOR THE DELIVERY OF AGRICULTURAL CHEMICALS 有权
    适用于农业化学品交付的MESO-SIZED CAPSULES

    公开(公告)号:US20110045975A1

    公开(公告)日:2011-02-24

    申请号:US12850676

    申请日:2010-08-05

    摘要: Various aspects disclosed herein disclose mesocapsules that include active ingredients such as agriculturally active ingredients including various fungicides, insecticides, miticides, herbicides, safeners and modifiers of plant physiology or structure. These mesocapsules are comprised of a polyurea shell and include hydrophilic groups on their surfaces. These mesocapsules have a volume-average diameter of about 500 nm or less and some of them have a volume-average diameter on the order of about 300 nm or less. These mesocapsules are especially well suited for delivering active ingredients that are not very soluble in water, many of these compounds have solubility values in the range of 1,000 ppm or less. Methods for making these mesocapsules include interfacial polycondensation reactions carried out in the presence of surfactants such as sodium dodecyl sulfate and another method in which all or most of the surfactant is replaced by adding amino acids to the aqueous phase of the interfacial reaction mixture before forming the final emulsion.

    摘要翻译: 本文公开的各个方面公开了包括活性成分例如农业活性成分(包括各种杀真菌剂,杀虫剂,杀螨剂,除草剂,安全剂和植物生理学或结构的改性剂)的中间胶囊。 这些中间胶囊由聚脲壳组成并且在其表面上包括亲水基团。 这些中间体具有约500nm或更小的体积平均直径,并且它们中的一些具有约300nm或更小量级的体积平均直径。 这些中间胶特别适用于递送不太可溶于水的活性成分,这些化合物中的许多具有在1,000ppm或更低的范围内的溶解度值。 制备这些中间胶囊的方法包括在表面活性剂如十二烷基硫酸钠存在下进行的界面缩聚反应,以及在形成所述界面反应混合物的水相之前通过向界面反应混合物的水相中加入氨基酸来代替所有或大部分表面活性剂的方法 最终乳液。

    NANOPOROUS PARTICLES IN A HOLLOW LATEX MATRIX
    7.
    发明申请
    NANOPOROUS PARTICLES IN A HOLLOW LATEX MATRIX 有权
    中性粒子中的纳米粒子

    公开(公告)号:US20130224464A1

    公开(公告)日:2013-08-29

    申请号:US13879522

    申请日:2010-11-15

    IPC分类号: C08K7/26

    摘要: Prepare an article of manufacture by providing a latex of hollow latex particles with a rigid inner shell and adhesive outer shell, providing nanoporous particles and dispersing them into the latex and drying the latex so as to cause the hollow latex particle to bind to one another and form an article of manufacture containing nanoporous particles and hollow latex particles wherein the hollow latex particles are bound directly to one another to form a continuous matrix and the nanoporous particles are dispersed within the continuous matrix of hollow latex particles.

    摘要翻译: 通过提供具有刚性内壳和粘合剂外壳的中空胶乳颗粒的胶乳来制备制品,提供纳米多孔颗粒并将其分散在胶乳中并干燥胶乳,以使中空胶乳颗粒彼此结合, 形成包含纳米多孔颗粒和中空胶乳颗粒的制品,其中中空胶乳颗粒彼此直接结合以形成连续基质,并且纳米多孔颗粒分散在中空胶乳颗粒的连续基体内。

    Stable, concentratable chemical mechanical polishing composition and methods relating thereto
    9.
    发明授权
    Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权
    稳定,可浓缩的化学机械抛光组合物及其相关方法

    公开(公告)号:US08435896B2

    公开(公告)日:2013-05-07

    申请号:US13039723

    申请日:2011-03-03

    IPC分类号: H01L21/302 H01L21/461

    CPC分类号: H01L21/3212 C09G1/16

    摘要: A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

    摘要翻译: 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物,包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 水溶性纤维素; 任选地,非糖水溶性聚合物; 任选地,式I的水溶性酸化合物,其中R选自氢和C 1-5烷基,并且其中x是1或2; 任选地,络合剂; 任选地,氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外,提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法,包括:提供基材,其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸,氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。