公开(公告)号：US12094866B2

公开(公告)日：2024-09-17

申请号：US18203693

申请日：2023-05-31

申请人： Kioxia Corporation

发明人： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC分类号： G11C5/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/528 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H10B69/00

CPC分类号： H01L25/18 ,  G11C5/02 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H10B69/00 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

公开(公告)号：US11705444B2

公开(公告)日：2023-07-18

申请号：US17342748

申请日：2021-06-09

申请人： KIOXIA CORPORATION

发明人： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC分类号： G11C5/02 ,  H01L25/18 ,  H05K1/02 ,  H05K3/30 ,  H10B69/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065 ,  H05K1/18 ,  H01L23/528 ,  H01L25/00

CPC分类号： H01L25/18 ,  G11C5/02 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H10B69/00 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.