公开(公告)号：US11705444B2

公开(公告)日：2023-07-18

申请号：US17342748

申请日：2021-06-09

申请人： KIOXIA CORPORATION

发明人： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC分类号： G11C5/02 ,  H01L25/18 ,  H05K1/02 ,  H05K3/30 ,  H10B69/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065 ,  H05K1/18 ,  H01L23/528 ,  H01L25/00

CPC分类号： H01L25/18 ,  G11C5/02 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H10B69/00 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

公开(公告)号：US12094866B2

公开(公告)日：2024-09-17

申请号：US18203693

申请日：2023-05-31

申请人： Kioxia Corporation

发明人： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC分类号： G11C5/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/528 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H10B69/00

CPC分类号： H01L25/18 ,  G11C5/02 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H10B69/00 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

公开(公告)号：US11379027B2

公开(公告)日：2022-07-05

申请号：US16549464

申请日：2019-08-23

申请人： Kioxia Corporation

发明人： Hayato Masubuchi

IPC分类号： G06F1/28 ,  G11C14/00 ,  G11C16/10 ,  G11C16/30 ,  G11C5/14

摘要： An electronic device includes a power supply circuit, a first counter that counts the number of times that supply of external power to the power supply circuit is stopped, a second counter that is operated by a first power and counts the number of times that generation of the plurality of kinds of power is stopped, a third counter counting the number of times that any of the plurality of kinds of power is dropped to a predetermined voltage or less, a non-volatile first memory storing status information indicating whether or not supply of the external power to the power supply circuit is properly stopped, and a fourth counter that counts the number of times that the supply of the external power to the power supply circuit is properly stopped and the number of times that the supply of the external power to the power supply circuit is abnormally stopped.