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1.发明申请Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus 失效相机模块，相机模块的制造方法，电子设备和电子设备的制造方法公开(公告)号：US20050129384A1
公开(公告)日：2005-06-16
申请号：US11003340
申请日：2004-12-06
IPC分类号： G02B7/02 , G02B6/00 , G02B7/04 , G03B17/02 , G03B17/14 , H01L27/14 , H04N5/225 , H04N5/232 , H04N5/335
CPC分类号： H04N5/2254
摘要： An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.
摘要翻译： 光学结构设置在器件基板的表面上，并且将外部光引入固态图像拾取器件的透镜系统放置在光学结构的中心。 从透镜系统的光入射侧观察的光学结构的外形为矩形，其平面形状形成矩形框架部。 中间结构设置在器件基板和光学结构之间。 中间结构具有用于将光学结构装配在框架部分的侧面的一部分中的装配部分。
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2.发明授权Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus 失效相机模块，相机模块的制造方法，电子设备和电子设备的制造方法公开(公告)号：US07619684B2
公开(公告)日：2009-11-17
申请号：US11003340
申请日：2004-12-06
申请人： Katsuitsu Nishida , Tohru Shigeta , Hidetoshi Nishimura , Yoshinori Tanida , Naoki Sekiguchi , Morimasa Yoshie
发明人： Katsuitsu Nishida , Tohru Shigeta , Hidetoshi Nishimura , Yoshinori Tanida , Naoki Sekiguchi , Morimasa Yoshie
CPC分类号： H04N5/2254
摘要： An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.
摘要翻译： 光学结构设置在器件基板的表面上，并且将外部光引入固态图像拾取器件的透镜系统放置在光学结构的中心。 从透镜系统的光入射侧观察的光学结构的外形为矩形，其平面形状形成矩形框架部。 中间结构设置在器件基板和光学结构之间。 中间结构具有用于将光学结构装配在框架部分的侧面的一部分中的装配部分。
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3.发明申请公开(公告)号：US20090147115A1
公开(公告)日：2009-06-11
申请号：US12313864
申请日：2008-11-25
CPC分类号： H04N5/2253 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/16151 , H01L2924/16152 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： In accordance with the present invention of the solid-state image pickup device 100, a holder 31 is mounted along outer edge portion of the board 1 in such a manner that the holder 31 is mounted on a board 1 and on chip components 7 that are arranged on the outer edge portion of the board 1. The downsized solid-state image pickup device 100 can be attained hereby.
摘要翻译： 根据本发明的固态图像拾取装置100，保持器31沿着板1的外边缘部分安装，使得保持器31安装在板1和片上部件7上 布置在板1的外边缘部分上。可以实现小型化的固态图像拾取装置100。
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公开(公告)号：US08531596B2
公开(公告)日：2013-09-10
申请号：US12449636
申请日：2008-02-05
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N1/00307 , H04N5/2252 , H04N5/2254 , H04N2007/145
摘要： A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.
摘要翻译： 相机装置（100）包括：第一壳体（1），包括透镜部分（10）; 包括图像拾取部分（20）的第二壳体（2）; 以及连接第一和第二壳体（1）和（2）的连接部分（3）。 在图像拾取期间，通过暴露在第一壳体（1）中的透镜保持器（12）的底表面和暴露在第一壳体（1）中的透明盖部分（25）的顶表面之间的接触来指定焦距 第二房（2）。 这允许实现其中以高精度指定焦距的相机装置。
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公开(公告)号：US07139473B2
公开(公告)日：2006-11-21
申请号：US10789363
申请日：2004-02-26
CPC分类号： H04N7/142 , H04M1/0214 , H04M1/0264 , H04N1/2104 , H04N5/2251 , H04N5/2252 , H04N5/2254 , H04N2007/145
摘要： There are provided a first casing 100A that has a photosensor section 113 for capturing an image, a second casing 100B that has a lens section 122 for projecting the image of a subject onto the photosensor section 113 of the first casing 100A and a connection section 100C that foldably connects the first casing 100A with the second casing 100B. The photosensor section 113 and the lens section 122 are arranged so that the photosensor section 113 and the lens section 122 are superposed on each other in a state in which the first casing 100A and the second casing 100B are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.
摘要翻译： 提供了具有用于捕获图像的光电传感器部113的第一壳体100A;具有用于将被摄体的图像投影到第一壳体100A的光电传感器部113的透镜部122的第二壳体100B，以及 连接部分100C，其将第一壳体100A与第二壳体100B可折叠地连接。光电传感器部分113和透镜部分122被布置成使得光电传感器部分113和透镜部分122以 第一壳体100A和第二壳体100B被折叠在一起。 利用这种布置，可以减小配备有该装置的折叠式照相机装置和折叠型便携式电话机的厚度。
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6.发明申请Image capturing device module, manufacturing method of the image capturing device module, and electronic information device 审中-公开图像捕捉装置模块，摄像装置模块的制造方法以及电子信息装置公开(公告)号：US20080278617A1
公开(公告)日：2008-11-13
申请号：US12152155
申请日：2008-05-12
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H01L2224/45144 , H01L2224/48091 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： An image capturing device module is disclosed. The image capturing device module includes an image capturing device provided on a base circuit substrate; a translucent member adhered to the image capturing device with a first adhesive to cover an upper part of an effective pixel region in the image capturing device; a lens body including a lens portion that focuses light into the effective pixel region in the image capturing device and a support portion that is translucent and is provided around the lens portion to expose an upper part of the lens portion; and a non-translucent molding resin that molds the image capturing device, the translucent member, and the lens body, with the upper part of the lens portion being exposed.
