ACRYLIC PRESSURE-SENSITIVE ADHESIVE RESIN COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE SHEET OR PRESSURE-SENSITIVE ADHESIVE TAPE USING THE SAME
    1.
    发明申请
    ACRYLIC PRESSURE-SENSITIVE ADHESIVE RESIN COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE SHEET OR PRESSURE-SENSITIVE ADHESIVE TAPE USING THE SAME 失效
    丙烯酸压敏胶粘剂组合物和压敏粘合片或使用其的压敏粘合胶带

    公开(公告)号:US20110189478A1

    公开(公告)日:2011-08-04

    申请号:US13017140

    申请日:2011-01-31

    IPC分类号: C09J7/02 C09J183/06

    摘要: The present invention relates to an acrylic pressure-sensitive adhesive resin composition including an organic-inorganic hybrid polymer synthesized from the following (a) to (d): (a) fine silica particles having silanol groups on a surface thereof; (b) a siloxane having at least one selected from a group consisting of an alkoxysilyl group and a silanol group at a molecular end thereof; (c) a trialkoxysilane represented by the following general formula (I) in which R1 represents a C1-6 alkyl group, and R1′ represents a hydrogen atom or a methyl group; and (d) a (meth)acrylic monomer:

    摘要翻译: 本发明涉及由以下(a)〜(d)合成的有机 - 无机杂化聚合物的丙烯酸系粘合树脂组合物:(a)表面具有硅烷醇基的二氧化硅微粒; (b)在其分子末端具有选自烷氧基甲硅烷基和硅烷醇基中的至少一种的硅氧烷; (c)由以下通式(I)表示的三烷氧基硅烷,其中R 1表示C 1-6烷基,R 1'表示氢原子或甲基; 和(d)(甲基)丙烯酸单体:

    SILICONE RESIN COMPOSITION
    2.
    发明申请
    SILICONE RESIN COMPOSITION 失效
    硅树脂组合物

    公开(公告)号:US20090163654A1

    公开(公告)日:2009-06-25

    申请号:US12340003

    申请日:2008-12-19

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08L83/05 C08K3/22

    摘要: A silicone resin composition obtainable by reacting a bifunctional alkoxysilane and a trifunctional alkoxysilane in the presence of a dispersion of fine metal oxide particles. The silicone resin composition is suitably used in backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like.

    摘要翻译: 一种有机硅树脂组合物,其通过使双官能烷氧基硅烷和三官能烷氧基硅烷在金属氧化物微粒分散体的存在下反应得到。 有机硅树脂组合物适合用于液晶显示器,交通灯,户外大显示器,广告牌等的背光源中。

    INORGANIC OXIDE PARTICLE CONTAINING SILICONE RESIN SHEET
    3.
    发明申请
    INORGANIC OXIDE PARTICLE CONTAINING SILICONE RESIN SHEET 审中-公开
    无机氧化物颗粒含硅树脂片

    公开(公告)号:US20130040135A1

    公开(公告)日:2013-02-14

    申请号:US13569372

    申请日:2012-08-08

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08G77/14 C09J7/02

    摘要: There are provided a silicone resin sheet having high heat resistance and strength and being excellent in flexibility, and a pressure-sensitive adhesive sheet having excellent anchoring, force and excellent moisture resistance. The inorganic oxide particle-containing silicone resin sheet according to the present invention includes a silicone resin composition containing a crosslinked structure in which an inorganic oxide particle dispersed in a polysiloxane resin and the polysiloxane resin are crosslinked through a chemical bond, and has a tensile elongation of 5 to 15%. The primer composition for a carboxyl group-containing adhesive according to the present invention is a primer composition used for a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer containing a carboxyl group-containing polymer as a base polymer, and contains a crosslinked structure in which a polysiloxane compound is crosslinked through a chemical bond to the surface of a core including an inorganic oxide particle.

