公开(公告)号：US07650692B2

公开(公告)日：2010-01-26

申请号：US12052087

申请日：2008-03-20

Applicant: Kunihiro Koyama ,  Muneyoshi Yamamoto ,  Takanori Uejima ,  Dai Nakagawa ,  Masaki Kimura

Inventor： Kunihiro Koyama ,  Muneyoshi Yamamoto ,  Takanori Uejima ,  Dai Nakagawa ,  Masaki Kimura

IPC: H05K3/30

CPC classification number: H01L25/165 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/288 ,  H05K3/303 ,  H05K2201/0125 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/083 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract translation: 吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于 作为最高的表面安装器件的晶体管的上端。 吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。 然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

公开(公告)号：US20060141259A1

公开(公告)日：2006-06-29

申请号：US11359676

申请日：2006-02-22

Applicant: Jessica Voss-Kehi ,  Kurl Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

Inventor： Jessica Voss-Kehi ,  Kurl Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

IPC: B32B27/00

CPC classification number: H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/22 ,  H05K2201/0125 ,  H05K2201/0257 ,  H05K2201/0329 ,  H05K2203/013 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2857 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31938

Abstract: Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using the method and composition are also disclosed.

公开(公告)号：US06906268B2

公开(公告)日：2005-06-14

申请号：US10022821

申请日：2001-12-14

Applicant: Arjang Fartash ,  Christopher D. Combs ,  Raiyomand Aspandiar ,  Tom E. Pearson

Inventor： Arjang Fartash ,  Christopher D. Combs ,  Raiyomand Aspandiar ,  Tom E. Pearson

IPC: H05K3/30 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/303 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/0125 ,  H05K2201/09072 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49153

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

Abstract translation: 一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。 保持器包括热收缩构件和保持构件。 由热收缩材料形成的热收缩构件被构造成从预先组装在其一侧上的部件接收通过形成在双面印刷电路板中的开口延伸的柱。 保持构件与热收缩构件联接，并且双面印刷电路板基本上设置在保持构件和部件之间。 当双面印刷电路板的相反侧被填充和回流时，热收缩构件被构造成可收缩地接合柱，将倒置的部件保持在双面印刷电路板上。

公开(公告)号：US06861345B2

公开(公告)日：2005-03-01

申请号：US09736795

申请日：2000-12-14

Applicant: Michael B. Ball ,  Chad A. Cobbley

Inventor： Michael B. Ball ,  Chad A. Cobbley

IPC: H01L21/60 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/0041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0125 ,  H05K2201/0191 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of forming conductive structures on the contact pads of a substrate,such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.

Abstract translation: 在诸如半导体管芯或印刷电路板的衬底的接触焊盘上形成导电结构的方法。 焊接掩模固定到基板的有效表面。 通过焊接掩模的孔径与衬底上的接触焊盘对准。 可以在其包含焊料掩模的材料层已经布置在基底上之后预先形成或形成孔。 导电材料设置在焊接掩模的孔中并由其形成，以形成与暴露于孔的接触焊盘相连通的导电结构。 通过焊接掩模暴露出导电结构的侧面，通过从衬底去除焊接掩模或通过减小焊接掩模的厚度。 本发明还包括在本发明方法的不同阶段形成的半导体器件。

公开(公告)号：US20030070292A1

公开(公告)日：2003-04-17

申请号：US10186712

申请日：2002-07-02

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Nobuyoshi Tatoh ,  Jun Yorita

IPC: H05K003/02 ,  H05K003/10

CPC classification number: H01L23/498 ,  H01L23/15 ,  H01L23/3735 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01S5/02 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/062 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/0125 ,  H05K2201/098 ,  H05K2203/0597 ,  H05K2203/1105 ,  H05K2203/1184 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2224/45099

Abstract: A circuit board comprising a patterned first metal layer 14 formed on a ceramic substrate 11, a patterned second metal layer 16 formed on the first metal layer, and a third metal layer 17 formed covering the entire upper surface and side surfaces of the second metal layer and a part of the upper surface of the first metal layer, wherein portions of the first metal layer not covered by the third metal layer are reduced in width by etching. The circuit board has thick-film fine wiring patterns with high bonding strength between the wiring patterns and the substrate and high reliability and enables realization of high-output modules which are small in size and high in performance, by mounting at least one high-output semiconductor element thereon.

Abstract translation: 一种电路板，包括形成在陶瓷基板11上的图案化第一金属层14，形成在第一金属层上的图案化第二金属层16，以及覆盖第二金属层的整个上表面和第二金属层的整个表面的第三金属层17 以及第一金属层的上表面的一部分，其中未被第三金属层覆盖的第一金属层的部分通过蚀刻而减小宽度。 电路板具有在布线图案和基板之间具有高结合强度的厚膜精细布线图案，并且具有高可靠性，并且能够实现尺寸小且性能高的高输出模块，通过安装至少一个高输出 半导体元件。

公开(公告)号：US5404408A

公开(公告)日：1995-04-04

申请号：US235237

申请日：1994-04-29

Applicant: Harald Strohmaier ,  Joseph Sauer

Inventor： Harald Strohmaier ,  Joseph Sauer

IPC: H04R25/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/305 ,  H04R25/502 ,  H05K3/284 ,  H05K3/325 ,  H04R2225/021 ,  H04R2225/61 ,  H05K2201/0125 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/074 ,  H05K2203/085 ,  H05K2203/1311 ,  H05K3/281 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49146

Abstract: A miniature hearing aid to be worn at the head together with a corresponding manufacturing method are particularly proposed, this hearing aid being distinguished by a miniaturized amplifier unit that is simple to manufacture. A highly shrinkable glue and/or a film that can be sucked on by under-pressure, thereby fixes the electrical components against a carrier part and also holds them against the contacting locations under contacting pressure.