摘要翻译： 公开了一种图像捕获装置模块。 图像捕获装置模块包括设置在基底电路基板上的图像捕获装置; 半透明构件，用第一粘合剂附着到图像捕获装置，以覆盖图像捕获装置中的有效像素区域的上部; 透镜体，其包括将光聚焦到图像捕获装置中的有效像素区域中的透镜部分和透明的支撑部分，并且设置在透镜部分周围以露出透镜部分的上部; 以及在透镜部分的上部露出的状态下对摄像装置，透光部件和透镜体进行成型的非半透明模塑树脂。
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公开(公告)号：US20100045855A1
公开(公告)日：2010-02-25
申请号：US12449636
申请日：2008-02-05
CPC分类号： H04N5/2253 , H04N1/00307 , H04N5/2252 , H04N5/2254 , H04N2007/145
摘要： A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.
摘要翻译： 相机装置（100）包括：第一壳体（1），包括透镜部分（10）; 包括图像拾取部分（20）的第二壳体（2）; 以及连接第一和第二壳体（1）和（2）的连接部分（3）。 在图像拾取期间，通过暴露在第一壳体（1）中的透镜保持器（12）的底表面和暴露在第一壳体（1）中的透明盖部分（25）的顶表面之间的接触来指定焦距 第二房（2）。 这允许实现其中以高精度指定焦距的相机装置。
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8.发明申请Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device 审中-公开半导体封装，其制造方法，半导体模块和电子器件公开(公告)号：US20090256229A1
公开(公告)日：2009-10-15
申请号：US12085152
申请日：2006-11-01
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.
摘要翻译： 在本发明的摄像机模块（1）中，透镜构件（20）附接到半导体封装（10）。 半导体封装（10）包括：安装在布线板（13）上的图像传感器（11）; 以及配线基板（13）与图像传感器11电连接的布线15。 图像传感器（11）和线15用模制树脂（14）密封。 在模具树脂（14）的表面的周边周围形成有台阶（18），半导体封装（10）和透镜部件（20）通过嵌合台阶（18）和突起（23）而接合， 的透镜架（22）。 利用这种布置，可以实现允许半导体封装与半导体封装被连接的安装部件之间的高精度对准的小型半导体模块。
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公开(公告)号：US20090020593A1
公开(公告)日：2009-01-22
申请号：US12224296
申请日：2007-01-12
申请人： Kazuo Kinoshita , Katsuitsu Nishida
发明人： Kazuo Kinoshita , Katsuitsu Nishida
CPC分类号： H05K3/3494 , B23K1/012 , B23K2101/40 , H05K3/3442 , H05K2201/10121 , H05K2201/10727 , H05K2203/081 , H05K2203/082 , H05K2203/304
摘要： In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.
摘要翻译： 在制造相机模块结构（100）时，热空气喷嘴（4）通过向焊料连接部分（3）吹入热空气而在焊料连接部分（3）处熔化焊料，同时吸嘴（5）吸热 从相机模块（2）更靠近的位置移动到相机模块（2）的空气比热风喷嘴（4）的位置移动。 这使得可以制造其中耐热脆弱的电子部件可以安装在布线板上而不被热损坏的焊料安装结构。
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10.发明申请Solder Mounting Structure, Manufacturing Method and Apparatus of the Solder Mounting Structure, Electronic Apparatus, and Wiring Board 审中-公开焊接安装结构，焊接安装结构的制造方法和装置，电子设备和接线板公开(公告)号：US20090025972A1
公开(公告)日：2009-01-29
申请号：US12087083
申请日：2006-11-20
申请人： Katsuitsu Nishida , Kazuo Kinoshita
发明人： Katsuitsu Nishida , Kazuo Kinoshita
CPC分类号： H05K3/3494 , H01L2224/81224 , H05K1/141 , H05K3/0058 , H05K3/3442 , H05K2201/0394 , H05K2201/09481 , H05K2201/09781 , H05K2201/10121 , H05K2201/2009 , H05K2201/2054 , H05K2203/0557 , H05K2203/1581 , H05K2203/304
摘要： A camera module structure (100) of the present invention is arranged such that a heat-sensitive camera module (2) is joined to a printed wiring board (1) through solder joint sections (3). The printed wiring board (1) has through holes (11) formed therein and terminals (12) formed thereon so as to close front surface apertures which are formed by the through holes (11) in the mounting surface of the printed wiring board (1). The solder joint sections (3) are provided on the terminals (12), respectively. The solder joint sections (3) are formed by heating by light (heat rays) applied to the rear side of the printed wiring board (1) by way of the terminals (12) on the printed wiring board (1), so that heat is not transmitted to the camera module (2). Accordingly, the camera module structure (100) mounted on the printed wiring board (1) is realized without heat damage to the heat-sensitive camera module (2).
摘要翻译： 本发明的相机模块结构（100）被布置成使得热敏相机模块（2）通过焊接部分（3）接合到印刷线路板（1）。 印刷电路板（1）具有形成在其中的通孔（11）和形成在其上的端子（12），以便封闭由印刷电路板（1）的安装表面中的通孔（11）形成的前表面孔 ）。 焊接部分（3）分别设置在端子（12）上。 通过在印刷电路板（1）上的端子（12）施加到印刷电路板（1）的后侧的光（热射线）加热形成焊接部分（3），使得热量 不发送到相机模块（2）。 因此，安装在印刷电路板（1）上的相机模块结构（100）实现为对热敏相机模块（2）的热损伤。
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