公开(公告)号：US4963307A

公开(公告)日：1990-10-16

申请号：US271905

申请日：1988-11-16

申请人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

发明人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

IPC分类号： B29B11/12 ,  B29B11/14 ,  B29C37/00 ,  B29C43/00 ,  B29C43/56

CPC分类号： B29B11/14 ,  B29B11/12 ,  B29C37/006 ,  B29C43/006 ,  B29C43/56 ,  Y10T428/8305

摘要： A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

摘要翻译： 用于树脂模制半导体器件的树脂模制片具有由粉末状或颗粒状树脂形成的片状体。 树脂的颗粒被压实，以便在相邻的颗粒之间形成空隙。 至少片剂的外周区域被熔合，使得树脂颗粒被焊接在一起以形成基本上没有开放孔隙的细小且不可渗透的结构的连续层。 在片剂融合之前，将片剂空隙内捕集的内部空气抽吸除去，使得片剂基本上不含空气。 通过将颗粒状或粉末状的树脂材料放置在真空容器中，使树脂材料中的内部空气向外部拉出，然后向树脂材料施加压力和热量，从而至少将 将颗粒状树脂的质量熔合以一起焊接。 将如此形成的片剂熔化并强制地进料到其中容纳待模制的半导体器件的真空模腔中，从而气密地密封半导体器件。 因此，产生基本上没有空隙的半导体封装。

公开(公告)号：US4826931A

公开(公告)日：1989-05-02

申请号：US107336

申请日：1987-10-09

申请人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

发明人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

IPC分类号： B29B11/12 ,  B29B11/14 ,  B29C37/00 ,  B29C43/00 ,  B29C43/56 ,  C08G59/02 ,  C08J5/00

CPC分类号： B29B11/14 ,  B29B11/12 ,  B29C37/006 ,  B29C43/006 ,  B29C43/56 ,  Y10T428/8305

摘要： A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

摘要翻译： 用于树脂模制半导体器件的树脂模制片具有由粉末状或颗粒状树脂形成的片状体。 树脂的颗粒被压实，以便在相邻的颗粒之间形成空隙。 至少片剂的外周区域被熔合，使得树脂颗粒被焊接在一起以形成基本上没有开放孔隙的细小且不可渗透的结构的连续层。 在片剂融合之前，将片剂空隙内捕集的内部空气抽吸除去，使得片剂基本上不含空气。 通过将颗粒状或粉末状的树脂材料放置在真空容器中，使树脂材料中的内部空气向外部拉出，然后向树脂材料施加压力和热量，从而至少将 将颗粒状树脂的质量熔合以一起焊接。 将如此形成的片剂熔化并强制地进料到其中容纳待模制的半导体器件的真空模腔中，从而气密地密封半导体器件。 因此，产生基本上没有空隙的半导体封装。

公开(公告)号：US5281121A

公开(公告)日：1994-01-25

申请号：US817383

申请日：1992-01-06

申请人： Yasutsugu Tsutsumi ,  Sueyoshi Tanaka ,  Yutaka Morita

发明人： Yasutsugu Tsutsumi ,  Sueyoshi Tanaka ,  Yutaka Morita

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C33/30

CPC分类号： B29C45/2602 ,  Y10S425/228

摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.

摘要翻译： 树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合， 以及位置确定构件，其附接到每个追逐块，使得当它们组装时确定追踪块的位置，其中每个追逐块被附接到每个支撑构件，以便能够在垂直方向上移动， 给定范围内的横向。

公开(公告)号：US5108278A

公开(公告)日：1992-04-28

申请号：US666562

申请日：1991-03-08

申请人： Yasutsugu Tsutsumi ,  Sueyoshi Tanaka ,  Yutaka Morita

发明人： Yasutsugu Tsutsumi ,  Sueyoshi Tanaka ,  Yutaka Morita

IPC分类号： B29C33/30 ,  B29C33/76 ,  B29C45/26 ,  B29C45/36 ,  B29L31/34

CPC分类号： B29C45/2602 ,  Y10S425/228

摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.

