公开(公告)号：US20130102149A1

公开(公告)日：2013-04-25

申请号：US13451207

申请日：2012-04-19

申请人： Kedar Sapre ,  Manuel Hernandez ,  Lei Luo

发明人： Kedar Sapre ,  Manuel Hernandez ,  Lei Luo

IPC分类号： H01L21/768

CPC分类号： H01L21/768 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of forming a dielectric liner layer on a semiconductor substrate are described. The method may include flowing a phosphorus-containing precursor with a silicon-containing precursor and an oxygen-containing precursor over the substrate to deposit a dielectric material. The dielectric material may be deposited along a field region and within at least one via on the substrate having a depth of at least 1 μm. The method may also include forming a liner layer within the via with the dielectric material. The liner may include a silicon oxide doped with phosphorus, and the thickness of the liner layer at an upper portion of the via sidewall may be less than about 5 times the thickness of the liner layer at a lower portion of the via sidewall.

摘要翻译： 描述在半导体衬底上形成电介质衬垫层的方法。 该方法可以包括使含磷前体和含氧前体在衬底上流动以沉积介电材料。 电介质材料可以沿着场区域并且在至少一个具有至少1um的深度的衬底上的至少一个通孔内沉积。 该方法还可以包括在电介质材料的通路内形成衬里层。 衬垫可以包括掺杂有磷的氧化硅，并且通孔侧壁的上部处的衬垫层的厚度可以小于通孔侧壁的下部处的衬垫层的厚度的约5倍。

公开(公告)号：US08617989B2

公开(公告)日：2013-12-31

申请号：US13451207

申请日：2012-04-19

申请人： Kedar Sapre ,  Manuel Hernandez ,  Lei Luo

发明人： Kedar Sapre ,  Manuel Hernandez ,  Lei Luo

IPC分类号： H01L21/316 ,  H01L23/538

CPC分类号： H01L21/768 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of forming a dielectric liner layer on a semiconductor substrate are described. The method may include flowing a phosphorus-containing precursor with a silicon-containing precursor and an oxygen-containing precursor over the substrate to deposit a dielectric material. The dielectric material may be deposited along a field region and within at least one via on the substrate having a depth of at least 1 μm. The method may also include forming a liner layer within the via with the dielectric material. The liner may include a silicon oxide doped with phosphorus, and the thickness of the liner layer at an upper portion of the via sidewall may be less than about 5 times the thickness of the liner layer at a lower portion of the via sidewall.

摘要翻译： 描述在半导体衬底上形成电介质衬垫层的方法。 该方法可以包括使含磷前体和含氧前体在衬底上流动以沉积介电材料。 电介质材料可以沿着场区域并且在至少一个具有至少1um的深度的衬底上的至少一个通孔内沉积。 该方法还可以包括在电介质材料的通路内形成衬里层。 衬垫可以包括掺杂有磷的氧化硅，并且通孔侧壁的上部处的衬垫层的厚度可以小于通孔侧壁的下部处的衬垫层的厚度的约5倍。

公开(公告)号：US07286325B2

公开(公告)日：2007-10-23

申请号：US10860163

申请日：2004-06-02

申请人： Manuel Hernandez ,  Yen Fu

发明人： Manuel Hernandez ,  Yen Fu

IPC分类号： G11B17/32

CPC分类号： G11B5/4853

摘要： According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, a conductive connection is made between two metal layers separated by an intermediate insulating layer by providing vias between one of the metal layers and the insulating layer. A conductor, such as a conductive sphere made of gold is disposed into the vias and pressed so as to create a conductive connection between the metal layers. In a further embodiment, vias are created in both metal layers. In such a case, a fixture support may be provided so that when the conductive sphere is pressed into the vias, it is also pressed into the support to improve the conductive connection.

