公开(公告)号：US07381468B2

公开(公告)日：2008-06-03

申请号：US10920456

申请日：2004-08-18

申请人： Kyung Wook Paik ,  Kyung Woon Jang ,  Sung Dong Cho

发明人： Kyung Wook Paik ,  Kyung Woon Jang ,  Sung Dong Cho

IPC分类号： B32B27/38 ,  C08L63/00

CPC分类号： H01G4/206 ,  H05K1/162 ,  H05K2201/0209 ,  Y10T29/417 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 μm dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste enables the formation of a dielectric layer having a high dielectric constant. The polymer/ceramic composite paste can be applied by a screen printing technique and is planarized to locally form a polymer/ceramic composite dielectric layer having a thickness of, e.g., up to 20 μm on a desired region. Accordingly, electrical parasitics resulting from the formation of a capacitor on unwanted regions can be reduced, and the capacitance error can be reduced.

摘要翻译： 用于嵌入式电容器的聚合物/陶瓷复合糊剂包括有机溶剂，分散在有机溶剂中的粒径不大于20μm的陶瓷粉末，聚合物和硬化剂。 使用聚合物/陶瓷复合糊剂能够形成具有高介电常数的介电层。 聚合物/陶瓷复合浆料可以通过丝网印刷技术施加，并且被平坦化以局部形成在所需区域上具有例如至多20μm的厚度的聚合物/陶瓷复合介电层。 因此，可以减少在不想要的区域上形成电容器所引起的电寄生现象，并且可以减小电容误差。

公开(公告)号：US20120018084A1

公开(公告)日：2012-01-26

申请号：US13177064

申请日：2011-07-06

申请人： Kyung Woon Jang ,  Seungbae Park ,  Young Jun Moon ,  Soon Min Hong ,  Chang-kyu Chung ,  Dae Jung Kim ,  Sang il Hong

发明人： Kyung Woon Jang ,  Seungbae Park ,  Young Jun Moon ,  Soon Min Hong ,  Chang-kyu Chung ,  Dae Jung Kim ,  Sang il Hong

IPC分类号： H05K7/00

CPC分类号： H05K3/305 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83851 ,  H01L2224/83862 ,  H05K3/323 ,  H05K2203/0278 ,  H05K2203/068 ,  Y02P70/613 ,  H01L2924/00012

摘要： Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.

摘要翻译： 这里公开了印刷电路板组件制造装置和制造印刷电路板组件的方法。 印刷电路板组装制造装置可以包括定影单元，其被配置为固化用于将具有不同高度的电子部件固定到印刷电路板的导电粘合剂。 定影单元可以被配置为固化导电粘合剂，同时向具有不同高度的电子部件施加压力。

公开(公告)号：US08327534B2

公开(公告)日：2012-12-11

申请号：US12926923

申请日：2010-12-17

申请人： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

发明人： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

IPC分类号： H01K3/10

CPC分类号： H05K3/321 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/09436 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

摘要翻译： 本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。 印刷电路板可以通过喷墨打印依次将含有导体的第一油墨和含绝缘体的第二油墨施加到基底基板上来制造，以形成印刷电路板，将元件安装在印刷电路板上，使得 元件的电极接触导电层并在高温下固化导电层。

公开(公告)号：US20110154661A1

公开(公告)日：2011-06-30

申请号：US12926923

申请日：2010-12-17

申请人： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

发明人： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

IPC分类号： H05K3/10

CPC分类号： H05K3/321 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/09436 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

摘要翻译： 本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。 印刷电路板可以通过喷墨打印依次施加含有导体的第一油墨和含绝缘体的第二油墨到基底基板上以形成印刷电路板，将元件安装在印刷电路板上，从而使印刷电路板 元件的电极接触导电层并在高温下固化导电层。