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公开(公告)号：US20080117402A1
公开(公告)日：2008-05-22
申请号：US11642987
申请日：2006-12-21
IPC分类号： G03B27/58
CPC分类号： H01L21/6835 , H01L21/67115 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2924/00
摘要： In an embodiment, a ring seal forming apparatus is disclosed, the apparatus including a substrate holder arranged to hold a substrate coated at least in part with resist, and a heating device configured to heat an area of the resist, relative movement between the substrate holder and heating device being possible, the movement being arranged such that, in use of the apparatus, the area of resist heated by the heating device is ring-shaped.
摘要翻译： 在一个实施例中，公开了一种环形密封形成装置，该装置包括：衬底保持器，其被布置成保持至少部分地涂覆有抗蚀剂的衬底;以及加热装置，其构造成加热抗蚀剂的区域，衬底保持器 并且加热装置是可能的，所述运动被布置成使得在使用该装置时，由加热装置加热的抗蚀剂的面积是环形的。
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公开(公告)号：US07567340B2
公开(公告)日：2009-07-28
申请号：US11529732
申请日：2006-09-29
CPC分类号： G03F7/70333 , G03F7/703
摘要： A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.
摘要翻译： 公开了一种器件制造方法，其包括在衬底台上提供衬底，所述衬底具有包括多个大体上平坦的表面的目标区域，每个表面相对于衬底台具有不同的高度，确定每个大致平面的相对高度 将图案化的辐射束投影到基板的目标区域上，使得光束的焦平面基本上与大体上平坦的表面之一的平面重合，使基板台沿基本上平行于基板平面的方向移动 并且将所述图案化的辐射束投影到所述基板的目标区域上，使得所述光束的焦平面基本上与所述大体上平坦的表面中的另一个的平面重合。
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公开(公告)号：US20080085462A1
公开(公告)日：2008-04-10
申请号：US11529732
申请日：2006-09-29
IPC分类号： G03C5/00
CPC分类号： G03F7/70333 , G03F7/703
摘要： A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.
摘要翻译： 公开了一种器件制造方法，其包括在衬底台上提供衬底，所述衬底具有包括多个大体上平坦的表面的目标区域，每个表面相对于衬底台具有不同的高度，确定每个大致平面的相对高度 将图案化的辐射束投影到基板的目标区域上，使得光束的焦平面基本上与大体上平坦的表面之一的平面重合，使基板台沿基本上平行于基板平面的方向移动 并且将所述图案化的辐射束投影到所述基板的目标区域上，使得所述光束的焦平面基本上与所述大体上平坦的表面中的另一个的平面重合。
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公开(公告)号：US20090237635A1
公开(公告)日：2009-09-24
申请号：US12393805
申请日：2009-02-26
申请人： Keith Frank Best , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui , Johannes Onvlee , Rudy Jan Maria Pellens , Remi Daniel Marie Edart , Oleg Viacheslavovich Voznyi , Pascale Anne Maury
发明人： Keith Frank Best , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui , Johannes Onvlee , Rudy Jan Maria Pellens , Remi Daniel Marie Edart , Oleg Viacheslavovich Voznyi , Pascale Anne Maury
CPC分类号： G03F9/7084 , G03F7/70633 , G03F9/7076 , G03F9/708 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.
摘要翻译： 根据本发明的第一方面，提供了一种在设置在基板上的层上提供对准标记的光刻方法，所述方法包括在所述层的一定范围内定向的区域上提供对准标记 相对于其上设置有该层的基板的表面。
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公开(公告)号：US08576374B2
公开(公告)日：2013-11-05
申请号：US12393805
申请日：2009-02-26
申请人： Keith Frank Best , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui , Johannes Onvlee , Rudy Jan Maria Pellens , Remi Daniel Marie Edart , Oleg Viacheslavovich Voznyi , Pascale Anne Maury
发明人： Keith Frank Best , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui , Johannes Onvlee , Rudy Jan Maria Pellens , Remi Daniel Marie Edart , Oleg Viacheslavovich Voznyi , Pascale Anne Maury
CPC分类号： G03F9/7084 , G03F7/70633 , G03F9/7076 , G03F9/708 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.
摘要翻译： 根据本发明的第一方面，提供了一种在设置在基板上的层上提供对准标记的光刻方法，所述方法包括在所述层的一定范围内定向的区域上提供对准标记 相对于其上设置有该层的基板的表面。
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6.发明授权公开(公告)号：US06914664B2
公开(公告)日：2005-07-05
申请号：US10365603
申请日：2003-02-13
申请人： Keith Frank Best , Alexander Friz , Joseph J. Consolini , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui
发明人： Keith Frank Best , Alexander Friz , Joseph J. Consolini , Henricus Wilhelmus Maria Van Buel , Cheng-Qun Gui
IPC分类号： G01B11/00 , G03F7/20 , G03F9/00 , H01L21/027 , G03B27/42
CPC分类号： G03F9/7069 , G03F9/7076 , G03F9/7084
摘要： To align between layers having a large Z separation, an alignment system which illuminates reference markers with normally incident radiation is used. The alignment system has an illumination system that is telecentric on the substrate side.
