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公开(公告)号：US09300062B2
公开(公告)日：2016-03-29
申请号：US13282172
申请日：2011-10-26
IPC分类号： H01R12/57 , H01R12/51 , H01L25/075 , H01L33/62
CPC分类号： H01R12/515 , H01L25/0753 , H01L33/62 , H01L2224/45139 , H01L2224/48137 , H01L2924/00014 , H01L2924/09701 , H01R12/57 , Y10T29/49002 , H01L2224/48091 , H01L2924/00 , H01L2924/00011 , H01L2224/45099
摘要： Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.
摘要翻译： 提供了用于发光装置的附件装置和方法。 在一个方面，发光器件可以包括设置在所述底座上的基座和发光区域。 该装置还可以包括设置在基座上的至少一个附接构件。 附接构件可以接合电气部件，从而在附接构件和电气部件之间提供气密的，无焊料的连接。
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公开(公告)号：USD705181S1
公开(公告)日：2014-05-20
申请号：US29412166
申请日：2012-01-31
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公开(公告)号：USD702653S1
公开(公告)日：2014-04-15
申请号：US29404913
申请日：2011-10-26
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公开(公告)号：US20120250310A1
公开(公告)日：2012-10-04
申请号：US13282172
申请日：2011-10-26
CPC分类号： H01R12/515 , H01L25/0753 , H01L33/62 , H01L2224/45139 , H01L2224/48137 , H01L2924/00014 , H01L2924/09701 , H01R12/57 , Y10T29/49002 , H01L2224/48091 , H01L2924/00 , H01L2924/00011 , H01L2224/45099
摘要： Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.
摘要翻译： 提供了用于发光装置的附件装置和方法。 在一个方面，发光器件可以包括设置在所述底座上的基座和发光区域。 该装置还可以包括设置在基座上的至少一个附接构件。 附接构件可以接合电气部件，从而在附接构件和电气部件之间提供气密的，无焊料的连接。
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公开(公告)号：USD703348S1
公开(公告)日：2014-04-22
申请号：US29426661
申请日：2012-07-09
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公开(公告)号：US08686445B1
公开(公告)日：2014-04-01
申请号：US12969267
申请日：2010-12-15
IPC分类号： H01L33/08
CPC分类号： H01L33/486 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A light emission package includes at least one solid state emitter, a leadframe including at least one electrical lead and a body structure encasing a portion of the leadframe. A thermal transfer material can be isolated from the at least one electrical lead. The body structure can include a plastic body structure wherein a rim portion can be disposed along a portion of the upper surface of the body structure. The light emission package can also include the at least one solid state emitter mounted over thermal transfer material using a direct metal-to-metal bond such as by eutectic die attachment. The light emission package is operable to emit light with an output of approximately 70% or greater of an initial light output for an extrapolated time of at least approximately 150,000 hours or more.
摘要翻译： 发光封装包括至少一个固态发射器，引线框架，其包括至少一个电引线和封装引线框架的一部分的主体结构。 热转印材料可以与至少一个电引线隔离。 身体结构可以包括塑料体结构，其中边缘部分可以沿着身体结构的上表面的一部分设置。 发光封装还可以包括使用直接金属 - 金属键（例如通过共晶管芯附接）安装在热转印材料上的至少一个固态发射器。 发光包可操作以发射具有大约70％或更大的初始光输出的光，用于至少约150,000小时或更长时间的外推时间。
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公开(公告)号：US08624271B2
公开(公告)日：2014-01-07
申请号：US13104558
申请日：2011-05-10
IPC分类号： H01L33/62
CPC分类号： H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
摘要翻译： 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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公开(公告)号：US08455908B2
公开(公告)日：2013-06-04
申请号：US13336540
申请日：2011-12-23
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。
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公开(公告)号：USD676395S1
公开(公告)日：2013-02-19
申请号：US29408955
申请日：2011-12-19
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10.发明授权公开(公告)号：US10211380B2
公开(公告)日：2019-02-19
申请号：US13309177
申请日：2011-12-01
摘要： Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.
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