摘要翻译： 根据本发明的实施例，提供了一种改进的方法和系统。 在一个实施例中，通过在金属层之一和绝缘层之间提供通孔，在由中间绝缘层分开的两个金属层之间形成导电连接。 诸如由金制成的导电球体的导体被布置在通孔中并被压制以便在金属层之间形成导电连接。 在另一实施例中，在两个金属层中形成通孔。 在这种情况下，可以提供固定支撑件，使得当导电球被压入通孔时，其也被压入支撑件以改善导电连接。

公开(公告)号：US08045295B2

公开(公告)日：2011-10-25

申请号：US12145464

申请日：2008-06-24

申请人： Yen Fu ,  Ellis T. Cha ,  Po-Kang Wang ,  Hong Tian ,  Manuel Hernandez ,  Yaw-Shing Tang ,  Ben Hu

发明人： Yen Fu ,  Ellis T. Cha ,  Po-Kang Wang ,  Hong Tian ,  Manuel Hernandez ,  Yaw-Shing Tang ,  Ben Hu

IPC分类号： G11B5/55

CPC分类号： H05K3/3442 ,  B24B37/00 ,  B24D18/00 ,  G11B5/4853 ,  H05K1/0215 ,  H05K2201/10727 ,  Y02P70/613

摘要： Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

摘要翻译： 呈现用于将滑块电耦合到地面的方法和装置。 在一个实施例中，接合焊盘设置在与用于读/写信号的接合焊盘分开的滑块体的一侧上。 该单独的接合焊盘在滑块体内电耦合到要耦合到地面的部件。 设置在悬架上的单独的导体（例如，迹线，柔性电路等）可以通过金球接合电耦合到单独的接合焊盘。 导体也耦合到硬盘驱动装置中的接地（例如，经由前置放大器）。 使用分离的接合焊盘和迹线可能会使得不需要使用导电粘合剂来将滑块经由其附接件电连接到滑块的舌部。

公开(公告)号：US20070188450A1

公开(公告)日：2007-08-16

申请号：US11353747

申请日：2006-02-14

申请人： Manuel Hernandez ,  Anthony Martinez

发明人： Manuel Hernandez ,  Anthony Martinez

IPC分类号： G09G5/08

CPC分类号： G06F3/1423 ,  G06F1/1626 ,  G06F1/1647 ,  G06F1/169 ,  G06F1/1694 ,  G06F2200/1637 ,  G09G2340/0492

摘要： A system for displaying data in a portable data processing system with a plurality of display interfaces. Data is displayed within a first display interface of the portable data processing system. A user input, which is a change in orientation of the portable data processing system, is detected. After determining a type of change in orientation of the portable data processing system, data is displayed within the first display interface or a second display interface of the portable data processing system based upon the type of change in orientation.

摘要翻译： 一种用于在具有多个显示接口的便携式数据处理系统中显示数据的系统。 数据显示在便携式数据处理系统的第一显示接口内。 检测到便携式数据处理系统的方位改变的用户输入。 在确定便携式数据处理系统的方向改变的类型之后，基于方向改变的类型，在便携式数据处理系统的第一显示界面或第二显示界面内显示数据。

公开(公告)号：US20070019333A1

公开(公告)日：2007-01-25

申请号：US11505239

申请日：2006-08-15

申请人： Manuel Hernandez

发明人： Manuel Hernandez

IPC分类号： G11B5/55

CPC分类号： H05K1/028 ,  G11B5/486 ,  H05K1/0266 ,  H05K2201/09145 ,  H05K2201/09936

摘要： A wireless suspension design is described that can be used in varying types of drive designs. In one embodiment, a flex circuit is provided with at least two indicia to indicate where the flex circuit is to be bent when attaching it to a head stack assembly.

摘要翻译： 描述了可用于不同类型的驱动器设计的无线悬架设计。 在一个实施例中，柔性电路设置有至少两个标记，以指示当将柔性电路连接到磁头堆叠组件时弯曲电路的何处。

公开(公告)号：US20070064346A1

公开(公告)日：2007-03-22

申请号：US11505058

申请日：2006-08-15

申请人： Manuel Hernandez

发明人： Manuel Hernandez

IPC分类号： G11B5/55

CPC分类号： H05K1/028 ,  G11B5/486 ,  H05K1/0266 ,  H05K2201/09145 ,  H05K2201/09936

摘要： A wireless suspension design is described that can be used in varying types of drive designs. In one embodiment, a flex circuit is provided with at least two indicia to indicate where the flex circuit is to be bent when attaching it to a head stack assembly.

