METHOD OF AT LEAST PARTIALLY RELEASING AN EPITAXIAL LAYER
    1.
    发明申请
    METHOD OF AT LEAST PARTIALLY RELEASING AN EPITAXIAL LAYER 有权
    至少部分释放外延层的方法

    公开(公告)号:US20110294281A1

    公开(公告)日:2011-12-01

    申请号:US13130173

    申请日:2009-11-19

    IPC分类号: H01L21/20

    摘要: A method of at least partially releasing an epitaxial layer of a material from a substrate. The method comprises the steps of: forming a patterned sacrificial layer on the substrate such that the substrate is partially exposed and partially covered by the sacrificial layer; growing the epitaxial layer on the patterned sacrificial layer by nano-epitaxial lateral overgrowth such that the epitaxial layer is formed above an intermediate layer comprising the patterned sacrificial layer and said material; and selectively etching the patterned sacrificial layer such that the epitaxial layer is at least partially released from the substrate.

    摘要翻译: 从衬底至少部分地释放材料的外延层的方法。 该方法包括以下步骤:在衬底上形成图案化的牺牲层,使得衬底被部分地暴露并被牺牲层部分地覆盖; 通过纳米外延横向过度生长在图案化的牺牲层上生长外延层,使得外延层形成在包括图案化的牺牲层和所述材料的中间层的上方; 并且选择性地蚀刻图案化的牺牲层,使得外延层至少部分地从衬底上释放出来。

    Method of at least partially releasing an epitaxial layer
    2.
    发明授权
    Method of at least partially releasing an epitaxial layer 有权
    至少部分地释放外延层的方法

    公开(公告)号:US08859399B2

    公开(公告)日:2014-10-14

    申请号:US13130173

    申请日:2009-11-19

    IPC分类号: H01L21/02 H01L33/00 H01L33/20

    摘要: A method of at least partially releasing an epitaxial layer of a material from a substrate. The method comprises the steps of: forming a patterned sacrificial layer on the substrate such that the substrate is partially exposed and partially covered by the sacrificial layer; growing the epitaxial layer on the patterned sacrificial layer by nano-epitaxial lateral overgrowth such that the epitaxial layer is formed above an intermediate layer comprising the patterned sacrificial layer and said material; and selectively etching the patterned sacrificial layer such that the epitaxial layer is at least partially released from the substrate.

    摘要翻译: 从衬底至少部分地释放材料的外延层的方法。 该方法包括以下步骤:在衬底上形成图案化的牺牲层,使得衬底被部分地暴露并被牺牲层部分地覆盖; 通过纳米外延横向过度生长在图案化的牺牲层上生长外延层,使得外延层形成在包括图案化的牺牲层和所述材料的中间层的上方; 并且选择性地蚀刻图案化的牺牲层,使得外延层至少部分地从衬底上释放出来。