ELECTROFORMING METHOD
    1.
    发明申请
    ELECTROFORMING METHOD 有权
    电化学方法

    公开(公告)号:US20110233063A1

    公开(公告)日:2011-09-29

    申请号:US13063638

    申请日:2009-09-11

    IPC分类号: C25D1/10

    摘要: A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: H≧W/2.85 where 300 μm≦W; H≧W/3.75 where 200 μm≦W

    摘要翻译: 制造具有形成在绝缘层中的空腔的模具,其形成为放置在导电基材的上表面上。 将该模具设置在电解液浴中以施加电压,并且将金属电沉积在空腔的底表面上以电铸模腔中的金属成形产品。 在这种电沉积过程中,当空腔的宽度取为W并且空腔的上开口和金属层的上表面之间的顶部空间的垂直高度被取为H时,金属层的生长为 停止,使得留在金属层上方的顶部空间的高度H满足:H≥W/ 2.85,其中300μm和nlE; W; H≥W/ 3.75,其中200μm&lt; NE; W <300μm; H≥W/ 4,其中100μm和nlE; W <200μm; 和H≥W/ 10,其中W <100μm。

    Electroforming method
    2.
    发明授权
    Electroforming method 有权
    电铸法

    公开(公告)号:US09085828B2

    公开(公告)日:2015-07-21

    申请号:US13063638

    申请日:2009-09-11

    摘要: A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: where 300 μm≦W; H≧W/3.75 where 200 μm≦W

    摘要翻译: 制造具有形成在绝缘层中的空腔的模具,其形成为放置在导电基材的上表面上。 将该模具设置在电解液浴中以施加电压,并且将金属电沉积在空腔的底表面上以电铸模腔中的金属成形产品。 在这种电沉积过程中,当空腔的宽度取为W并且空腔的上开口和金属层的上表面之间的顶部空间的垂直高度被取为H时,金属层的生长为 停止,使得留在金属层上方的顶部空间的高度H满足:其中300μm&nlE; W; H≥W/ 3.75,其中200μm&lt; NE; W <300μm; H≥W/ 4,其中100μm和nlE; W <200μm; 和H≥W/ 10,其中W <100μm。

    ELECTROCASTING METHOD
    3.
    发明申请
    ELECTROCASTING METHOD 有权
    电动方法

    公开(公告)号:US20080237050A1

    公开(公告)日:2008-10-02

    申请号:US12057903

    申请日:2008-03-28

    IPC分类号: C25D1/10

    CPC分类号: C25D1/10

    摘要: The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity.

    摘要翻译: 本发明提供了一种电铸方法,通过该方式可以控制与电沉积在模具上的表面相对的表面的形状。 模制金属制品通过在空腔的侧壁面上形成绝缘层和形成空腔的导电模具的外壁面进行电铸,将模具放置在电解槽中并施加电压,将电沉积金属 并且在空腔中生长金属层,以便留下高度至少为空腔宽度三分之一的空间。

    Electrocasting method
    4.
    发明授权
    Electrocasting method 有权
    电铸法

    公开(公告)号:US07908098B2

    公开(公告)日:2011-03-15

    申请号:US12057903

    申请日:2008-03-28

    IPC分类号: G01F17/00

    CPC分类号: C25D1/10

    摘要: The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity.

    摘要翻译: 本发明提供了一种电铸方法,通过该方式可以控制与电沉积在模具上的表面相对的表面的形状。 模制金属制品通过在空腔的侧壁面上形成绝缘层和形成空腔的导电模具的外壁面进行电铸,将模具放置在电解槽中并施加电压,将电沉积金属 并且在空腔中生长金属层,以便留下高度至少为空腔宽度三分之一的空间。

    Contact and method for manufacturing the contact
    5.
    发明授权
    Contact and method for manufacturing the contact 失效
    联系人和制造接触的方法

    公开(公告)号:US08696392B2

    公开(公告)日:2014-04-15

    申请号:US13264769

    申请日:2011-03-24

    IPC分类号: H01R13/02

    摘要: A contact includes a plate with a width that ranges from 0.1 mm or more to 1 mm or less, and a stress concentrated place, where a surface roughness (Ra) on the stress concentrated place is 0.2 μm or less. When samples whose surface roughness Ra is 0.040 μm, 0.080 μm, 0.120 μm, and 0.180 μm were used to study a number of repetitive fracture times, as the surface roughness Ra was smaller, the number of repetitive fracture times became larger. Particularly, it is found that the surface roughness Ra may be 0.200 μm or less in order to satisfy 3000 times as a number of operating times of the battery connector. Further, the surface roughness Ra may be 0.080 μm or less in order to satisfy 6000 times as the number of operating times when a safety factor is 2.