摘要翻译： 树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合， 以及位置确定构件，其附接到中心块，使得当它们组装时确定跟踪块的位置，其中每个追逐块被附接到每个支撑构件，以便可以在垂直和横向方向上移动 在给定范围内。 中心块设置在支撑构件上，并且设置在夹具之间的中间板之间的两个追逐块之间，以形成一体的单元。

公开(公告)号：US5073375A

公开(公告)日：1991-12-17

申请号：US561707

申请日：1990-08-02

申请人： Mitsuhiro Yoshida ,  Yutaka Morita ,  Yoshio Ishino ,  Shigemitsu Ohsawa

发明人： Mitsuhiro Yoshida ,  Yutaka Morita ,  Yoshio Ishino ,  Shigemitsu Ohsawa

IPC分类号： A61K9/00 ,  A61K9/70 ,  A61K31/445 ,  A61K47/00 ,  A61K47/14 ,  A61P17/00 ,  A61P21/02 ,  A61P25/04 ,  A61P29/00

CPC分类号： A61K9/7053 ,  A61K31/445 ,  A61K47/14 ,  A61K9/0014 ,  A61K9/7076 ,  Y10S514/906

摘要： A pharmaceutical preparation for the percutaneous administration comprises eperisone or tolperisone, including salts thereof, and a monoglyceride of an aliphatic acid having 8 to 12 carbon atoms or/and an ester of lactic acid with an aliphatic alcohol having 12 to 18 carbon atoms. It is improved in the percutaneous absorption.

公开(公告)号：US5059427A

公开(公告)日：1991-10-22

申请号：US193713

申请日：1988-05-13

申请人： Mitsuhiro Yoshida ,  Yutaka Morita ,  Yoshio Ishino ,  Shigemitsu Ohsawa

发明人： Mitsuhiro Yoshida ,  Yutaka Morita ,  Yoshio Ishino ,  Shigemitsu Ohsawa

IPC分类号： A61K9/00 ,  A61K9/70 ,  A61K31/445 ,  A61K47/00 ,  A61K47/14 ,  A61P17/00 ,  A61P21/02 ,  A61P25/04 ,  A61P29/00

CPC分类号： A61K9/7053 ,  A61K31/445 ,  A61K47/14 ,  A61K9/0014 ,  A61K9/7076 ,  Y10S514/906

摘要： A pharmaceutical preparation for the percutaneous administration comprises eperisone or tolperisone, including salts thereof, and a monoglyceride of an aliphatic acid having 8 to 12 carbon atoms or/and an ester of lactic acid with an aliphatic alcohol having 12 to 18 carbon atoms. It is improved in the percutaneous absorption.

公开(公告)号：US4989240A

公开(公告)日：1991-01-29

申请号：US377380

申请日：1989-07-10

申请人： Chihiro Fuse ,  Yutaka Morita

发明人： Chihiro Fuse ,  Yutaka Morita

IPC分类号： H04M1/23 ,  H04M1/2745

CPC分类号： H04M1/23 ,  H04M1/27455 ,  H01H2221/082

摘要： A telephone having a closure removably covering an operation panel on the body of the telephone, and automatic dialing push buttons arranged on the closure for performing an automatic dialing function. Depression of the push button on the closure becomes effective when the operation panel is covered with the closure. When the push button is depressed in this state, prestored telephone number data is automatically transmitted to telephone lines as dial signals.

公开(公告)号：US4934920A

公开(公告)日：1990-06-19

申请号：US206743

申请日：1988-06-15

申请人： Shunji Yamauchi ,  Minoru Tanaka ,  Kenitiro Sakamoto ,  Yutaka Morita ,  Toru Kidera ,  Hiroki Mieda

发明人： Shunji Yamauchi ,  Minoru Tanaka ,  Kenitiro Sakamoto ,  Yutaka Morita ,  Toru Kidera ,  Hiroki Mieda

IPC分类号： B29C43/56 ,  B29C45/17 ,  B30B15/00

CPC分类号： B29C43/18 ,  B29C43/56 ,  B29C45/1701 ,  B30B15/0082 ,  B29C2791/001 ,  B29L2031/3406 ,  Y10T29/49121

摘要： An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust-collecting device for collecting dust which is suspended by the air inside the dust-proof cover.

