摘要:
A computer implemented method for designing a semiconductor integrated circuit includes placing dummy pattern on a second interconnection layer positioned just above the first power line based on a placement result of the first power line, the dummy pattern having a long axis parallel with a direction of the first power line; and electrically connecting the dummy pattern to the first power line, based on placement results of the first power line and the dummy pattern.
摘要:
A semiconductor integrated circuit device includes a plurality of flip-flops, each of which has an external input terminal and external output terminal, the flip-flops being cascade-connected by having data output terminals respectively connected to data input terminals of the next-stage flip-flops. A reset signal is input via the external input terminal of the first-stage flip-flop and is sequentially transferred from the external output terminal thereof to the next-stage flip-flops. The reset signal is transferred via a transmission path different from the original data transmission path to reset all of the flip-flops.
摘要:
A method for designing a semiconductor integrated circuit, includes placing first, second and third cells, respectively including first stage synchronous circuit having signal propagation time, second stage synchronous circuit having a signal propagation time almost equal to the first stage synchronous circuit, and logic circuit; routing wirings so as to electrically connect the first to third cells; verifying signal propagation timing of the semiconductor integrated circuit having the first to third cells; adjusting the signal propagation timing based on critical path of the signal propagation timing of the semiconductor integrated circuit; and extracting the critical path to replace the second stage synchronous circuit by synchronous circuit of different synchronous type from the first stage synchronous circuit so as to provide a shorter signal propagation time than the first stage synchronous circuit.
摘要:
A computer implemented method for designing a semiconductor integrated circuit includes placing dummy pattern on a second interconnection layer positioned just above the first power line based on a placement result of the first power line, the dummy pattern having a long axis parallel with a direction of the first power line; and electrically connecting the dummy pattern to the first power line, based on placement results of the first power line and the dummy pattern.
摘要:
A stacked-chip device includes a first inductive chip having a first function, a second inductive chip having a second function different from the first function, which is stacked on the first inductive chip, and a third inductive chip having the second function, which is stacked on the second inductive chip. Each of the first, second and third inductive chips has transmitting inductors which transmit data and receiving inductors which receive data. The transmitting inductors and the receiving inductors are disposed in line symmetry to an axis of symmetry. The axes of symmetry of the first, second and third inductive chips are overlapped. Each of the second and third inductive chips is disposed in upside-down or back to front to the first inductive chip.
摘要:
A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.
摘要:
The facility of operation in a manufacturing process and the reliability of the finished product can be improved by making a design based on two basic wiring pattern layers in which wiring traces are formed with regularity, and a basic via array layer inserted between the two basic wiring pattern layers, in which vias are formed with regularity.
摘要:
A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.
摘要:
A semiconductor integrated circuit includes a first delay circuit generating a first delay clock; a second delay circuit generating a second delay clock; a first register registering a value of a first delay of the first delay clock; a second register registering a value of a second delay of the second delay clock; a clock supplying circuit supplying a clock signal to the first and second delay circuits; a phase comparator detecting a phase difference between the first and second delay clocks; and a built-in test circuit configured to control the first and second registers so that the value of the first delay can be registered in the first register and the value of the second delay can be registered in the second register.
摘要:
A semiconductor memory device including dynamic memory cells for which refresh operation is required, wherein one fundamental cycle consists of a normal operation for carrying out writing or reading into or from the memory cells and a refresh operation. This semiconductor memory device comprising: a refresh signal generating circuit supplied with a clock signal to generate a refresh signal indicating start of refresh; a count signal generating circuit supplied with the clock signal to generate a count signal required for selection of a memory cell to be refreshed, a refresh counter circuit supplied with the refresh signal and the count signal to select a word line and a bit line to which a memory cell to be refreshed is connected; and a precharge circuit supplied with the refresh signal to carry out precharge of the bit line for refresh.