摘要:
There are provided preflow periods t11, t12 in which group III element materials TMG, TMA and TMI are not supplied from a group III element material container to a reaction region (reactor), while a group V element material PH3 and an Mg dopant material are supplied from a group V element material container and a dopant material container to the reaction region (reactor) after an Mg-undoped group III-V compound semiconductor layer is crystallinically grown and before an Mg-doped group III-V compound semiconductor layer is crystallinically grown. According to the semiconductor manufacturing method, an Mg doping profile can be accurately controlled.
摘要:
There are provided preflow periods t11, t12 in which group III element materials TMG, TMA and TMI are not supplied from a group III element material container to a reaction region (reactor), while a group V element material PH3 and an Mg dopant material are supplied from a group V element material container and a dopant material container to the reaction region (reactor) after an Mg-undoped group III-V compound semiconductor layer is crystallinically grown and before an Mg-doped group III-V compound semiconductor layer is crystallinically grown. According to the semiconductor manufacturing method, an Mg doping profile can be accurately controlled.
摘要:
A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.
摘要:
An imaging lens unit configured for processing by a solder reflow process, and includes a lens group of one or more lenses; and a lens tube supporting the lens group. The imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of at least 200° C. The imaging lens unit has a clearance between the lens tube and at least one of the cationically-cured epoxy resin lenses and has lens supporting portions provided at least three locations inside the lens tube that support the at least one cationically-cured epoxy resin lens. The lens unit can be miniaturized. The imaging lens unit also provides excellent optical characteristics without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm.
摘要:
According to one embodiment, a vehicle-mounted apparatus includes a wireless communication unit, an authentication data acquisition unit, a data transmitting/receiving unit, and a controller. The authentication data acquisition unit is configured to perform an authentication process with a roadside apparatus, through the wireless communication unit, and thereby to acquire authentication data showing that the apparatus is authenticated in a specified area of a road. The data transmitting/receiving unit is configured to transmit and receive information containing the authentication data, to and from the vehicle-mounted apparatus mounted in any other vehicle. The controller is configured to control the data transmitting/receiving unit in accordance with the authentication data, causing the data transmitting/receiving unit to transmit and receive data other than the authentication data.
摘要:
A coating comprising a polymer (I)-containing coating component and colloidal silica (II) of 60 nm or less average particle diameter, wherein 0.5 to 20 parts by mass, in terms of solid content, of colloidal silica (II) is contained per 100 parts by mass of polymer (I) and wherein the area of colloidal silica exposed from the surface of the coating occupies 35% or more based on the coating surface. This coating exhibits excellent antifouling performance and excels in transparency, weather resistance, water resistance, and elongation degree.
摘要:
The present invention provides a light selective transmission filter which selectively shields light and has a high transmittance of light at a specific wavelength such as visible rays, and which has a sufficiently reduced thickness and excellent heat resistance. The present invention further provides a lens unit including such a light selective transmission filter. The light selective transmission filter selectively reducing a transmittance of light has a thickness of less than 200 μm and includes a base material containing a functional film with reflow resistance. The lens unit includes such a light selective transmission filter and a lens.
摘要:
An optical glass having a high refractive index (particularly preferably a refractive index of 1.6 or more), low dispersion (an Abbe number of 45 or more), a low deformation point, and improved resistance to devitrification upon molding, and suitable for precision-mold press molding or other molding processes and also suitable for transfer of a fine structure is provided. The optical glass contains 1.0-4.5 wt. % SiO2, 30.5-50.0 wt. % B2O3, 1.1-8.0 wt. % Li2O, 10.1-19.5 wt. % BaO, 15.5-30.0 wt. % ZnO, 3.0-15.0 wt. % Y2O3, and 10.0-19.5 wt. % La2O3.
摘要:
The color display device includes a colored light generation unit for repetitively generating a plurality of colored lights in a time sequence with a predetermined frequency, and an image generation unit for processing said plurality of colored lights, so as to generate an image corresponding to each of the plurality of colored lights generated in a time sequence. The said predetermined frequency is 180 Hz or more.
摘要:
An imaging device with a semi-column-parallel pipeline analog-to-digital converter architecture. The semi-column-parallel pipeline architecture allows multiple column output lines to share an analog-to-digital converter. Analog-to-digital conversions are performed in a pipelined manner to reduce the conversion time, which results in shorter row times and increased frames rate and data throughput. The architecture also enhances the pitch of the analog-to-digital converters, which allows high performance, high resolution analog-to-digital converters to be used. As such, semi-column-parallel pipeline architecture overcomes the shortcomings of the typical serial and column-parallel architectures.