    摘要翻译: 提供了具有高耐热性和强度并且柔软性优异的硅树脂片,以及具有优异的锚定力,强力和优异的耐湿性的压敏粘合片。 本发明的无机氧化物颗粒的有机硅树脂片包括含有分散在聚硅氧烷树脂中的无机氧化物颗粒和聚硅氧烷树脂通过化学键交联的交联结构的有机硅树脂组合物,并且具有拉伸伸长率 为5至15%。 根据本发明的含羧基粘合剂的底漆组合物是用于具有含有含羧基的聚合物作为基础聚合物的压敏粘合剂层的压敏粘合片的底漆组合物,并且含有交联 其中聚硅氧烷化合物通过化学键交联到包含无机氧化物颗粒的芯的表面的结构。

    THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER
    4.
    发明申请
    THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER 审中-公开
    导热片,绝缘片和散热片

    公开(公告)号:US20120285674A1

    公开(公告)日:2012-11-15

    申请号:US13469988

    申请日:2012-05-11

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: F28F7/00

    摘要: A thermal conductive sheet contains a resin and a plate-like or flake-like filler. The average orientation angle of the filler is 29 degrees or more and the maximum orientation angle thereof is 65 degrees or more with respect to the plane direction of the thermal conductive sheet.

    摘要翻译: 导热片包含树脂和板状或片状填料。 填料的平均取向角相对于导热片的平面方向为29度以上,最大取向角为65度以上。

    SILICONE RESIN COMPOSITION CONTAINING FINE INORGANIC PARTICLES
    5.
    发明申请
    SILICONE RESIN COMPOSITION CONTAINING FINE INORGANIC PARTICLES 审中-公开
    含有精细无机颗粒的硅树脂组合物

    公开(公告)号:US20100036051A1

    公开(公告)日:2010-02-11

    申请号:US12488891

    申请日:2009-06-22

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08K3/22 C08L83/06 C08K3/10

    摘要: A silicone resin composition comprising fine inorganic particles, wherein the silicone resin composition is obtained by a step comprising reacting (A) a bifunctional alkoxysilane and/or a dual end-disilanol, and (B) a compound having an alkoxysilyl group at an end of a molecule, in the presence of a dispersion of said fine inorganic particles. The silicone resin composition of the present invention can be suitably used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like.

    摘要翻译: 一种有机硅树脂组合物,其包含无机微粒,其中所述有机硅树脂组合物通过以下步骤获得:(A)双官能烷氧基硅烷和/或双末端二硅烷醇,和(B)在末端二甲硅烷基末端具有烷氧基甲硅烷基的化合物 在所述无机细颗粒的分散体存在下分子。 本发明的有机硅树脂组合物可以适用于例如包封材料,涂料,成型材料,表面保护材料,粘合剂,粘合剂等。

    RESIN COMPOSITION CONTAINING FINE METAL OXIDE PARTICLES
    6.
    发明申请
    RESIN COMPOSITION CONTAINING FINE METAL OXIDE PARTICLES 审中-公开
    含有精细金属氧化物颗粒的树脂组合物

    公开(公告)号:US20100036033A1

    公开(公告)日:2010-02-11

    申请号:US12488872

    申请日:2009-06-22

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08K3/22

    摘要: A resin composition comprising fine metal oxide particles, wherein the resin composition is obtained by a step comprising subjecting (a) a silicon-containing compound represented by the formula (I): wherein each of R1 and R2 is independently an alkyl group or a phenyl group; and each of X1 and X2 is independently an alkyl group; and (b-i) a poly(dimethyl siloxanes) containing a methoxy group in an amount of from 10 to 50% by weight, or (b-ii) a silicon-containing compound represented by the formula (II): wherein each of R3 and R4 is independently a methyl group, an ethyl group, or a propyl group, to a reaction, in the presence of a dispersion of the fine metal oxide particles. The resin composition of the present invention can be suitably used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in cases where the resin composition of the present invention is used as an encapsulating material, the resin composition is suitably used for, for example, a photosemiconductor device mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

    摘要翻译: 一种包含金属氧化物微粒的树脂组合物,其中所述树脂组合物通过以下步骤获得:(a)由式(I)表示的含硅化合物:其中R 1和R 2各自独立地为烷基或苯基 组; X1和X2各自独立地为烷基; 和(b)含有10至50重量%的甲氧基的聚(二甲基硅氧烷),或(b-ii)由式(II)表示的含硅化合物:其中R3和 R 4独立地是甲基,乙基或丙基,在金属氧化物微粒分散体的存在下进行反应。 本发明的树脂组合物可以适用于例如包封材料,涂料,成型材料,表面保护材料,粘合剂,粘合剂等。 特别是在使用本发明的树脂组合物作为密封材料的情况下,树脂组合物适合用于例如安装有蓝色或白色LED元件的光半导体器件(液晶显示器的背光灯,交通灯, 户外大显示器,广告牌等)。

