Accurate parasitic capacitance extraction for ultra large scale integrated circuits
    1.
    发明授权
    Accurate parasitic capacitance extraction for ultra large scale integrated circuits 有权
    超大规模集成电路的精确寄生电容提取

    公开(公告)号:US08214784B2

    公开(公告)日:2012-07-03

    申请号:US12893870

    申请日:2010-09-29

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits
    2.
    发明申请
    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits 有权
    超大型集成电路的精确寄生电容提取

    公开(公告)号:US20120260225A1

    公开(公告)日:2012-10-11

    申请号:US13527096

    申请日:2012-06-19

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits
    3.
    发明申请
    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits 有权
    超大型集成电路的精确寄生电容提取

    公开(公告)号:US20090007035A1

    公开(公告)日:2009-01-01

    申请号:US11865304

    申请日:2007-10-01

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Accurate parasitic capacitance extraction for ultra large scale integrated circuits
    4.
    发明授权
    Accurate parasitic capacitance extraction for ultra large scale integrated circuits 有权
    超大规模集成电路的精确寄生电容提取

    公开(公告)号:US08572537B2

    公开(公告)日:2013-10-29

    申请号:US13527096

    申请日:2012-06-19

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits
    5.
    发明申请
    Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits 有权
    超大型集成电路的精确寄生电容提取

    公开(公告)号:US20110023003A1

    公开(公告)日:2011-01-27

    申请号:US12893870

    申请日:2010-09-29

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Accurate parasitic capacitance extraction for ultra large scale integrated circuits
    6.
    发明授权
    Accurate parasitic capacitance extraction for ultra large scale integrated circuits 有权
    超大规模集成电路的精确寄生电容提取

    公开(公告)号:US07818698B2

    公开(公告)日:2010-10-19

    申请号:US11865304

    申请日:2007-10-01

    IPC分类号: G06F17/50

    摘要: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

    摘要翻译: 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤,其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

    Method on scan chain reordering for lowering VLSI power consumption
    8.
    发明授权
    Method on scan chain reordering for lowering VLSI power consumption 有权
    用于降低VLSI功耗的扫描链重新排序方法

    公开(公告)号:US07181664B2

    公开(公告)日:2007-02-20

    申请号:US10827507

    申请日:2004-04-19

    IPC分类号: G01R31/28

    摘要: A method for reordering a scan chain meets given constraints and minimizes peak power dissipation. The given constraints include a maximum peak power dissipation, a maximum scan chain length and a maximum distance between two successive registers. The method includes embedding a developed tool into an existing VLSI design flow for low-power circuit designs. Furthermore, the characteristics quickly judge if the problem has corresponding feasible solutions and searching the optimal solution. Modified data from the given scan chain declaration data and the scan pattern data, which satisfy the constraints, can be obtained.

    摘要翻译: 扫描链重新排序的方法满足给定约束并最大限度地降低峰值功耗。 给定的约束包括最大峰值功耗,最大扫描链长度和两个连续寄存器之间的最大距离。 该方法包括将开发的工具嵌入到用于低功率电路设计的现有VLSI设计流程中。 此外,特征快速判断问题是否具有相应的可行解决方案,并寻找最优解。 可以获得来自给定的扫描链声明数据和满足约束的扫描图形数据的修改数据。

    Method on scan chain reordering for lowering VLSI power consumption
    9.
    发明申请
    Method on scan chain reordering for lowering VLSI power consumption 有权
    用于降低VLSI功耗的扫描链重新排序方法

    公开(公告)号:US20050235182A1

    公开(公告)日:2005-10-20

    申请号:US10827507

    申请日:2004-04-19

    IPC分类号: G01R31/28 G01R31/3185

    摘要: A method for reordering a scan chain so that the given constraints are met and the peak power dissipation is minimized and disclosed. The constraints include a maximum peak power dissipation, a maximum scan chain length and a maximum distance between two successive registers. The developed tool can be embedded into the existing VLSI design flow for low-power circuit designs. Furthermore, the characteristics are quickly judging if the problem has corresponding feasible solutions and searching the optimal solution. Given the scan chain declaration data and the scan pattern data, the modified ones, which satisfy the constraints, can be obtained.

    摘要翻译: 一种用于重新排序扫描链以使得给定约束得到满足并且峰值功率耗散被最小化和公开的方法。 约束包括最大峰值功耗,最大扫描链长度和两个连续寄存器之间的最大距离。 开发的工具可以嵌入现有的VLSI设计流程,用于低功耗电路设计。 此外,特征是快速判断问题是否具有相应的可行解和搜索最优解。 给定扫描链声明数据和扫描图案数据,可以获得满足约束条件的修改的数据。

    Photo-frame style photo album
    10.
    发明授权
    Photo-frame style photo album 失效
    相框风格相册

    公开(公告)号:US06845582B1

    公开(公告)日:2005-01-25

    申请号:US10650937

    申请日:2003-08-27

    IPC分类号: A47G1/06 B42D1/08

    摘要: A photo-frame album generally includes a lower frame, a lower divider, an upper frame and an upper divider. The upper divider is disposed on the upper frame, both the lower and the upper frames are provided with magnetic pieces, on inner side of the upper and the lower dividers of the upper and the lower frames are respectively provided stop pieces and further slits. On the rims of the lower and the upper frames are formed with backing surface, plural magnetic pieces are provided on a support stand of the lower frame.

    摘要翻译: 相框相册通常包括下框架,下分隔件,上框架和上分隔件。 上分隔件设置在上框架上,下框架和上框架都设有磁片,上框架和下框架的上下分隔件的内侧分别设置有止挡件和另外的狭缝。 在下框架和上框架的边缘形成有背衬表面,在下框架的支撑架上设置多个磁片。