    摘要翻译: 触点包括宽度为0.1mm以上至1mm以下的板,应力集中的应力集中的位置为0.2μm以下。 使用表面粗糙度Ra为0.040μm,0.080μm,0.120μm,0.180μm的样品,研究重复断裂次数,随着表面粗糙度Ra越小,重复断裂次数越大。 特别地,发现表面粗糙度Ra可以为0.200μm以下,以满足电池连接器的操作次数的3000倍。 此外,为了使安全系数为2的操作次数的6000倍,表面粗糙度Ra可以为0.080μm以下。

    CONTACT AND METHOD FOR MANUFACTURING THE CONTACT
    6.
    发明申请
    CONTACT AND METHOD FOR MANUFACTURING THE CONTACT 失效
    联系人和制造联系人的方法

    公开(公告)号:US20120238158A1

    公开(公告)日:2012-09-20

    申请号:US13264769

    申请日:2011-03-24

    IPC分类号: H01R13/02 H01R43/16

    摘要: A contact includes a plate with a width that ranges from 0.1 mm or more to 1 mm or less, and a stress concentrated place, where a surface roughness (Ra) on the stress concentrated place is 0.2 μm or less. When samples whose surface roughness Ra is 0.040 μm, 0.080 μm, 0.120 μm, and 0.180 μm were used to study a number of repetitive fracture times, as the surface roughness Ra was smaller, the number of repetitive fracture times became larger. Particularly, it is found that the surface roughness Ra may be 0.200 μm or less in order to satisfy 3000 times as a number of operating times of the battery connector. Further, the surface roughness Ra may be 0.080 μm or less in order to satisfy 6000 times as the number of operating times when a safety factor is 2.

    摘要翻译: 触点包括宽度为0.1mm以上至1mm以下的板,应力集中的应力集中的位置为0.2μm以下。 使用表面粗糙度Ra为0.040μm,0.080μm,0.120μm,0.180μm的样品来研究重复断裂次数,随着表面粗糙度Ra越小,重复断裂次数越大。 特别地,发现表面粗糙度Ra可以为0.200μm以下,以满足电池连接器的操作次数的3000倍。 此外,为了使安全系数为2的操作次数的6000倍,表面粗糙度Ra可以为0.080μm以下。

    METHOD FOR MODIFYING CHROMOSOMES
    10.
    发明申请
    METHOD FOR MODIFYING CHROMOSOMES 有权
    修饰色素的方法

    公开(公告)号:US20090007282A1

    公开(公告)日:2009-01-01

    申请号:US12116294

    申请日:2008-05-07

    IPC分类号: A01K67/027

    摘要: The present invention relates to a method for producing a modified foreign chromosome(s) or a fragment(s) thereof, which comprises the steps of: (a) preparing a microcell comprising a foreign chromosome(s) or a fragment(s) thereof, and transferring said foreign chromosome(s) or a fragment(s) into a cell with high homologous recombination efficiency through its fusion with said microcell; (b) in said cell with high homologous recombination efficiency, inserting a targeting vector by homologous recombination into a desired site of said foreign chromosome(s) or a fragment(s) thereof, and/or a desired site of a chromosome(s) derived from said cell with high homologous recombination efficiency, thereby marking said desired site; and (c) in said cell with high homologous recombination efficiency, causing deletion and/or translocation to occur at the marked site of said foreign chromosome(s) or a fragment(s) thereof.

    摘要翻译: 本发明涉及一种生产修饰的外源染色体或其片段的方法,其包括以下步骤:(a)制备包含外来染色体或其片段的微细胞 并通过与所述微细胞融合将所述外源染色体或片段转移到具有高同源重组效率的细胞中; (b)在具有高同源重组效率的所述细胞中,通过同源重组将靶向载体插入所述外源染色体或其片段的所需位点和/或染色体的所需位点, 衍生自具有高同源重组效率的所述细胞,从而标记所述期望的位点; 和(c)在具有高同源重组效率的所述细胞中,导致在所述外源染色体或其片段的标记位点发生缺失和/或易位。