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    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    4.
    发明申请
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 审中-公开
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US20050211427A1

    公开(公告)日：2005-09-29

    申请号：US10882142

    申请日：2004-06-29

    申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    IPC分类号： G05D23/00

    CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
    6.
    发明授权
    Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
    用于在发热装置中实现温度均匀性和热点冷却的方法和装置

    公开(公告)号：US07104312B2

    公开(公告)日：2006-09-12

    申请号：US10698304

    申请日：2003-10-30

    申请人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

    发明人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

    IPC分类号： F28F7/00

    CPC分类号： F28F3/048 ,  F04B19/006 ,  F28D15/00 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

    摘要翻译： 一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。 该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。 该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。 通过优化和控制热交换器中的流体和热电阻来最小化温差。 对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
    7.
    发明申请
    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 审中-公开
    用于微通道热交换器中压降降低的交错歧管

    公开(公告)号：US20050211417A1

    公开(公告)日：2005-09-29

    申请号：US10881980

    申请日：2004-06-29

    申请人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    发明人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F04B19/00 ,  F28D15/02 ,  F28F3/12 ,  H01L23/473 ,  F28F7/00

    CPC分类号： H01L23/473 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F13/185 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

    摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    8.
    发明授权
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 有权
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US06988534B2

    公开(公告)日：2006-01-24

    申请号：US10439635

    申请日：2003-05-16

    申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

    发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F28F7/00

    CPC分类号： G06Q20/20 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28D21/0015 ,  F28F3/12 ,  F28F13/06 ,  F28F2210/10 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
    9.
    发明授权
    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 有权
    用于微通道热交换器中压降降低的交错歧管

    公开(公告)号：US06986382B2

    公开(公告)日：2006-01-17

    申请号：US10439912

    申请日：2003-05-16

    申请人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

    发明人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F28F7/00

    CPC分类号： F28D15/0266 ,  F04B19/006 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

    摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。