    COMPOSITION FOR SILICONE RESIN
    7.
    发明申请
    COMPOSITION FOR SILICONE RESIN 失效
    硅树脂组合物

    公开(公告)号:US20100160577A1

    公开(公告)日:2010-06-24

    申请号:US12644670

    申请日:2009-12-22

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08L83/06 C08G77/14

    摘要: A composition for a silicone resin containing a poly(methyl silsesquioxane) derivative having an alkoxysilyl group at an end of a molecule, and fine metal oxide particles having a reactive functional group on the surface thereof, wherein the composition further contains at least one compound selected from the group consisting of disilanol derivatives having silanol groups at both ends of a molecule and a monofunctional silane derivative represented by the formula (II): wherein X is an alkoxy group or a halogen atom. The silicone resin composition of the present invention can be suitably used as, for example, materials for encapsulating photosemiconductor elements for use in backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like.

    摘要翻译: 一种含有分子末端具有烷氧基甲硅烷基的聚(甲基倍半硅氧烷)衍生物及其表面具有反应性官能团的金属氧化物微粒的硅酮树脂组合物,其中所述组合物还含有至少一种选自 由分子两末端具有硅烷醇基的二硅烷醇衍生物和由式(II)表示的单官能硅烷衍生物组成的组:其中X为烷氧基或卤素原子。 本发明的有机硅树脂组合物可以适当地用作例如用于液晶显示器,交通信号灯,户外大显示器,广告标牌等的背光中的用于封装光半导体元件的材料。

    SILICONE RESIN COMPOSITION AND THERMAL CONDUCTIVE SHEET
    8.
    发明申请
    SILICONE RESIN COMPOSITION AND THERMAL CONDUCTIVE SHEET 审中-公开
    硅树脂组合物和导热片

    公开(公告)号:US20120309885A1

    公开(公告)日:2012-12-06

    申请号:US13488784

    申请日:2012-06-05

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C08L83/06 C08K3/28 C08K3/38

    CPC分类号: C09K5/14

    摘要: A silicone resin composition contains a borosiloxane resin containing a B—O—Si bond and boron nitride. A silicone resin composition contains an aluminosiloxane resin containing an Al—O—Si bond and aluminum nitride.

    摘要翻译: 有机硅树脂组合物含有含有B-O-Si键的硼硅氧烷树脂和氮化硼。 有机硅树脂组合物含有含有Al-O-Si键的铝硅氧烷树脂和氮化铝。

    THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER
    9.
    发明申请
    THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER 审中-公开
    导热片,绝缘片和散热片

    公开(公告)号:US20120286194A1

    公开(公告)日:2012-11-15

    申请号:US13469982

    申请日:2012-05-11

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: C09K5/14

    摘要: A thermal conductive sheet contains a resin and a filler. The filler contains a plate-like or flake-like first filler and a block-like or sphere-like second filler, and the average orientation angle of the first filler is 28 degrees or more and the maximum orientation angle thereof is 60 degrees or more with respect to the plane direction of the thermal conductive sheet.

    摘要翻译: 导热片含有树脂和填料。 填料含有板状或片状的第一填料和块状或球状的第二填料,第一填料的平均取向角为28度以上,最大取向角为60度以上 相对于导热片的平面方向。

    SILICONE RESIN COMPOSITION
    10.
    发明申请
    SILICONE RESIN COMPOSITION 失效
    硅树脂组合物

    公开(公告)号:US20110186792A1

    公开(公告)日:2011-08-04

    申请号:US13017198

    申请日:2011-01-31

    申请人: Keisuke HIRANO

    发明人: Keisuke HIRANO

    IPC分类号: F21V9/06

    摘要: The present invention relates to a silicone resin composition including a silicone resin and metal oxide fine particles dispersed therein, the silicone resin being obtained by reacting a siloxane derivative having at least one selected from the group consisting of an alkoxysilyl group and a silanol group at a molecular end thereof and having a weight-average molecular weight (Mw) as determined by a gel permeation method of 300 to 6,000, with silica fine particles having silanol groups on a surface thereof.

    摘要翻译: 本发明涉及含有硅树脂和分散在其中的金属氧化物微粒的有机硅树脂组合物,所述有机硅树脂通过使具有选自烷氧基甲硅烷基和硅烷醇基中的至少一种的硅氧烷衍生物在 分子末端,通过凝胶渗透法测定的重均分子量(Mw)为300〜6000,其表面具有硅烷醇基的二氧化硅微粒。