摘要:
Provided is a method of manufacturing a magnetic head with which bonding of a slider and a suspension can be performed by taking an ABS pattern, which determines flying characteristics, as a reference, with no special fabrication required on the slider or the suspension. The method relates to a method of manufacturing a magnetic head for attaching a slider, on which an air bearing surface (ABS) is formed, to a suspension. A surface of the slider on which the ABS is formed is photographed, and the ABS and an engraved region formed within the ABS are identified from the photographed image. Then, a reference that serves as a guide in attaching the suspension is computed, and the slider is attached to the suspension based on the reference. It thus becomes possible for positive pressure and negative pressure that occur in the ABS to be well balanced centered about the suspension, making it possible to stabilize flying attitude and electrical characteristics.
摘要:
A pallet main body is provided with a block holding member which presses a positioning surface of an actuator block against a block reference surface formed in the pallet main body, and a movable arm. An insertion member, which can be inserted between a plurality of opposing suspensions, is formed at a distal end of the movable arm. As a suspension to which a slider is to be attached contacts a first contact surface formed on the side in contact with this suspension, a distal end of the suspension to which the slider is to be attached is held at a prescribed height from the block reference surface, thereby forming a gap between this suspension and a suspension opposed to this suspension.
摘要:
A pallet main body is provided with a block holding member which presses a positioning surface of an actuator block against a block reference surface formed in the pallet main body, and a movable arm. An insertion member, which can be inserted between a plurality of opposing suspensions, is formed at a distal end of the movable arm. As a suspension to which a slider is to be attached contacts a first contact surface formed on the side in contact with this suspension, a distal end of the suspension to which the slider is to be attached is held at a prescribed height from the block reference surface, thereby forming a gap between this suspension and a suspension opposed to this suspension.
摘要:
A method of manufacturing a magnetic head, and a magnetic head manufacturing apparatus, are provided, which make it possible to post mount a slider to a suspension even when the suspension and an actuator block are assembled together in advance, thus preventing the slider from being destroyed due to ESD or the like. First, a plurality of opposing suspensions are pushed open, forming a gap having a prescribed height between distal ends of the suspensions to which the slider is to be attached. Both side surfaces of the slider are then gripped by pressing surfaces formed on a gripping mechanism. An ABS of the slider is made to contact a horizontal regulating surface formed on the gripping mechanism, thus regulating the horizontal attitude of the slider. The slider, which is gripped by the gripping mechanism, is then inserted into the gap. A rear surface of the slider is attached to the distal end of the suspension through a connecting member.
摘要:
After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.
摘要:
After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.
摘要:
Provided is a method of manufacturing a magnetic head with which bonding of a slider and a suspension can be performed by taking an ABS pattern, which determines flying characteristics, as a reference, with no special fabrication required on the slider or the suspension. The method relates to a method of manufacturing a magnetic head for attaching a slider, on which an air bearing surface (ABS) is formed, to a suspension. A surface of the slider on which the ABS is formed is photographed, and the ABS and an engraved region formed within the ABS are identified from the photographed image. Then, a reference that serves as a guide in attaching the suspension is computed, and the slider is attached to the suspension based on the reference. It thus becomes possible for positive pressure and negative pressure that occur in the ABS to be well balanced centered about the suspension, making it possible to stabilize flying attitude and electrical characteristics.
摘要:
A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要:
Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.
摘要:
After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.