Abstract translation: 特别提出一种与相应的制造方法一起佩戴在头部的微型助听器，该助听器由制造简单的小型化放大器单元区分。 可以通过低压吸收的高收缩胶和/或膜，从而将电气部件固定在承载部件上，并将其抵抗接触压力下的接触位置。

公开(公告)号：US5326636A

公开(公告)日：1994-07-05

申请号：US953609

申请日：1992-09-29

Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  B32B9/00

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.

Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积性破裂的结果，当建立粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

公开(公告)号：US4725478A

公开(公告)日：1988-02-16

申请号：US772515

申请日：1985-09-04

Applicant: Eckart Mathias ,  William A. Feehley

Inventor： Eckart Mathias ,  William A. Feehley

IPC: H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/22 ,  B32B3/00 ,  B05D3/02

CPC classification number: H05K1/0313 ,  H05K3/0011 ,  H05K3/22 ,  H05K1/095 ,  H05K2201/0125 ,  H05K2201/0129 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24901 ,  Y10T428/24917

Abstract: The present invention relates to the manufacture of printed circuit boards and, particularly, to a process of miniaturizing said printed circuit board.

Abstract translation: 本发明涉及印刷电路板的制造，特别涉及一种使所述印刷电路板小型化的方法。

公开(公告)号：US4227240A

公开(公告)日：1980-10-07

申请号：US972197

申请日：1978-12-22

Applicant: John W. Shaffer ,  Donald E. Armstrong

Inventor： John W. Shaffer ,  Donald E. Armstrong

IPC: G03B15/04 ,  H05K1/00 ,  G03B15/02

CPC classification number: G03B15/0457 ,  G03B15/0442 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2201/0125 ,  H05K2201/0394 ,  H05K2203/175

Abstract: A photoflash unit comprising a plurality of high voltage type flashlamps mounted on a printed circuit board containing circuitry for sequentially igniting the flashlamps. A plurality of electrically conductive reflectors respectively associated with the flashlamps are disposed between the lamps and the circuit board, with each reflector having an aperture in alignment with a corresponding aperture in the circuit board. Connected in series with each but the last lamp of the array is a radiant-energy-activated disconnect switch comprising a strip of electrically conductive heat-shrinkable polymeric material which is attached at both ends to the circuit board so that the midportion of the strip bridges a respective one of the apertures therein. A sheet of electrically insulating material is interposed between the reflectors and circuit board to prevent shorting therebetween. A plurality of deformations, such as dimples, are formed in the insulating sheet for spacing the sheet from the disconnect switch strips.

Abstract translation: 一种闪光灯单元，包括安装在印刷电路板上的多个高压型闪光灯，其包含用于顺序点燃闪光灯的电路。 分别与闪光灯相关联的多个导电反射器设置在灯和电路板之间，每个反射器具有与电路板中的相应孔对准的孔。 与阵列中的每个阵列串联连接的是辐射能激活的断开开关，其包括导电的热收缩聚合物材料条，其两端连接到电路板，使得条带的中间部分 其中的孔中的相应一个。 电绝缘材料片插入在反射器和电路板之间以防止它们之间的短路。 在绝缘片中形成多个变形，例如凹坑，用于将片材与断开开关条隔开。

公开(公告)号：US20160007462A1

公开(公告)日：2016-01-07

申请号：US14333856

申请日：2014-07-17

Applicant: Hamilton Sundstrand Corporation

Inventor： Slade R. Culp ,  Sameh Dardona ,  Wayde R. Schmidt

IPC: H05K1/16 ,  B32B37/06 ,  H05K1/09 ,  H05K3/36 ,  H05K1/02 ,  C23C18/16 ,  H05K3/12

CPC classification number: H05K1/16 ,  B32B37/06 ,  B32B2305/72 ,  C23C18/1633 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/165 ,  H05K3/12 ,  H05K3/36 ,  H05K3/4617 ,  H05K2201/0125 ,  H05K2201/0129 ,  H05K2203/06 ,  H05K2203/1105

Abstract: A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

Abstract translation: 一种制造印刷电子器件的方法包括在第一衬底上印刷电子部件的痕迹以形成第一层。 该方法还包括在至少一个附加基底上印刷电子部件的痕迹以形成至少一个附加层。 第一层与至少一个附加层堆叠以形成组装的电气装置。 打印后至少有一层被修改。