摘要翻译： 一种半导体装置的制造装置，其特征在于，包括覆盖所述设备中的尘埃产生部分的防尘盖，所述设备例如用于进行由引线框架构成的半导体器件和半导体芯片的树脂模制的线模和芯片粘合 以及用于收集由防尘罩内的空气悬挂的灰尘的集尘装置。

公开(公告)号：US4283838A

公开(公告)日：1981-08-18

申请号：US11639

申请日：1979-02-12

申请人： Masahiro Yamane ,  Toshimi Watanabe ,  Keiji Itoga ,  Kiyoshi Ishibashi ,  Yutaka Morita ,  Isamu Yamamoto ,  Kiyoji Imanaka

发明人： Masahiro Yamane ,  Toshimi Watanabe ,  Keiji Itoga ,  Kiyoshi Ishibashi ,  Yutaka Morita ,  Isamu Yamamoto ,  Kiyoji Imanaka

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L25/11 ,  H01L21/28

CPC分类号： H01L23/49562 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3171 ,  H01L24/05 ,  H01L24/33 ,  H01L25/115 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/94 ,  H01L24/94 ,  H01L2924/10157 ,  H01L2924/12036 ,  H01L2924/1301 ,  Y10T29/49121 ,  Y10T29/5147

摘要： The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

摘要翻译： 本发明提供了一种塑料封装半导体器件，其包括具有多个半导体元件保持部件的连接金属板，所述多个半导体元件保持部件在一个方向上与至少两个连接臂串联连接，所述连接臂的截面积小于所述半导体 元件保持部，并且在连接方向上设置在所述半导体元件保持部的侧面的内侧。 本发明提供一种制备半导体器件的方法，所述半导体器件具有用作汽车二极管的大约5至50安培的相对较大的电流容量并且在批量生产中具有高质量。

公开(公告)号：US20080095841A1

公开(公告)日：2008-04-24

申请号：US11664725

申请日：2005-10-05

申请人： Toshio Suzuki ,  Masanobu Yasui ,  Satoshi Sugawara ,  Yutaka Morita

发明人： Toshio Suzuki ,  Masanobu Yasui ,  Satoshi Sugawara ,  Yutaka Morita

IPC分类号： A61K9/20 ,  A61K31/435 ,  A61K47/02 ,  A61P9/00 ,  A61K47/36

CPC分类号： A61K31/4422 ,  A61K9/0056

摘要： The present invention aims to provide a pharmaceutical composition containing a stable dihydropyridine compound, where improving the stability of dihydropyridine compounds in pharmaceutical compositions under influence of storage conditions and thus providing a pharmaceutical composition with superior handling ability and affordable administration. As such, the present invention is a pharmaceutical composition, comprising a dihydropyridine compound, and at least one selected from iron oxide and carrageenan; and a method for producing a pharmaceutical composition. In addition, the present invention is a method for stabilizing a dihydropyridine compound in a pharmaceutical composition, comprising mixing the dihydropyridine compound and at least one selected from iron oxide and carrageenan; and also a stabilizing agent, wherein the stabilizing agent is utilized for a pharmaceutical composition containing a dihydropyridine compound, and comprises at least one selected from iron oxide and carrageenan.

摘要翻译： 本发明的目的在于提供含有稳定的二氢吡啶化合物的药物组合物，其在储存条件的影响下提高药物组合物中二氢吡啶化合物的稳定性，从而提供具有优异的处理能力和可负担的施用的药物组合物。 因此，本发明是包含二氢吡啶化合物和选自氧化铁和角叉菜胶中的至少一种的药物组合物， 和药物组合物的制造方法。 此外，本发明是一种用于在药物组合物中稳定二氢吡啶化合物的方法，包括将二氢吡啶化合物和选自氧化铁和角叉菜聚糖中的至少一种混合; 还有稳定剂，其中稳定剂用于含有二氢吡啶化合物的药物组合物，并且包含选自氧化铁和角叉菜胶的至少一种。