公开(公告)号：US20230062556A1

公开(公告)日：2023-03-02

申请号：US17412887

申请日：2021-08-26

Applicant: Knowles Electronics, LLC

Inventor： Michael Kuntzman ,  Ken Deng ,  Faisal Zaman ,  Bing Yu ,  Vahid Naderyan ,  Peter V. Loeppert

IPC: B81B7/00

Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.

公开(公告)号：US20220155073A1

公开(公告)日：2022-05-19

申请号：US17138895

申请日：2020-12-31

Applicant: Knowles Electronics, LLC

Inventor： Ken Deng ,  Michael Pedersen ,  Jeremy Johnson ,  Kevin Meneou

IPC: G01C19/5712

Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

公开(公告)号：US12072350B2

公开(公告)日：2024-08-27

申请号：US17847979

申请日：2022-06-23

Applicant: Knowles Electronics, LLC

Inventor： Faisal Zaman ,  Shubham Shubham ,  Ken Deng

IPC: G01P15/125 ,  G01P1/00

CPC classification number: G01P15/125 ,  G01P1/00

Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.

公开(公告)号：US20240208800A1

公开(公告)日：2024-06-27

申请号：US18087602

申请日：2022-12-22

Applicant: Knowles Electronics, LLC

Inventor： Ken Deng ,  Bing Yu ,  Michael Pedersen ,  Nicholas Palcheck ,  Jeremy Johnson ,  Richard Li-Chen Chen

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0013 ,  B81C1/00111 ,  B81B2201/02 ,  B81B2203/0361 ,  B81B2203/0376 ,  B81C2201/0174

Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.

公开(公告)号：US20230417793A1

公开(公告)日：2023-12-28

申请号：US17847979

申请日：2022-06-23

Applicant: Knowles Electronics, LLC

Inventor： Faisal Zaman ,  Shubham Shubham ,  Ken Deng

IPC: G01P15/125 ,  G01P1/00

CPC classification number: G01P15/125 ,  G01P1/00

Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.

公开(公告)号：US20230192475A1

公开(公告)日：2023-06-22

申请号：US17869870

申请日：2022-07-21

Applicant: Knowles Electronics, LLC

Inventor： Ken Deng ,  Michael Pedersen ,  Richard Li-Chen Chen ,  Shubham Shubham ,  Faisal Zaman

IPC: B81B3/00 ,  G01C19/5755 ,  G01H11/06

CPC classification number: B81B3/0051 ,  G01C19/5755 ,  G01H11/06 ,  B81B2201/0235 ,  B81B2201/0285 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2203/055

Abstract: A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.

公开(公告)号：US11772961B2

公开(公告)日：2023-10-03

申请号：US17412887

申请日：2021-08-26

Applicant: Knowles Electronics, LLC

Inventor： Michael Kuntzman ,  Ken Deng ,  Faisal Zaman ,  Bing Yu ,  Vahid Naderyan ,  Peter V. Loeppert

IPC: B81B7/00

CPC classification number: B81B7/0041 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2207/093

Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.

公开(公告)号：US11609091B2

公开(公告)日：2023-03-21

申请号：US17138895

申请日：2020-12-31

Applicant: Knowles Electronics, LLC

Inventor： Ken Deng ,  Michael Pedersen ,  Jeremy Johnson ,  Kevin Meneou

IPC: G01C19/5712

Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.