Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
    1.
    发明授权
    Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device 有权
    III族氮化物衬底,提供外延层的衬底,其制造方法以及制造半导体器件的方法

    公开(公告)号:US08101968B2

    公开(公告)日:2012-01-24

    申请号:US13016497

    申请日:2011-01-28

    IPC分类号: H01L33/00

    摘要: A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface is not more than 3×1013; a group III nitride substrate, wherein the number of silicon atoms per square centimeter of a surface is not more than 3×1013, and a haze level of the surface is not more than 5 ppm; and a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1014, and a haze level of the surface is not more than 5 ppm.

    摘要翻译: 可以形成能够形成质量良好的外延生长层的III族氮化物衬底及其制造方法。 GaN衬底是以下之一:III族氮化物衬底,其中每平方厘米表面的酸性材料的原子数不大于2×1014,并且每平方厘米表面的硅原子数 不超过3×1013; III族氮化物衬底,其中每平方厘米表面的硅原子数不大于3×1013,并且表面的雾度不大于5ppm; 和III族氮化物衬底,其中每平方厘米表面的酸性材料的原子数不大于2×1014,并且表面的雾度不大于5ppm。

    GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    III族氮化物衬底,外延层基板,其制造方法和制造半导体器件的方法

    公开(公告)号:US20100187540A1

    公开(公告)日:2010-07-29

    申请号:US12445681

    申请日:2007-10-09

    摘要: A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface is not more than 3×1013; a group III nitride substrate, wherein the number of silicon atoms per square centimeter of a surface is not more than 3×1013, and a haze level of the surface is not more than 5 ppm; and a group III nitride substrate, wherein the number of atoms of an acid, material per square centimeter of a surface is not more than 2×1014, and a haze level of the surface is not more than 5 ppm.

    摘要翻译: 可以形成能够形成质量良好的外延生长层的III族氮化物衬底及其制造方法。 GaN衬底是以下之一:III族氮化物衬底,其中每平方厘米表面的酸性材料的原子数不大于2×1014,并且每平方厘米表面的硅原子数 不超过3×1013; III族氮化物衬底,其中每平方厘米表面的硅原子数不大于3×1013,并且表面的雾度不大于5ppm; 和III族氮化物衬底,其中酸的原子数,每平方厘米表面的材料不大于2×1014,并且表面的雾度不大于5ppm。

    GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    5.
    发明申请
    GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    III族氮化物衬底,外延层基板,其制造方法和制造半导体器件的方法

    公开(公告)号:US20110133207A1

    公开(公告)日:2011-06-09

    申请号:US13016497

    申请日:2011-01-28

    IPC分类号: H01L29/20

    摘要: A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate (1) is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface (3) is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface (3) is not more than 3×1013; a group III nitride substrate, wherein the number of silicon atoms per square centimeter of a surface (3) is not more than 3×1013, and a haze level of the surface (3) is not more than 5 ppm; and a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface (3) is not more than 2×1014, and a haze level of the surface (3) is not more than 5 ppm.

    摘要翻译: 可以形成能够形成质量良好的外延生长层的III族氮化物衬底及其制造方法。 GaN衬底(1)是以下之一:III族氮化物衬底,其中每平方厘米表面(3)的酸性材料的原子数不大于2×1014,并且硅原子数 每平方厘米的表面(3)不大于3×1013; III族氮化物衬底,其中每平方厘米表面(3)的硅原子数不大于3×1013,并且表面(3)的雾度不大于5ppm; 和III族氮化物衬底,其中每平方厘米表面(3)的酸性材料的原子数不大于2×1014,并且表面(3)的雾度水平不大于5ppm。

    Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
    6.
    发明授权
    Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device 有权
    III族氮化物衬底,提供外延层的衬底,其制造方法以及制造半导体器件的方法

    公开(公告)号:US07901960B2

    公开(公告)日:2011-03-08

    申请号:US12445681

    申请日:2007-10-09

    IPC分类号: H01L21/00

    摘要: A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface is not more than 3×1013; a group III nitride substrate, wherein the number of silicon atoms per square centimeter of a surface is not more than 3×1013, and a haze level of the surface is not more than 5 ppm; and a group III nitride substrate, wherein the number of atoms of an acid, material per square centimeter of a surface is not more than 2×1014, and a haze level of the surface is not more than 5 ppm.

    摘要翻译: 可以形成能够形成质量良好的外延生长层的III族氮化物衬底及其制造方法。 GaN衬底是以下之一:III族氮化物衬底,其中每平方厘米表面的酸性材料的原子数不大于2×1014,并且每平方厘米表面的硅原子数 不超过3×1013; III族氮化物衬底,其中每平方厘米表面的硅原子数不大于3×1013,并且表面的雾度不大于5ppm; 和III族氮化物衬底,其中酸的原子数,每平方厘米表面的材料不大于2×1014,并且表面的雾度不大于5ppm。