摘要:
A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base. The apparatus uses a wide bandwidth light source for the exposure light source that produces exposure light and non-exposure light having wavelengths different from those in the exposure light, and optical adjustments for optical components in at least a portion of the illumination optics are performed by using non-exposure light
摘要:
Light is irradiated on a light-shielding pattern on an object surface side of a projection optical system, and light intensity distribution of the light having passed through the projection optical system and slits is detected while slits of an aerial image measuring unit on the image plane side of the projection optical system are moved within a plane perpendicular to the optical axis of the projection optical system, The information concerning the flare of the projection optical system is computed from the light intensity distribution, so that the influence of resist coated on a wafer used in a conventional exposing method can be eliminated, and highly accurate measurement of information concerning the flare can be realized. Further, measurement of information concerning the flare can be performed in a short time comparing to the exposing method because development process or the like of the wafer is not necessary.
摘要:
A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.
摘要:
A sensor is used at a substrate level in a lithographic projection apparatus having a projection system with a numeric aperture that is greater than 1 and is configured to project a patterned radiation beam onto a target portion of a substrate The sensor includes a radiation-detector; a transmissive plate having a front surface and a back surface, the transmissive plate being positioned such that radiation projected by the projection system passes into the front surface of the transmissive plate and out of the back surface thereof to the radiation detector; and a luminescent layer provided on the back surface of the transmissive plate, the luminescent layer absorbing the radiation and emitting luminescent radiation of a different wavelength, wherein the back surface is rough.
摘要:
Provided that a pair of strip-like regions extend from 2 mm to 10 mm inside each of a pair of opposing sides along an outer periphery of a top surface of a substrate on which a mask pattern is to be formed, with a 2 mm edge portion excluded at each end in a lengthwise direction thereof, the height from a least squares plane for the strip-like regions on the substrate top surface to the strip-like regions is measured at intervals of 0.05-0.35 mm in horizontal and vertical directions, and a substrate in which the difference between the maximum and minimum values for the height among all the measurement points is νoτ μoρε τηαν 0.5 μm is selected.
摘要:
There is disclosed a wafer flatness evaluation method includes measuring front and rear surface shapes of a wafer. The wafer front surface measured is divided into sites. Then, a flatness calculating method is selected according to a position of the site to be evaluated and flatness in the wafer surface is acquired.
摘要:
A defect inspecting apparatus and a defect inspecting method are provided to conduct discriminating detection of minute circuit patterns and foreign particles as well as to detect defectives on the surface of a substrate with a high precision. The beams from a laser light source are converged by a lens to be incident upon an inspecting point. The light emitted from the inspecting point by the incident beam is detected by a photoreceiver. On the light receiving surface of the photoreceiver, a plurality of light receiving areas are provided. Each of the light receiving areas has longitudinal direction and shorter direction on its positively projected view. The arrangement of the light receiving areas is selected in accordance with the arrangement information of the patterns formed on the substrate. The foreign particles and the patterns are distinguished by obtaining the logical product of the output signals from the selected light receiving area.
摘要:
A foreign particle inspection apparatus, for detecting a foreign particle on a reticle or the like includes an illumination system for irradiating an inspection area on a specimen with inspecting light, and plural light-receiving systems adapted to condense the scattered light from a foreign particle in the inspection area and having respective light-receiving areas on the specimen, each smaller than the inspection area. Each of the light-receiving areas of the plural light-receiving systems overlaps partially with at least one of the other light-receiving areas. The plural light-receiving systems are so arranged that any point in the inspection area is covered by the light-receiving areas of at least two of the plural light-receiving systems. A foreign particle in the inspection area is detected by a detection system, based on the lights condensed by the plural light receiving systems.
摘要:
Provided is an exposure apparatus that is able to prevent liquid from on a measuring part. An exposure apparatus comprises a measuring system (60), which has a first pattern (61) formed on the upper surface of a substrate stage, and a second area (S2) specified on the upper surface in the vicinity of a first area (S1), which includes the first pattern (61), and a second pattern (80) is formed in the second area (S2) so that the liquid (LQ) that has remained so as to span the first area (S1) and the second area (S2) retreats from the first area (S1) and collects in the second area (S2).
摘要翻译:提供能够防止测量部件上的液体的曝光装置。 曝光装置包括测量系统(60),其具有形成在基板台的上表面上的第一图案(61)和在第一区域附近的上表面上指定的第二区域(S 2) S 1),其包括第一图案(61),并且在第二区域(S 2)中形成第二图案(80),使得保留以跨越第一区域(S1)的液体(LQ) )和第二区域(S 2)从第一区域(S 1)退回并收集在第二区域(S 2)中。
摘要:
A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.