摘要:
According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines.
摘要:
According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines.
摘要:
According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines.
摘要:
According to one embodiment, a NAND type flash memory includes a first transfer transistor disposed between first and second memory planes, the first potential transfer terminal of the first transfer transistor being commonly connected to a first word line in the first NAND block and a second word line in the third NAND block, a second transfer transistor disposed at a first end of the first memory plane, the first potential transfer terminal of the second transfer transistor being connected to a third word line in the second NAND block, and a third transfer transistor disposed at a second end of the second memory plane, the first potential transfer terminal of the third transfer transistor being connected to a fourth word line in the fourth NAND block.
摘要:
According to one embodiment, a NAND type flash memory includes a first transfer transistor disposed between first and second memory planes, the first potential transfer terminal of the first transfer transistor being commonly connected to a first word line in the first NAND block and a second word line in the third NAND block, a second transfer transistor disposed at a first end of the first memory plane, the first potential transfer terminal of the second transfer transistor being connected to a third word line in the second NAND block, and a third transfer transistor disposed at a second end of the second memory plane, the first potential transfer terminal of the third transfer transistor being connected to a fourth word line in the fourth NAND block.
摘要:
A semiconductor memory device, in which interference between adjoining cells can be reduced and an expansion of a chip area can be suppressed, comprising: a memory cell array in which plural memory cells connected to plural word lines and plural bit lines are disposed in a matrix form; sense amplifiers each of which is to be connected to each of the bit lines; a control circuit which controls voltages of the word lines and the bit lines, and programs data into the memory cells or reads data from the memory cells; wherein the plural bit lines include at least a first, a second, a third and a fourth bit lines adjoining to each other, and the sense amplifiers include at least a first and a second sense amplifiers, a first and a fourth selection transistors which are provided between the first and the fourth bit lines and the first sense amplifier, and connect the first and the fourth bit lines to the first sense amplifier; and a second and a third selection transistors which are provided between the second and the third bit lines and the second sense amplifier, and connect the second and the third bit lines to the second sense amplifier.
摘要:
A semiconductor memory device includes memory cell transistors, a first selection transistor, and word lines. Each of the memory cell transistors has a stacked gate including a charge accumulation layer and a control gate, and is configured to retain at least two levels of “0” data and “1” data according to a threshold voltage. The threshold voltage corresponding to the “0” data being the lowest threshold voltage in the levels retained by each of the memory cell transistors. The first selection transistor has a current path connected in series to one of the memory cell transistors. Each of the word lines is connected to the control gate of one of the memory cell transistors. upper limit values of threshold voltages of the memory cell transistors retaining the “0” data being different from one another in each word line.
摘要:
A semiconductor integrated circuit device includes dynamic latches, switch circuit, capacitor, first static latch, and first transfer gate. In refreshing data of the dynamic latches, data stored in the first static latch is moved to the second node through the first transfer gate and saved. The data of the dynamic latch is bootstrapped. The bootstrapped data is transferred to the first node to distribute charges, thereby setting the potential of the first node. The set potential is written back to the dynamic latch to refresh it. The saved data of the second node is moved to the first node through the first transfer gate and written back to the first static latch.
摘要:
A semiconductor memory device, in which interference between adjoining cells can be reduced and an expansion of a chip area can be suppressed, comprising: a memory cell array in which plural memory cells connected to plural word lines and plural bit lines are disposed in a matrix form; sense amplifiers each of which is to be connected to each of the bit lines; a control circuit which controls voltages of the word lines and the bit lines, and programs data into the memory cells or reads data from the memory cells; wherein the plural bit lines include at least a first, a second, a third and a fourth bit lines adjoining to each other, and the sense amplifiers include at least a first and a second sense amplifiers, a first and a fourth selection transistors which are provided between the first and the fourth bit lines and the first sense amplifier, and connect the first and the fourth bit lines to the first sense amplifier; and a second and a third selection transistors which are provided between the second and the third bit lines and the second sense amplifier, and connect the second and the third bit lines to the second sense amplifier.
摘要:
A write controller performs verification for checking whether each memory cell is on a predetermined verification level. For a memory cell to be written to a voltage level higher than the predetermined verification level, the write controller stores, in first and second latch circuits, the number of times of write to be performed by a write voltage after the verification. Whenever write is performed by the write voltage, the write controller updates the number of times of write stored in the first and second latch circuits. After write is performed the number of times of write by the write voltage, the write controller performs write by an intermediate voltage lower than the write voltage.