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    Flexible printed-circuit boards bonding method and printed circuit board
    1.
    发明授权
    Flexible printed-circuit boards bonding method and printed circuit board 失效
    柔性印刷电路板接合方法和印刷电路板

    公开(公告)号：US07958632B2

    公开(公告)日：2011-06-14

    申请号：US11589239

    申请日：2006-10-30

    申请人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    发明人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    IPC分类号： H01R43/00 ,  H05K1/00

    CPC分类号： H05K3/361 ,  H01L2924/19107 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/09781 ,  H05K2203/0285 ,  H05K2203/049 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

    摘要翻译： 作为柔性印刷电路基板的第一布线基板与第二布线基板接合。 在第二布线板的表面上形成有多个突出部件。 粘合剂沉积在第二布线板的表面上，使得在突出构件上存在比在其它区域更薄的粘合剂层。 随后，将第一布线板放置在第二布线板上，使得用于引线接合的第一布线板的一部分位于至少一个突出构件的上方。 由于粘合剂，第一布线板被接合到第二布线板。

    Flexible printed-circuit boards bonding method and printed circuit board
    2.
    发明申请
    Flexible printed-circuit boards bonding method and printed circuit board 失效
    柔性印刷电路板接合方法和印刷电路板

    公开(公告)号：US20070284135A1

    公开(公告)日：2007-12-13

    申请号：US11589239

    申请日：2006-10-30

    申请人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    发明人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    IPC分类号： H05K1/00

    CPC分类号： H05K3/361 ,  H01L2924/19107 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/09781 ,  H05K2203/0285 ,  H05K2203/049 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

    摘要翻译： 作为柔性印刷电路基板的第一布线基板与第二布线基板接合。 在第二布线板的表面上形成有多个突出部件。 粘合剂沉积在第二布线板的表面上，使得在突出构件上存在比在其它区域更薄的粘合剂层。 随后，将第一布线板放置在第二布线板上，使得用于引线接合的第一布线板的一部分位于至少一个突出构件的上方。 由于粘合剂，第一布线板被接合到第二布线板。

    Substrate, substrate adapted for interconnecting optical elements and optical module
    4.
    发明申请
    Substrate, substrate adapted for interconnecting optical elements and optical module 失效

    公开(公告)号：US20060028926A1

    公开(公告)日：2006-02-09

    申请号：US11017811

    申请日：2004-12-22

    申请人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    发明人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    IPC分类号： G11B11/00

    CPC分类号： G02B6/4202 ,  G02B6/4221

    摘要： The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

    Electronic part and circuit substrate
    6.
    发明授权
    Electronic part and circuit substrate 有权
    电子部件和电路基板

    公开(公告)号：US07874847B2

    公开(公告)日：2011-01-25

    申请号：US11898713

    申请日：2007-09-14

    申请人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    发明人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    IPC分类号： H01R12/00

    CPC分类号： H05K3/326 ,  H01R13/2421 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/094 ,  H05K2201/10734

    摘要： Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.

    摘要翻译： 通过将形成为形成为电路基板的电接触器的电连接端子的焊料凸块和形成为电路基板的电接触器的螺旋接触器彼此接触来建立电连接。 焊料凸点形成为使得其高度相对于其上形成焊料凸块的表面彼此不同。

    Optical module and manufacturing method thereof
    7.
    发明授权
    Optical module and manufacturing method thereof 有权
    光模块及其制造方法

    公开(公告)号：US07674017B2

    公开(公告)日：2010-03-09

    申请号：US12182717

    申请日：2008-07-30

    申请人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    发明人： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

    IPC分类号： F21V29/00

    CPC分类号： G02B6/4201 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/066 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2018

    摘要： An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

    摘要翻译： 根据本发明的光学模块包括电布线基板，安装在电布线基板上的第一光学元件，使得第一光学元件的发热部分相对靠近电布线基板的基板表面定位， 散热器安装在与电布线基板上的第一光学元件的安装平面相同的平面上，散热器安装在电布线基板上，使得电布线基板上的电布线的区域与散热器重叠。 这提高了光学模块的散热效率。

    Substrate, substrate adapted for interconnecting optical elements and optical module
    8.
    发明授权
    Substrate, substrate adapted for interconnecting optical elements and optical module 失效
    基板，适用于互连光学元件的基板和光学模块

    公开(公告)号：US07519243B2

    公开(公告)日：2009-04-14

    申请号：US11017811

    申请日：2004-12-22

    申请人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    发明人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    IPC分类号： G02B6/12

    CPC分类号： G02B6/4202 ,  G02B6/4221

    摘要： The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

    摘要翻译： 本发明提供了能够在厚度方向上透过光以提高基板的有用性的基板10。 其目的是提供适于互连光学元件的基板，从而减少导致小型化和低成本的部件的数量，以及导致低功耗的高效且稳定的光耦合。 为了实现该目的，衬底包括衬底主体，其中它包括设置在第一衬底主体表面上的电布线层，以便能够电连接安装在第一衬底主体表面侧上的第一光学元件; 以及光传输路径，在电配线层电连接的第一光学元件与设置在第二基板主体表面的与衬底本体中的第一衬底主体表面不同的一侧的第二光学元件之间传播和接收传播光。

    Multiplexer-demultiplexer, receiver, transmitter, and manufacturing method
    9.
    发明申请
    Multiplexer-demultiplexer, receiver, transmitter, and manufacturing method 审中-公开
    多路复用器解复用器，接收机，发射机和制造方法

    公开(公告)号：US20080112668A1

    公开(公告)日：2008-05-15

    申请号：US11896305

    申请日：2007-08-30

    申请人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    发明人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    IPC分类号： G02B6/28 ,  B32B17/00

    CPC分类号： G02B6/29362 ,  G02B6/2938

    摘要： A multiplexer-demultiplexer includes a first lens, a multilayer filter, and a second lens. The first lens is positioned to collimate a multi-wavelength light having various wavelengths. The multilayer filter includes multiple filter films each arranged at a different angle, is positioned such that collimated multi-wavelength light enters and/or exits at an angle, separates the collimated multi-wavelength light into single-wavelength light according to wavelength, and reflects each of the single-wavelength light. The second lens is positioned to converge each of the single-wavelength lights separated by the multilayer filter at a different position.

    摘要翻译： 多路复用器 - 解复用器包括第一透镜，多层滤光器和第二透镜。 第一透镜被定位成准直具有各种波长的多波长光。 多层滤波器包括各自以不同角度布置的多个滤光片，定位成使得准直的多波长光以一定角度进入和/或退出，将准直的多波长光根据波长分离为单波长光，并且反射 每个单波长的光。 第二透镜被定位成将由多层滤光器分离的每个单波长光会聚在不同的位置。

    Optical module
    10.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US07583867B2

    公开(公告)日：2009-09-01

    申请号：US11064454

    申请日：2005-02-24

    申请人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    发明人： Koji Terada ,  Jun Matsui ,  Hiroyuki Nobuhara

    IPC分类号： G02B6/12

    CPC分类号： H05K1/189 ,  G02B6/4201 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/02 ,  H05K2201/09063 ,  H05K2201/10121

    摘要： An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

    摘要翻译： 光学模块包括执行光信号和电信号之间的转换的光电元件; 具有第一表面和第二表面的主体，所述第一表面和所述第二表面相互连续并相邻; 以及安装在所述本体上的电路板，所述电路板具有沿着所述第一表面和所述第二表面弯曲的弯曲部分。 光电元件安装在与弯曲部分邻接的第一表面上的一个部分上。 形成有用于外部连接的布线单元的电布线板安装在布置在第二表面上的另一部分上。