公开(公告)号：US07172685B2

公开(公告)日：2007-02-06

申请号：US10120700

申请日：2002-04-11

申请人： Max W. Thompson ,  Behzad Jazayeri ,  Robert Zapata ,  Manuel Hernandez

发明人： Max W. Thompson ,  Behzad Jazayeri ,  Robert Zapata ,  Manuel Hernandez

IPC分类号： C10G25/00 ,  C10G25/12 ,  B01J8/00 ,  B01J20/00

CPC分类号： C10G45/02 ,  B01D53/047 ,  B01D53/08 ,  B01D53/12 ,  B01D2253/1122 ,  B01D2253/1124 ,  B01D2253/304 ,  B01D2256/24 ,  B01D2257/304 ,  B01D2257/306 ,  B01D2257/308 ,  B01D2259/40009 ,  B01D2259/40056 ,  B01D2259/40086 ,  B01D2259/403 ,  B01J20/0225 ,  B01J20/06 ,  B01J20/08 ,  B01J20/106 ,  B01J20/3433 ,  B01J20/3458 ,  B01J2220/56 ,  C10G25/09 ,  C10G25/12

摘要： A hydrocarbon desulfurization system employing regenerable solid sorbent particulates in a fluidized bed desulfurization reactor. The sulfur-loaded sorbent particulates are continuously withdrawn from the reactor and transferred to a regenerator. A novel solids transport mechanism provides for the safe and effective transfer of the sulfur-loaded sorbent particulates from the high pressure hydrocarbon environment of the reactor to the low pressure oxygen environment of the regenerator.

摘要翻译： 在流化床脱硫反应器中使用可再生固体吸附剂颗粒的烃脱硫系统。 硫负载的吸附剂颗粒从反应器中连续排出并转移到再生器中。 新颖的固体输送机制提供了将负载硫的吸附剂颗粒从反应器的高压烃环境到再生器的低压氧气环境的安全和有效的转移。

公开(公告)号：US07064928B2

公开(公告)日：2006-06-20

申请号：US10414233

申请日：2003-04-16

申请人： Yen Fu ,  Ellis Cha ,  Po-Kang Wang ,  Hong Tian ,  Manuel Hernandez ,  Yaw-Shing Tang ,  Ben Hu

发明人： Yen Fu ,  Ellis Cha ,  Po-Kang Wang ,  Hong Tian ,  Manuel Hernandez ,  Yaw-Shing Tang ,  Ben Hu

IPC分类号： G11B5/55 ,  G11B5/60

CPC分类号： H05K3/3442 ,  B24B37/00 ,  B24D18/00 ,  G11B5/4853 ,  H05K1/0215 ,  H05K2201/10727 ,  Y02P70/613

摘要： Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

摘要翻译： 呈现用于将滑块电耦合到地面的方法和装置。 在一个实施例中，接合焊盘设置在与用于读/写信号的接合焊盘分开的滑块体的一侧上。 该单独的接合焊盘在滑块体内电耦合到要耦合到地面的部件。 设置在悬架上的单独的导体（例如，迹线，柔性电路等）可以通过金球接合电耦合到单独的接合焊盘。 导体也耦合到硬盘驱动装置中的接地（例如，经由前置放大器）。 使用分离的接合焊盘和迹线可能会使得不需要使用导电粘合剂来将滑块经由其附接件电连接到滑块的舌部。

公开(公告)号：US20050190499A1

公开(公告)日：2005-09-01

申请号：US10860163

申请日：2004-06-02

申请人： Manuel Hernandez ,  Yen Fu

发明人： Manuel Hernandez ,  Yen Fu

IPC分类号： G11B5/48 ,  G11B5/60

CPC分类号： G11B5/4853

摘要： According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, a conductive connection is made between two metal layers separated by an intermediate insulating layer by providing vias between one of the metal layers and the insulating layer. A conductor, such as a conductive sphere made of gold is disposed into the vias and pressed so as to create a conductive connection between the metal layers. In a further embodiment, vias are created in both metal layers. In such a case, a fixture support may be provided so that when the conductive sphere is pressed into the vias, it is also pressed into the support to improve the conductive connection.

摘要翻译： 根据本发明的实施例，提供了一种改进的方法和系统。 在一个实施例中，通过在金属层之一和绝缘层之间提供通孔，在由中间绝缘层分开的两个金属层之间形成导电连接。 诸如由金制成的导电球体的导体被布置在通孔中并被压制以便在金属层之间形成导电连接。 在另一实施例中，在两个金属层中形成通孔。 在这种情况下，可以提供固定支撑件，使得当导电球被压入通孔时，其也被压入支撑件以改善导电连接。