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1.发明申请ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE 有权各向异性导电膜组合物，各向异性导电膜和半导体器件公开(公告)号：US20130154094A1
公开(公告)日：2013-06-20
申请号：US13713404
申请日：2012-12-13
申请人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
发明人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
IPC分类号： H01L23/498
CPC分类号： H01L23/49883 , C08K5/00 , C08K2201/001 , C09J7/20 , C09J9/00 , C09J11/08 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2423/04 , C09J2475/00 , H01B1/20 , H01L24/29 , H01L2224/2929 , H01L2224/29298 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2924/07802 , H01L2924/07811 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
摘要翻译： 半导体器件通过各向异性导电膜组合物结合。 各向异性导电膜组合物包括乙烯 - 乙酸乙烯酯共聚物，聚氨酯树脂和有机细颗粒。 各向异性导电膜组合物在80℃下的熔融粘度为约2,000〜约8,000Pa·s
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2.发明授权Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device 有权各向异性导电膜组合物，各向异性导电膜和半导体器件公开(公告)号：US09299654B2
公开(公告)日：2016-03-29
申请号：US13713404
申请日：2012-12-13
申请人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
发明人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kang Bae Yoon
IPC分类号： H01B1/06 , H01B1/24 , H01B1/02 , H01B1/22 , H01L23/498 , H01B1/20 , H01L23/00 , C09J7/02 , C09J9/00 , C09J11/08 , C08K5/00
CPC分类号： H01L23/49883 , C08K5/00 , C08K2201/001 , C09J7/20 , C09J9/00 , C09J11/08 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2423/04 , C09J2475/00 , H01B1/20 , H01L24/29 , H01L2224/2929 , H01L2224/29298 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2924/07802 , H01L2924/07811 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
摘要翻译： 半导体器件通过各向异性导电膜组合物结合。 各向异性导电膜组合物包括乙烯 - 乙酸乙烯酯共聚物，聚氨酯树脂和有机细颗粒。 各向异性导电膜组合物在80℃下的熔融粘度为约2,000〜约8,000Pa·s
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公开(公告)号：US09437346B2
公开(公告)日：2016-09-06
申请号：US14049243
申请日：2013-10-09
申请人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kyu Bong Kim , Woo Jun Lim
发明人： Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kyu Bong Kim , Woo Jun Lim
CPC分类号： H01B1/22 , C09J2201/602 , H01L24/29 , H01L24/32 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/32135 , H01L2224/32225 , H01L2224/81903 , H01L2224/83201 , H01L2224/8385 , H01L2224/9211 , H01L2924/07802 , H01L2924/07811 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
摘要翻译： 使用各向异性导电粘合剂组合物连接的半导体器件，所述各向异性导电粘合剂组合物包含热固性聚合引发剂; （甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯，其中（甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯以组合物中总重量的1重量％至25重量％的量存在于组合物中 组合固体含量。
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公开(公告)号：US09666552B2
公开(公告)日：2017-05-30
申请号：US14071999
申请日：2013-11-05
申请人： Young Ju Shin , Kyu Bong Kim , Hyun Joo Seo , Kyoung Hun Shin , Woo Jun Lim
发明人： Young Ju Shin , Kyu Bong Kim , Hyun Joo Seo , Kyoung Hun Shin , Woo Jun Lim
CPC分类号： H01L24/29 , C09J9/02 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/81191 , H01L2224/83851 , H01L2924/07802 , H01L2924/07811 , H01L2924/00
摘要： A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.
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公开(公告)号：US09252117B2
公开(公告)日：2016-02-02
申请号：US14072872
申请日：2013-11-06
申请人： Kyoung Hun Shin , Kyu Bong Kim , Hyun Joo Seo , Young Ju Shin , Woo Jun Lim
发明人： Kyoung Hun Shin , Kyu Bong Kim , Hyun Joo Seo , Young Ju Shin , Woo Jun Lim
CPC分类号： H01L24/29 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/27502 , H01L2224/2784 , H01L2224/29082 , H01L2224/2929 , H01L2224/29291 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29386 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2924/07811 , H01L2924/20104 , H01L2924/20105 , H01L2924/00
摘要： A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.
摘要翻译： 通过各向异性导电膜连接的半导体器件，该膜在固化后在40℃下的储能模量为100MPa〜300MPa，DSC的峰值点为80℃〜90℃ （差示扫描量热仪）轮廓。
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