摘要翻译： 为了在具有大Z分离的层之间进行对准，使用以正常入射辐射照亮参考标记的对准系统。 对准系统具有在基板侧上是远心的照明系统。
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公开(公告)号：US20080083818A1
公开(公告)日：2008-04-10
申请号：US11544000
申请日：2006-10-06
IPC分类号： B23K31/00
CPC分类号： B23K31/02 , B23K2101/40
摘要： A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.
摘要翻译： 一种在下基板的顶部测量具有上基板的键合衬底的接合质量的方法，所述方法包括蚀刻上衬底中的一个或多个窗口，使得可通过测量系统看到上衬底上的覆盖测量对准标记 并且通过测量系统可以看到下部基板上的覆盖测量对准标记，使用测量系统来测量覆盖测量对准标记的位置，确定上和下基板上相应的覆盖测量对准标记之间的距离，以及调整 考虑到上基板上的覆盖测量对准标记与下基板上的覆盖测量对准标记之间的偏移的确定的距离。
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公开(公告)号：US07562686B2
公开(公告)日：2009-07-21
申请号：US11317241
申请日：2005-12-27
申请人： Keith Frank Best , Geoffrey Norman Phillipps , Franciscus Godefridus Casper Bijnen , Enno Van Den Brink , Henricus Wilhelmus Maria Van Buel , Joseph J. Consolini , Peter Ten Berge
发明人： Keith Frank Best , Geoffrey Norman Phillipps , Franciscus Godefridus Casper Bijnen , Enno Van Den Brink , Henricus Wilhelmus Maria Van Buel , Joseph J. Consolini , Peter Ten Berge
CPC分类号： H01L25/50 , B81C3/001 , G03F9/7084 , H01L24/26 , H01L24/83 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01041 , H01L2924/01061 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/00
摘要： A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.
摘要翻译： 基板接合系统具有用于分别保持第一基板和第二基板的第一和第二基板台，以及控制器。 第一衬底包括具有第一接触焊盘的第一器件，而第二衬底具有第二接触焊盘的第二器件。 晶片接合系统布置成以第一和第二器件形成电路的方式结合第一和第二器件。 第一和第二衬底台各自包括位置传感器，其布置成分别测量在第一和第二衬底的对准标记上产生的光信号。 第一和第二衬底台包括分别设置成改变相应衬底台的位置和取向的第一和第二致动器。
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公开(公告)号：US07133117B2
公开(公告)日：2006-11-07
申请号：US10995309
申请日：2004-11-24
IPC分类号： G03B27/54 , H01L21/301
CPC分类号： G03F7/70425 , G03F7/70633 , G03F9/7003 , G03F9/7076 , G03F9/708 , G03F9/7084 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/54466 , H01L2924/0002 , H01L2924/00
摘要： A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that etches reversed alignment markers on a first side of a substrate to a depth of 10 μm, the substrate is flipped over, and bonded to a carrier wafer and then lapped or ground to a thickness of 10 μm to reveal the reversed alignment markers as normal alignment markers. The reversed alignment markers may comprise normal alignment patterns overlaid with mirror imaged alignment patterns.
摘要翻译： 本文提供了能够对基板两侧的结构进行成像的装置制造方法。 本发明的一个实施例包括一种器件制造方法，其将衬底的第一侧上的反向对准标记刻蚀至10μm的深度，将衬底翻转，并结合到载体晶片上，然后研磨或研磨至厚度 为10个，以显示反向比对标记作为正常对准标记。 反向的对准标记可以包括覆盖有镜像对准图案的正常对准图案。
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公开(公告)号：US06844244B2
公开(公告)日：2005-01-18
申请号：US10738990
申请日：2003-12-19
IPC分类号： G03F7/20 , G03F9/00 , H01L21/027 , H01L21/301 , H01L23/544
CPC分类号： G03F7/70425 , G03F7/70633 , G03F9/7003 , G03F9/7076 , G03F9/708 , G03F9/7084 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/54466 , H01L2924/0002 , H01L2924/00
摘要： A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that etches reversed alignment markers on a first side of a substrate to a depth of 10 μm, the substrate is flipped over, and bonded to a carrier wafer and then lapped or ground to a thickness of 10 μm to reveal the reversed alignment markers as normal alignment markers. The reversed alignment markers may comprise normal alignment patterns overlaid with mirror imaged alignment patterns.
摘要翻译： 本文提供了能够对基板两侧的结构进行成像的装置制造方法。 本发明的一个实施例包括一种器件制造方法，其将衬底的第一侧上的反向对准标记刻蚀至10μm的深度，将衬底翻转，并结合到载体晶片上，然后研磨或研磨至厚度 为10个，以显示反向比对标记作为正常对准标记。 反向的对准标记可以包括覆盖有镜像对准图案的正常对准图案。
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