摘要:
The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.
摘要:
A coaxial electrical connector comprises an outer conductor (10) having a tubular section (11); a central conductor (20) having a contact section (21) extending in the axial direction in the tubular section (11); and a dielectric block (30) molded to hold together both the conductors (10, 20). The central conductor (20) has a radial section (22) extending outwardly in the radial direction from the bottom of the contact section (21) and a connection portion (23A) on the bottom face of the radial section (22) for contact with a circuit board. The central conductor 20 has a surface-processed portion so as to form at least one of a raised portion (24) and an indented portion (22A) and is in contact with the dielectric block at the surface-processed portion.
摘要:
Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two-component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.
摘要:
Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.
摘要:
A machine tool capable of eliminating a laborious attachment/detachment work of a cover member is provided. The machine tool includes a door device 5 having a first door 6 to cover a machining-area opening 3e when machining a workpiece and a second door 7 to cover the machining-area opening 3e when not machining the workpiece and formed to be visible an inside thereof, in which the first door 6 and the second door 7 are arranged in a movable manner between a position-in-use covering the machining-area opening 3e and a position when opened opening the machining-area opening 3e.
摘要:
The invention provides: 1) a dispersion-type resin composition including polymer particles insoluble in an organic solvent, the resin composition being prepared by polymerizing a radically polymerizable unsaturated monomer in the organic solvent in the presence of a fluorine-type resin containing silane group and epoxy group; 2) a resin composition including polymer particles insoluble in an organic solvent, the resin composition being prepared by polymerizing a radically polymerizable unsaturated monomer in the organic solvent in the presence of a dispersion stabilizer comprising at least one of a component (I) having silane group, and a component (II) having epoxy group, at least one of components (I) and (II) being a fluorine-containing resin; 3) a curable composition including one of the resin compositions 1) and 2) and a metal chelate compound; and 4) a coating composition including one of the curable composition and the resin compositions.
摘要:
The invention provides:1) a fluorine-containing resin composition including:a) a fluorine-containing resin having (i) a hydrolyzable group attached directly to a silicon atom and/or a silanol group and (ii) an epoxy group in the molecule, orb) a mixture of a component (I) having a hydrolyzable group attached directly to a silicon atom and/or a silanol group and a component (II) having an epoxy group, such that at least one of the components (I) and (II) is a fluorine-containing resin;2) a curable composition including the resin composition and a metal chelate compound; and3) a coating composition including this resin composition or this curable composition.
摘要:
Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two-component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.
摘要:
The present invention provides a method for concentrating an aqueous solution containing at least 3-hydroxy-2,2-dimethyl propanal and/or a dimer thereof, which includes subjecting a mixed solution of an aqueous solution containing at least 3-hydroxy-2,2-dimethyl propanal and/or a dimer thereof and an azeotropic agent to azeotropic distillation in a distillation column to distil off water and the azeotropic agent from the mixed solution, wherein the mixed solution is prepared by adding, as the azeotropic agent, at least one selected from the group consisting of 1-butanol, 2-butanol, 2-methyl-1-propanol, 1-pentanol and 1-hexanol to the aqueous solution.
摘要:
A coaxial electrical connector includes an outer conductive body including a fitting portion having an opening portion for receiving a mating connector on one end portion side in a direction of an axis line, and an attachment portion formed of a surface perpendicular to the axis line on the other end portion side for attaching to a circuit board, and extending to substantially cover an area inside of a peripheral border of the fitting portion through a joining portion bent at a part of the peripheral border; a dielectric body retained and held inside of the fitting portion; and a central conductive body including a contact portion for contacting a mate central conductive body, a connection portion extending from the dielectric body in a radial direction and situated on a bottom surface of the attachment portion, and a retained portion for covering the retained portion.