FOAMED STRUCTURE AND RESIN PANEL
    1.
    发明申请

    公开(公告)号:US20190039279A1

    公开(公告)日:2019-02-07

    申请号:US16076367

    申请日:2017-02-15

    申请人: Kyoraku Co., Ltd.

    IPC分类号: B29C49/04

    摘要: A resin panel according to an embodiment includes a core material, a reinforcing material, a skin material covering the core material and the reinforcing material, and a fastened member. A reinforcing material has a first plate provided on a front surface of the core material, a second plate provided on a back surface of the core material, and a connecting plate connecting the first plate and the second plate. The fastened member is attached to the skin material by a fastening member penetrating the skin material and the first plate or the second plate of the reinforcing material.

    MOLDING PRODUCTION METHOD, MOLDING DIE, MOLDING PRODUCTION APPARATUS, BURR REMOVAL METHOD, AND BURR REMOVAL DEVICE

    公开(公告)号:US20210178653A1

    公开(公告)日:2021-06-17

    申请号:US16758617

    申请日:2018-10-30

    申请人: KYORAKU CO., LTD.

    IPC分类号: B29C49/50 B29C37/02

    摘要: A molding-forming method, a molding mold, and a molding production apparatus with which efficient burrs removal is possible without requiring a large apparatus. A molding production method includes, in addition to a molding being formed inside a mold, burrs formed around the molding are separated from the molding. After formation of the molding, air is blown inside the mold on at least a portion of the burrs formed around the molding to cool the same, a projecting member is projected toward the cooled burrs, and the burrs are separated from the molding. After pressing the burrs toward the projecting member by the air blowing, the burr is pressed toward the mold surface facing the projecting member by projection of the projecting member to separate the burr from the molding.

    RESIN RESIDUE REMOVAL DEVICE
    8.
    发明公开

    公开(公告)号:US20240109238A1

    公开(公告)日:2024-04-04

    申请号:US18262032

    申请日:2022-01-19

    申请人: KYORAKU CO., LTD.

    发明人: Tadatoshi TANJI

    摘要: A resin residue removal device is provided that is capable of appropriately removing a resin residue adhered to a lower surface of a die of a molding apparatus. The present invention provides a resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device including a moving mechanism and a resin residue removal head, wherein the moving mechanism is configured to move the resin residue removal head between a lateral position out of a position immediately below the die and an immediately below position as the position immediately below, and also in the immediately below position, to move the head between a separate position separate from the lower surface and a close position close to the lower surface, and the resin residue removal head is configured to allow removal of the resin residue adhered to the lower surface by moving along the lower surface.