公开(公告)号：US07002698B2

公开(公告)日：2006-02-21

申请号：US10721057

申请日：2003-11-24

申请人： Kyle Hanson ,  Mark Dix ,  Vlad Zila ,  Daniel J. Woodruff

发明人： Kyle Hanson ,  Mark Dix ,  Vlad Zila ,  Daniel J. Woodruff

IPC分类号： G01B11/14

CPC分类号： H01L21/67259 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/67781

摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear way comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

公开(公告)号：US06645355B2

公开(公告)日：2003-11-11

申请号：US09944828

申请日：2001-08-31

申请人： Kyle Hanson ,  Mark Dix ,  Vlad Zila ,  Daniel J. Woodruff

发明人： Kyle Hanson ,  Mark Dix ,  Vlad Zila ,  Daniel J. Woodruff

IPC分类号： C25D1700

CPC分类号： H01L21/67769 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/67781

摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

摘要翻译： 阐述了用于半导体晶片处理装置的提升/倾斜组件。 提升/倾斜组件包括包括固定框架和可移动框架的线性导轨。 用于接收多个半导体晶片的嵌座可旋转地连接到可移动框架。 当它由与可线性方式耦合的电动机用可移动框架驱动时，嵌套在晶片水平取向和晶片垂直取向之间旋转。 当嵌套处于晶片垂直方向时，连接到嵌套的杠杆提供与巢的真垂直的偏移。

公开(公告)号：US06672820B1

公开(公告)日：2004-01-06

申请号：US08990107

申请日：1997-12-15

申请人： Kyle Hanson ,  Mark Dix ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle

发明人： Kyle Hanson ,  Mark Dix ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle

IPC分类号： B65H500

CPC分类号： H01L21/681 ,  C25D7/12 ,  C25D17/001 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/67781

摘要： A transport system for manipulating a semiconductor wafer in a processing tool is set forth. The system includes a transport unit guide disposed within the processing tool for supporting a wafer transfer unit as the unit moves between a first position and a second position. The transport unit guide comprises a frame, a lateral guide rail mounted on the frame, and a series of magnetic segments arranged upon the transport unit guide proximate the lateral guide rail. The wafer transfer unit includes a tram translatably attached to the lateral guide rail and a wafer transfer arm assembly for manipulating the semiconductor wafer. An electromagnet is mounted on the tram in cooperative relation with the magnetic segments for moving the transfer unit along the guide rail. Actuators are used for controlling the position of the transfer unit and transfer arm assembly, and sensors are used for determining the position of the transfer unit and the transfer arm assembly. A controller is disposed remote of the wafer transfer unit and directs the movement of the transfer unit and transfer arm assembly in response to the sensors using the actuators. A communication link is established between the actuators, sensors and controller. Preferably, the communication link is a fiber optic link.

摘要翻译： 阐述了在处理工具中操纵半导体晶片的传送系统。 该系统包括设置在处理工具内的传送单元引导件，用于当单元在第一位置和第二位置之间移动时支撑晶片传送单元。 运输单元引导件包括框架，安装在框架上的横向导轨以及布置在靠近横向导轨的传送单元引导件上的一系列磁性段。 晶片传送单元包括可平移地附接到横向导轨的电车和用于操纵半导体晶片的晶片传送臂组件。 一个电磁铁与磁性部件协调地安装在电车上，用于沿着导轨移动传送单元。 驱动器用于控制传送单元和传送臂组件的位置，传感器用于确定传送单元和传送臂组件的位置。 控制器设置在远离晶片传送单元的位置，并响应于使用致动器的传感器引导传送单元和传送臂组件的移动。 在执行器，传感器和控制器之间建立通信链路。 优选地，通信链路是光纤链路。

公开(公告)号：US06654122B1

公开(公告)日：2003-11-25

申请号：US09618707

申请日：2000-07-18

申请人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

发明人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

IPC分类号： G01B1114

CPC分类号： H01L21/67259 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/67781

摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

公开(公告)号：US06091498A

公开(公告)日：2000-07-18

申请号：US991062

申请日：1997-12-15

申请人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

发明人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

IPC分类号： B65G49/07 ,  B25J9/06 ,  C25D7/12 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  G01B11/14 ,  G01N21/00

CPC分类号： H01L21/67259 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/67781

摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide/actuator comprising a fixed frame and a movable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the movable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

摘要翻译： 阐述了用于半导体晶片处理装置的提升/倾斜组件。 提升/倾斜组件包括具有固定框架和可移动框架的线性导向/致动器。 用于接收多个半导体晶片的嵌套可旋转地连接到可移动框架。 当它由与可线性方式耦合的电动机用可移动框架驱动时，嵌套在晶片水平取向和晶片垂直取向之间旋转。 当嵌套处于晶片垂直方向时，连接到嵌套的杠杆提供与巢的真垂直的偏移。

公开(公告)号：US20130299343A1

公开(公告)日：2013-11-14

申请号：US13468273

申请日：2012-05-10

申请人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D19/00

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002

摘要： An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

公开(公告)号：US08562752B2

公开(公告)日：2013-10-22

申请号：US13299141

申请日：2011-11-17

申请人： Daniel J. Woodruff

发明人： Daniel J. Woodruff

IPC分类号： B08B7/04 ,  B08B5/04 ,  B08B3/00 ,  B08B1/02 ,  B08B7/00 ,  B08B3/14 ,  B08B3/12 ,  B08B6/00

CPC分类号： C25D17/001 ,  C25D17/16 ,  H01L21/00 ,  Y10S134/902

摘要： A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receive and/or process semi-conductor wafers. The top of the process chamber also includes a tiltable rim. This rim tilts from a non-inclined position to an inclined position. The wafers may be loaded into and unloaded from the process chamber when the rim is in its inclined position.

摘要翻译： 用于处理半导体晶片的处理室。 该室包括处理室内的至少一个转子。 转子适于接收和/或处理半导体晶片。 处理室的顶部还包括可倾斜的边缘。 该边缘从非倾斜位置倾斜到倾斜位置。 当轮辋处于其倾斜位置时，晶片可以被装载到处理室中并从处理室卸载。

公开(公告)号：US08313631B2

公开(公告)日：2012-11-20

申请号：US12917997

申请日：2010-11-02

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

IPC分类号： C25D5/00

CPC分类号： C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25F3/30

摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.

摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。

公开(公告)号：US20120037495A1

公开(公告)日：2012-02-16

申请号：US12856357

申请日：2010-08-13

申请人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

IPC分类号： C25D17/10

CPC分类号： C25D17/001

摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

公开(公告)号：US07909967B2

公开(公告)日：2011-03-22

申请号：US11457192

申请日：2006-07-13

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25F7/00

摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。