Plasma-etching apparatus
    2.
    发明授权
    Plasma-etching apparatus 失效
    等离子体蚀刻装置

    公开(公告)号:US4243506A

    公开(公告)日:1981-01-06

    申请号:US69058

    申请日:1979-08-23

    IPC分类号: C23F4/00 H01J37/32 B01K1/00

    摘要: A "planar" type plasma-etching apparatus wherein one electrode is a metallic mesh electrode, while the other electrode is a metallic plate electrode, and wherein a work piece is placed outside the mesh electrode. This apparatus has the advantage that a work piece having a large area can be etched uniformly over its whole surface.

    摘要翻译: “平面”型等离子体蚀刻装置,其中一个电极是金属网状电极,而另一个电极是金属板电极,并且其中工件放置在网状电极的外部。 该装置的优点是可以在其整个表面上均匀地蚀刻具有大面积的工件。