摘要:
A stacked-chip device includes a first inductive chip having a first function, a second inductive chip having a second function different from the first function, which is stacked on the first inductive chip, and a third inductive chip having the second function, which is stacked on the second inductive chip. Each of the first, second and third inductive chips has transmitting inductors which transmit data and receiving inductors which receive data. The transmitting inductors and the receiving inductors are disposed in line symmetry to an axis of symmetry. The axes of symmetry of the first, second and third inductive chips are overlapped. Each of the second and third inductive chips is disposed in upside-down or back to front to the first inductive chip.
摘要:
A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.
摘要:
The facility of operation in a manufacturing process and the reliability of the finished product can be improved by making a design based on two basic wiring pattern layers in which wiring traces are formed with regularity, and a basic via array layer inserted between the two basic wiring pattern layers, in which vias are formed with regularity.
摘要:
A computer implemented method for designing a semiconductor integrated circuit includes placing dummy pattern on a second interconnection layer positioned just above the first power line based on a placement result of the first power line, the dummy pattern having a long axis parallel with a direction of the first power line; and electrically connecting the dummy pattern to the first power line, based on placement results of the first power line and the dummy pattern.
摘要:
A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.
摘要:
A semiconductor integrated circuit includes a first delay circuit generating a first delay clock; a second delay circuit generating a second delay clock; a first register registering a value of a first delay of the first delay clock; a second register registering a value of a second delay of the second delay clock; a clock supplying circuit supplying a clock signal to the first and second delay circuits; a phase comparator detecting a phase difference between the first and second delay clocks; and a built-in test circuit configured to control the first and second registers so that the value of the first delay can be registered in the first register and the value of the second delay can be registered in the second register.
摘要:
A semiconductor memory device including dynamic memory cells for which refresh operation is required, wherein one fundamental cycle consists of a normal operation for carrying out writing or reading into or from the memory cells and a refresh operation. This semiconductor memory device comprising: a refresh signal generating circuit supplied with a clock signal to generate a refresh signal indicating start of refresh; a count signal generating circuit supplied with the clock signal to generate a count signal required for selection of a memory cell to be refreshed, a refresh counter circuit supplied with the refresh signal and the count signal to select a word line and a bit line to which a memory cell to be refreshed is connected; and a precharge circuit supplied with the refresh signal to carry out precharge of the bit line for refresh.
摘要:
A semiconductor integrated circuit according to an example of the present invention includes a chip substrate, first and second switches arranged on the chip substrate in which ON/OFF of an electrical signal path is directly controlled by an optical signal, a first light shielding layer arranged above the chip substrate, an optical waveguide layer arranged on the first light shielding layer, a second light shielding layer arranged on the optical waveguide layer, a reflecting plate arranged in the optical waveguide layer to change an advancing direction of the optical signal, and means for leading the optical signal to the first and second switches from an inside of the optical waveguide layer. The first and second light shielding layers reflect the optical signal, and the optical waveguide layer transmits the optical signal radially.
摘要:
A latch circuit includes first and second inverters connected in a cross-coupling manner at a first node and a second node. A voltage application circuit applies a hot carrier generation voltage for generating hot carrier at a transistor included in the first inverter or the second inverter. An inverting circuit generates an inversion signal as an inverted signal of an amplified signal provided from the latch circuit to the bit line pair to provide the inversion signal to the first node and the second node.
摘要:
An upper-layer metal power standard cell comprises: a basic power metal layer which is disposed in an upper layer of a circuit and which supplies a power voltage from an outside of the upper-layer metal power standard cell; a transistor element layer which is formed in a predetermined arrangement on a circuit substrate under the basic power metal layer; and an inner wire layer which supplies the power voltage to the transistor element layer disposed under the basic power metal layer disposed in the upper layer from the basic power metal layer.