Method of applying an encapsulant material to an ink jet printhead
    4.
    发明授权
    Method of applying an encapsulant material to an ink jet printhead 有权
    将密封材料施加到喷墨打印头的方法

    公开(公告)号:US07121647B2

    公开(公告)日:2006-10-17

    申请号:US10679070

    申请日:2003-10-02

    IPC分类号: B41J2/16

    摘要: A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.

    摘要翻译: 提供了一种模板印刷的密封剂材料,用于保护热喷墨打印头墨盒中的电气部件。 还提供了通过模板印刷将密封材料施加到喷墨打印盒的方法。 该方法包括提供具有至少一个孔的模板,提供喷墨墨盒和将密封材料模版印刷到喷墨打印墨盒的一部分上,从而形成密封材料层以保护电气部件或其它打印头部件。

    Method of making a micro-fluid ejection device
    5.
    发明授权
    Method of making a micro-fluid ejection device 有权
    制造微流体喷射装置的方法

    公开(公告)号:US07690115B2

    公开(公告)日:2010-04-06

    申请号:US11386174

    申请日:2006-03-22

    IPC分类号: B21D53/76 B32B38/14

    摘要: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

    摘要翻译: 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径,用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构或盒体上,用粘合线印刷粘合线密度为至少约1.2mm-1的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上,用于将流体从容纳区域流动到其装置侧。

    Printed conductive connectors
    6.
    发明授权
    Printed conductive connectors 有权
    印刷导电连接器

    公开(公告)号:US07354794B2

    公开(公告)日:2008-04-08

    申请号:US11062019

    申请日:2005-02-18

    IPC分类号: H01L21/00

    摘要: Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

    摘要翻译: 将电路装置与半导体基板连接的方法和由该方法制成的微流体喷射装置。 一种方法包括印刷导电流体的细长条以将包含流体喷射致动器装置的半导体衬底上的第一接触焊盘与电迹线电路上的第二接触焊盘电互连,其中电迹线电路邻近并间隔开 从半导体衬底放置。 导电流体包含液体组分和导电颗粒组分。 将液体组分从导电颗粒组分移除以提供将第一接触垫和第二接触垫相互连接的导电材料的实心细长带。

    Inkjet printhead packaging tape for sealing nozzles
    7.
    发明授权
    Inkjet printhead packaging tape for sealing nozzles 有权
    用于密封喷嘴的喷墨打印头包装胶带

    公开(公告)号:US07669978B2

    公开(公告)日:2010-03-02

    申请号:US11699295

    申请日:2007-01-29

    CPC分类号: B41J2/14072

    摘要: An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

    摘要翻译: 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列,并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状,并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而,胶带不接触密封剂珠。 优选地,带具有比喷嘴板的宽度短的宽度部分。 以这种方式,密封剂珠可能比以前已知的更接近喷嘴孔。 反过来,加热器芯片可以减小尺寸并节省硅。

    Inkjet printhead packaging tape for sealing nozzles

    公开(公告)号:US07219979B2

    公开(公告)日:2007-05-22

    申请号:US10775939

    申请日:2004-02-10

    IPC分类号: B41J2/14 B41J2/16 B41J2/165

    CPC分类号: B41J2/14072

    摘要: An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

    Process for manufacturing a micro-fluid ejection device
    10.
    发明授权
    Process for manufacturing a micro-fluid ejection device 有权
    微流体喷射装置的制造方法

    公开(公告)号:US07043838B2

    公开(公告)日:2006-05-16

    申请号:US10880899

    申请日:2004-06-30

    IPC分类号: B21D53/76 B32B38/14 H05K3/32

    摘要: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

    摘要翻译: 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径,用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上,用于将流体从容纳区域流动到其装置侧。